Patents by Inventor Cheng-Hung Huang

Cheng-Hung Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11969236
    Abstract: A wearable device for measuring blood pressure comprises a housing with through-holes formed thereon, a processing unit disposed in the housing, a display connected to the processing unit, a plurality of sensors connected to the processing unit, the sensors being configured to transmit at least one physiological signal to the processing unit via the through-holes, and a time delay structure connected between one of the through-holes and one of the sensors and configured to lengthen a path distance between the skin surface and the sensor, wherein the processing unit is configured to determine a systolic arterial pressure and a diastolic arterial pressure by the at least one physiological signal and a Moens-Korteweg (MK) function, and to control the display to display the systolic arterial pressure and the diastolic arterial pressure to be read by the user.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: April 30, 2024
    Assignee: Accurate Meditech Inc
    Inventors: Kuan Jen Wang, Cheng Yan Guo, Ching-Hung Huang
  • Patent number: 11959623
    Abstract: The present disclosure provides a connecting device and a lamp system. The connecting device is used to connect multiple lamps to form the lamp system. The connecting device includes a connecting element, a cover, and a shell. The cover is mounted on the connecting element and includes at least two first assembling members. The shell is detachably mounted on the cover. The shell includes a side wall, an opening, multiple gateways, and at least two second assembling members. The side wall surrounds a space. The opening and the gateways all are formed on a top of the side wall and communicate with the space. A portion of each of the lamps is received in one of the gateways. The second assembling members are disposed on the side wall and face each other in a radial line of the shell, and respectively engage with the first assembling members.
    Type: Grant
    Filed: April 27, 2023
    Date of Patent: April 16, 2024
    Assignee: Radiant Opto-Electronics Corporation
    Inventors: Chih-Hung Ju, Cheng-Ang Chang, Guo-Hao Huang, Chung-Kuang Chen
  • Patent number: 11949799
    Abstract: Disclosed is an input/output circuit for a physical unclonable function generator circuit. In one embodiment, a physical unclonable function (PUF) generator includes: a PUF cell array comprising a plurality of bit cells configured in a plurality of columns and at least one row, and at least one input/output (I/O) circuit each coupled to at least two neighboring columns of the PUF cell array, wherein the at least one I/O circuit each comprises a sense amplifier (SA) with no cross-coupled pair of transistors, wherein the SA comprises two cross-coupled inverters with no access transistor and a SA enable transistor, and wherein the at least one I/O circuit each is configured to access and determine logical states of at least two bit cells in the at least two neighboring columns; and based on the determined logical states of the plurality of bit cells, to generate a PUF signature.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jui-Che Tsai, Shih-Lien Linus Lu, Cheng Hung Lee, Chia-En Huang
  • Publication number: 20240096998
    Abstract: The present disclosure describes a method for forming metallization layers that include a ruthenium metal liner and a cobalt metal fill. The method includes depositing a first dielectric on a substrate having a gate structure and source/drain (S/D) structures, forming an opening in the first dielectric to expose the S/D structures, and depositing a ruthenium metal on bottom and sidewall surfaces of the opening. The method further includes depositing a cobalt metal on the ruthenium metal to fill the opening, reflowing the cobalt metal, and planarizing the cobalt and ruthenium metals to form S/D conductive structures with a top surface coplanar with a top surface of the first dielectric.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shuen-Shin LIANG, Chij-chien CHI, Yi-Ying LIU, Chia-Hung CHU, Hsu-Kai CHANG, Cheng-Wei CHANG, Chein-Shun LIAO, Keng-chu LIN, KAi-Ting HUANG
  • Patent number: 11935871
    Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming-Hung Tseng, Kris Lipu Chuang, Chung-Ming Weng, Tsung-Yuan Yu, Tzuan-Horng Liu
  • Publication number: 20240088204
    Abstract: Semiconductor structures and methods are provided. An exemplary method includes depositing a first conductive material layer over a substrate, patterning the first conductive material layer to form a first conductor plate over the substrate, forming a first high-K dielectric layer over the first conductor plate, forming a second high-K dielectric layer on the first high-K dielectric layer, forming a third high-K dielectric layer on the second high-K dielectric layer, and forming a second conductor plate over the third high-K dielectric layer and vertically overlapped with the first conductor plate, where a composition of the first high-K dielectric layer is the same as a composition of the third high-K dielectric layer and is different from a composition of the second high-K dielectric layer.
    Type: Application
    Filed: March 22, 2023
    Publication date: March 14, 2024
    Inventors: Li Chung Yu, Shin-Hung Tsai, Cheng-Hao Hou, Hsiang-Ku Shen, Chen-Chiu Huang, Dian-Hau Chen
  • Patent number: 11926389
    Abstract: A tilting vehicle includes a frame unit, a tilting mechanism and two front wheels. The frame unit includes a head tube extending generally along an up-down direction, and a main frame detachably connected to the head tube. The tilting mechanism includes one crossbar pivotally connected to the head tube and extending along a left-right direction, and two connecting rods extending along the up-down direction, being opposite to each other along the left-right direction, and being pivotally connected to opposite ends of the one crossbar, respectively, such that the connecting rods are movable along the up-down direction relative to the head tube. The front wheels are rotatably mounted to the connecting rods, respectively.
    Type: Grant
    Filed: July 18, 2022
    Date of Patent: March 12, 2024
    Assignee: Kwang Yang Motor Co., Ltd.
    Inventors: Cheng-Hung Huang, Feng-Chih Tsai
  • Publication number: 20240068652
    Abstract: The present disclosure provides a connecting device and a lamp system. The connecting device is used to connect multiple lamps to form the lamp system. The connecting device includes a connecting element, a cover, and a shell. The cover is mounted on the connecting element and includes at least two first assembling members. The shell is detachably mounted on the cover. The shell includes a side wall, an opening, multiple gateways, and at least two second assembling members. The side wall surrounds a space. The opening and the gateways all are formed on a top of the side wall and communicate with the space. A portion of each of the lamps is received in one of the gateways. The second assembling members are disposed on the side wall and face each other in a radial line of the shell, and respectively engage with the first assembling members.
    Type: Application
    Filed: April 27, 2023
    Publication date: February 29, 2024
    Inventors: Chih-Hung JU, Cheng-Ang CHANG, Guo-Hao HUANG, Chung-Kuang CHEN
  • Patent number: 11915954
    Abstract: A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.
    Type: Grant
    Filed: January 30, 2023
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hung Huang, Cheng-Lung Wu, Zheng-Lin He, Yang-Ann Chu, Jiun-Rong Pai, Hsuan Lee
  • Patent number: 11915957
    Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hung Huang, Cheng-Lung Wu, Yi-Fam Shiu, Yu-Chen Chen, Yang-Ann Chu, Jiun-Rong Pai
  • Publication number: 20230339560
    Abstract: A motorcycle windshield structure includes a windshield support frame set that supports a windshield and includes a vehicle body mounting frame seat unit, a sliding frame unit on the vehicle body mounting frame seat unit, and a power unit driving the sliding frame unit to slide. The vehicle body mounting frame seat unit includes a slide rail mounting frame having first and second guide roller sets. The sliding frame unit includes slide rails connected to the slide rail mounting frame and a sliding frame slidable along the slide rails. The power unit includes a power motor and first and second control cables respectively wound around the first and second guide roller sets. The power motor and the first and second control cables define, respectively, a raising stroke and a lowering stroke for the windshield, which are arranged, in a parallel manner, in a vehicle left-right direction.
    Type: Application
    Filed: March 24, 2023
    Publication date: October 26, 2023
    Inventors: FENG-CHIH TSAI, CHENG-HUNG HUANG, EN-TI YEH
  • Publication number: 20230025109
    Abstract: A tilting vehicle includes a frame unit, a tilting mechanism and two front wheels. The frame unit includes a head tube extending generally along an up-down direction, and a main frame detachably connected to the head tube. The tilting mechanism includes one crossbar pivotally connected to the head tube and extending along a left-right direction, and two connecting rods extending along the up-down direction, being opposite to each other along the left-right direction, and being pivotally connected to opposite ends of the one crossbar, respectively, such that the connecting rods are movable along the up-down direction relative to the head tube. The front wheels are rotatably mounted to the connecting rods, respectively.
    Type: Application
    Filed: July 18, 2022
    Publication date: January 26, 2023
    Applicant: KWANG YANG MOTOR CO., LTD.
    Inventors: Cheng-Hung HUANG, Feng-Chih TSAI
  • Patent number: 10910886
    Abstract: A heating system with wireless communication function includes a wireless information transmitting device, a wireless charging transmitting device and a wireless receiving heating device. The wireless information transmitting device includes an external shell, an information transmitting end coil and an information transmitting end magnetic shield. The wireless receiving heating device is disposed on a top surface of the wireless charging transmitting device. The wireless charging transmitting device includes a shell, a transmitting end coil and a transmitting end magnetic shield. The wireless charging transmitting device transmits energy to the wireless receiving heating device by near field induction and the object within the accommodating part of the wireless receiving heating device can be heated. The wireless receiving heating device notifies the wireless charge heating device to increase or decrease energy transmission in a digital communication manner.
    Type: Grant
    Filed: September 3, 2018
    Date of Patent: February 2, 2021
    Assignees: HITENX (WUXI) TECHNOLOGY CO., LTD., TENX (SHENZHEN) TECHNOLOGY LIMITED
    Inventor: Cheng-Hung Huang
  • Publication number: 20200076247
    Abstract: A heating system with wireless communication function includes a wireless information transmitting device, a wireless charging transmitting device and a wireless receiving heating device. The wireless information transmitting device includes an external shell, an information transmitting end coil and an information transmitting end magnetic shield. The wireless receiving heating device is disposed on a top surface of the wireless charging transmitting device. The wireless charging transmitting device includes a shell, a transmitting end coil and a transmitting end magnetic shield. The wireless charging transmitting device transmits energy to the wireless receiving heating device by near field induction and the object within the accommodating part of the wireless receiving heating device can be heated. The wireless receiving heating device notifies the wireless charge heating device to increase or decrease energy transmission in a digital communication manner.
    Type: Application
    Filed: September 3, 2018
    Publication date: March 5, 2020
    Inventor: CHENG-HUNG HUANG
  • Publication number: 20190187839
    Abstract: A modular wireless wall-mounted switch device includes a body having a plurality of switches and connecting ports, a control module including a microprocessor electrically connected with the switches and connecting ports of the body to correspond the witches to the respective connecting ports and a wireless signal transmitter electrically connected to the microprocessor, and a plurality of controllers each having stored therein an identification code corresponding to one respective electrical product and a control signal for controlling one respective electrical product. When the user triggers one switch, the microprocessor sends out the control signal and the respective identification code of the respective controller corresponding to the triggered switch through the wireless signal transmitter, causing the respective controller to control the operation of the respective electrical product.
    Type: Application
    Filed: February 22, 2019
    Publication date: June 20, 2019
    Inventor: Cheng-Hung HUANG
  • Patent number: 10287801
    Abstract: A door lock alarm includes a housing affixed to a door panel that carries a door lock and is hinged to a door frame, and a sensor including a circuit substrate mounted in the housing, a microprocessor installed in the circuit substrate, a sensor component electrically coupled to the microprocessor to face toward the door lock for detecting the presence of the latch bolt of the door lock in the locking position and providing a corresponding signal to the microprocessor so that the microprocessor activates alarm to give off an alarm signal upon receipt of the signal from the sensor component.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: May 14, 2019
    Assignee: PHILIO TECHNOLOGY CORPORATION
    Inventor: Cheng-Hung Huang
  • Patent number: D827462
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: September 4, 2018
    Assignee: PHILIO TECHNOLOGY CORPORATION
    Inventor: Cheng-Hung Huang
  • Patent number: D852868
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: July 2, 2019
    Assignee: PHILIO TECHNOLOGY CORPORATION
    Inventor: Cheng-Hung Huang
  • Patent number: D852869
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: July 2, 2019
    Assignee: PHILIO TECHNOLOGY CORPORATION
    Inventor: Cheng-Hung Huang
  • Patent number: D1021220
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: April 2, 2024
    Assignee: Radiant Opto-Electronics Corporation
    Inventors: Cheng-Ang Chang, Guo-Hao Huang, Chun-Yi Sun, Chih-Hung Ju, Pin-Tsung Wang