Abstract: A display panel including a pixel array substrate, an opposite substrate, and a display media is provided. The pixel array substrate includes a substrate, a plurality of scan lines, a plurality of data lines, a plurality of pixel units, and a gate driving circuit. The gate driving circuit including a plurality of first signal lines, a plurality of second signal lines, a plurality of dummy signal lines, and a plurality of contact structures is disposed in a peripheral region of the substrate. Each of the second signal lines is electrically connected to one corresponding first signal line. Each of the dummy signal lines is electrically connected to one corresponding second signal line via one corresponding contact structure. Each of the first signal lines is electrically connected to the corresponding second signal line via one corresponding contact structure.

Abstract: A display panel including a pixel array substrate, an opposite substrate, and a display media is provided. The pixel array substrate includes a substrate, a plurality of scan lines, a plurality of data lines, a plurality of pixel units, and a gate driving circuit. The gate driving circuit including a plurality of first signal lines, a plurality of second signal lines, a plurality of dummy signal lines, and a plurality of contact structures is disposed in a peripheral region of the substrate. Each of the second signal lines is electrically connected to one corresponding first signal line. Each of the dummy signal lines is electrically connected to one corresponding second signal line via one corresponding contact structure. Each of the first signal lines is electrically connected to the corresponding second signal line via one corresponding contact structure.

Abstract: A semiconductor device package includes a metal carrier, a passive device, a conductive adhesive material, a dielectric layer and a conductive via. The metal carrier has a first conductive pad and a second conductive pad spaced apart from the first conductive pad. The first conductive pad and the second conductive pad define a space therebetween. The passive device is disposed on top surfaces of first conductive pad and the second conductive pad. The conductive adhesive material electrically connects a first conductive contact and a second conductive contact of the passive device to the first conductive pad and the second conductive pad respectively. The dielectric layer covers the metal carrier and the passive device and exposes a bottom surface of the first conductive pad and the second conductive pad. The conductive via extends within the dielectric layer and is electrically connected to the first conductive pad and/or the second conductive pad.

Abstract: A display panel including a pixel array substrate, an opposite substrate, and a display media is provided. The pixel array substrate includes a substrate, a plurality of scan lines, a plurality of data lines, a plurality of pixel units, and a gate driving circuit. The gate driving circuit including a plurality of first signal lines, a plurality of second signal lines, a plurality of dummy signal lines, and a plurality of contact structures is disposed in a peripheral region of the substrate. Each of the second signal lines is electrically connected to one corresponding first signal line. Each of the dummy signal lines is electrically connected to one corresponding second signal line via one corresponding contact structure. Each of the first signal lines is electrically connected to the corresponding second signal line via one corresponding contact structure.

Abstract: A semiconductor device package includes a metal carrier, a passive device, a conductive adhesive material, a dielectric layer and a conductive via. The metal carrier has a first conductive pad and a second conductive pad spaced apart from the first conductive pad. The first conductive pad and the second conductive pad define a space therebetween. The passive device is disposed on top surfaces of first conductive pad and the second conductive pad. The conductive adhesive material electrically connects a first conductive contact and a second conductive contact of the passive device to the first conductive pad and the second conductive pad respectively. The dielectric layer covers the metal carrier and the passive device and exposes a bottom surface of the first conductive pad and the second conductive pad. The conductive via extends within the dielectric layer and is electrically connected to the first conductive pad and/or the second conductive pad.

Abstract: A semiconductor device package includes a metal carrier, a passive device, a conductive adhesive material, a dielectric layer and a conductive via. The metal carrier has a first conductive pad and a second conductive pad spaced apart from the first conductive pad. The first conductive pad and the second conductive pad define a space therebetween. The passive device is disposed on top surfaces of first conductive pad and the second conductive pad. The conductive adhesive material electrically connects a first conductive contact and a second conductive contact of the passive device to the first conductive pad and the second conductive pad respectively. The dielectric layer covers the metal carrier and the passive device and exposes a bottom surface of the first conductive pad and the second conductive pad. The conductive via extends within the dielectric layer and is electrically connected to the first conductive pad and/or the second conductive pad.

Abstract: A driving circuit including an output circuit, a pull-down module, conductive wires, at least one first signal line, and a buffer layer is provided. The conductive wires are electrically connected between the output circuit and the pull-down module. The output circuit and the pull-down module are electrically coupled to a driving control signal through the first signal line. A first overlapping region is located between the first signal line and a portion of the conductive wires. The buffer layer is disposed between the first signal line and the portion of the conductive wires. The buffer layer includes an overlapping portion and an extending portion. The overlapping portion is at least disposed in the first overlapping region. The extending portion is disposed outside the overlapping portion. A thickness of the overlapping portion is greater than a thickness of the extending portion. A display panel is also provided.

Abstract: A display panel including a pixel array substrate, an opposite substrate, and a display media is provided. The pixel array substrate includes a substrate, a plurality of scan lines, a plurality of data lines, a plurality of pixel units, and a gate driving circuit. The gate driving circuit including a plurality of first signal lines, a plurality of second signal lines, a plurality of dummy signal lines, and a plurality of contact structures is disposed in a peripheral region of the substrate. Each of the second signal lines is electrically connected to one corresponding first signal line. Each of the dummy signal lines is electrically connected to one corresponding second signal line via one corresponding contact structure. Each of the first signal lines is electrically connected to the corresponding second signal line via one corresponding contact structure.

Abstract: A semiconductor device package includes a metal carrier, a passive device, a conductive adhesive material, a dielectric layer and a conductive via. The metal carrier has a first conductive pad and a second conductive pad spaced apart from the first conductive pad. The first conductive pad and the second conductive pad define a space therebetween. The passive device is disposed on top surfaces of first conductive pad and the second conductive pad. The conductive adhesive material electrically connects a first conductive contact and a second conductive contact of the passive device to the first conductive pad and the second conductive pad respectively. The dielectric layer covers the metal carrier and the passive device and exposes a bottom surface of the first conductive pad and the second conductive pad. The conductive via extends within the dielectric layer and is electrically connected to the first conductive pad and/or the second conductive pad.

Abstract: A driving circuit including an output circuit, a pull-down module, conductive wires, at least one first signal line, and a buffer layer is provided. The conductive wires are electrically connected between the output circuit and the pull-down module. The output circuit and the pull-down module are electrically coupled to a driving control signal through the first signal line. A first overlapping region is located between the first signal line and a portion of the conductive wires. The buffer layer is disposed between the first signal line and the portion of the conductive wires. The buffer layer includes an overlapping portion and an extending portion. The overlapping portion is at least disposed in the first overlapping region. The extending portion is disposed outside the overlapping portion. A thickness of the overlapping portion is greater than a thickness of the extending portion. A display panel is also provided.

Abstract: The invention provides method and associated processor for adaptive linkify of a text. The method may include: by a processor, modifying a current search criterion according to an adaptable factor, searching for match of the modified search criterion in the text, and enabling found match of the modified search criterion to be clickable. The adaptable factor may reflect at least one of the following: a locale setting of the device, a location of the device, manual setting, reachability, linguistic analysis result and system learning result.

Abstract: A dual-band antenna including a ground element, a short-circuit element, a feed element and a radiator is provided. The radiator includes a first connection segment, a first radiation element, a second radiation element, a third radiation element and a fourth radiation element. The dual-band antenna covers a first frequency band a second frequency band through the symmetrical first radiation element and second radiation element and the symmetrical third radiation element and fourth radiation element, so as to effectively decrease an antenna volume, and satisfy the requirement of a signal coverage range of a communication device.

Abstract: An antenna structure includes a feed unit, a grounding unit, a connecting unit, a radiating unit, and a resonating unit. The grounding unit is spaced apart from the feed unit. The connecting unit resists and is electrically connected to the feed unit and the grounding unit. The radiating unit is electrically connected to one side of the connecting unit so as to activate a first resonance mode. The resonating unit is electrically connected to another side of the connecting unit so as to activate a second resonance mode.

Abstract: An antenna structure includes a feed unit, a grounding unit, a first radiating unit, a second radiating unit, third radiating unit, fourth radiating unit, and a fifth radiating unit. The grounding unit is spaced apart from the feed unit. The first radiating unit is electrically connected to the feed unit. The second radiating unit is electrically connected to the grounding unit. The third radiating unit is electrically connected to the first radiating unit, the second radiating unit, and the fourth radiating unit. The fifth radiating unit is electrically connected to the feed unit and couples with the fourth radiating unit.

Abstract: A dual-band antenna including a ground element, a short-circuit element, a feed element and a radiator is provided. The radiator includes a first connection segment, a first radiation element, a second radiation element, a third radiation element and a fourth radiation element. The dual-band antenna covers a first frequency band a second frequency band through the symmetrical first radiation element and second radiation element and the symmetrical third radiation element and fourth radiation element, so as to effectively decrease an antenna volume, and satisfy the requirement of a signal coverage range of a communication device.

Abstract: An antenna structure includes a main portion, a first radiating portion connected to the main portion, a second radiating portion connected to the main portion and opposite to the first radiating portion, and a coupling portion spaced from and coplanar with the main portion and opposite to the second radiating portion. The main portion and the first radiating portion excite a low frequency mode, the main portion, the first radiating portion, the second radiating portion, and the coupling portion excite a high frequency mode, and when the antenna structure is interfered by a user's human body when close to the user's human body, the coupling portion transmits the interference to ground. A wireless communication device employing the antenna structure is also disclosed.

Abstract: An antenna structure includes a feed unit, a grounding unit, a first radiating unit, a second radiating unit, third radiating unit, fourth radiating unit, and a fifth radiating unit. The grounding unit is spaced apart from the feed unit. The first radiating unit is electrically connected to the feed unit. The second radiating unit is electrically connected to the grounding unit. The third radiating unit is electrically connected to the first radiating unit, the second radiating unit, and the fourth radiating unit. The fifth radiating unit is electrically connected to the feed unit and couples with the fourth radiating unit.

Abstract: An antenna structure includes a feed unit, a grounding unit, a connecting unit, a radiating unit, and a resonating unit. The grounding unit is spaced apart from the feed unit. The connecting unit resists and is electrically connected to the feed unit and the grounding unit. The radiating unit is electrically connected to one side of the connecting unit so as to activate a first resonance mode. The resonating unit is electrically connected to another side of the connecting unit so as to activate a second resonance mode.

Abstract: An antenna structure includes an antenna holder, a first metallic portion, a second metallic portion, and a radiator. The antenna holder includes a top wall, a first sidewall, and a second sidewall. The first sidewall and the second sidewall are both substantially perpendicularly connected to a periphery of the top wall. The radiator is positioned at least on the top wall, the first sidewall, and the second sidewall. The first metallic portion is substantially parallel to the first sidewall. The second metallic portion is substantially parallel to the second sidewall. The first metallic portion and the second metallic portion are both configured for being coupled to the radiator.

Abstract: An antenna assembly includes a carrier, a metal sheet, and an antenna. The metal sheet is attached to the carrier and defining at least one notch. The antenna is connected to the metal sheet and includes a radio body for receiving and transmitting wireless signals. The radio body is positioned above the metal sheet. The length of current path in a peripheral wall of the at least one notch is in a predetermined proportion to the wavelength of the wireless signals, enabling the metal sheet to resonate with the radio body to increase the bandwidth of the antenna.