Patents by Inventor Cheng-Hung Lin
Cheng-Hung Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250111821Abstract: A display apparatus is provided. The display apparatus includes a display module and multiple light-emitting driving circuits. Each of the light-emitting driving circuits includes a timing control circuit and a driving circuit. The timing control circuit receives multiple clock signals and a previous light-emitting timing signal to provide a light-emitting timing signal and an internal voltage. The driving circuit receives a first phase signal among multiple phase signals and the internal voltage to provide a light-emitting driving signal to the display module based on the first phase signal and the internal voltage. The phase signals all present disabled levels during a vertical blank period.Type: ApplicationFiled: July 16, 2024Publication date: April 3, 2025Applicant: AUO CorporationInventors: Che-Chia Chang, Che-Wei Tung, En-Chih Liu, Yu-Chieh Kuo, Mei-Yi Li, Ming-Hung Chuang, Yu-Hsun Chiu, Chen-Chi Lin, Cheng-Hsing Lin, Shu-Wen Tzeng, Jui-Chi Lo, Ming-Yang Deng
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Publication number: 20250096185Abstract: A semiconductor structure can include a first substrate having a frontside and a backside opposite the frontside. The semiconductor structure can include devices on the frontside. The semiconductor structure can include first interconnect structures on the frontside and coupled to the devices. The semiconductor structure can include a heat distribution layer on the frontside and electrically isolated from the first interconnect structures, where the heat distribution layer includes a thermally conductive material. The semiconductor structure can include a second substrate coupled to the first substrate on the frontside. The semiconductor structure can include second interconnect structures on the backside and coupled to the devices.Type: ApplicationFiled: September 18, 2023Publication date: March 20, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Po-Yu Chen, Cheng Hung Wu, Hui-Ling Lin, Yu Hsiang Chen
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Publication number: 20250093593Abstract: Optical devices and methods of manufacture are presented in which a mirror structure is utilized to transmit and receive optical signals to and from an optical device. In embodiments the mirror structure receives optical signals from outside of an optical device and directs the optical signals through at least one mirror to an optical component of the optical device.Type: ApplicationFiled: January 3, 2024Publication date: March 20, 2025Inventors: Wen-Chih Lin, Cheng-Yu Kuo, Yen-Hung Chen, Hsuan-Ting Kuo, Chia-Shen Cheng, Chao-Wei Li, Ching-Hua Hsieh, Wen-Chih Chiou, Ming-Fa Chen, Shang-Yun Hou
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Patent number: 12249770Abstract: In one example in accordance with the present disclosure, an example computing device is disclosed. The example computing device includes a housing. The example computing device also includes a rotatable antenna disposed within the housing. The rotatable antenna is to rotate such that a direction of radiation is maintained in a single direction as the housing is to rotate.Type: GrantFiled: October 15, 2020Date of Patent: March 11, 2025Assignee: Hewlett-Packard Development Company, L.P.Inventors: Chun-Chih Liu, Cheng-Ming Lin, Ren-Hao Chen, Chia Hung Kuo
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Patent number: 12242321Abstract: The disclosure provides a power management method. The power management method is applicable to an electronic device. The electronic device is electrically coupled to an adapter, and includes a system and a battery. The adapter has a feed power. The battery has a discharge power. The power management method of the disclosure includes: reading a power value of the battery; determining a state of the system; and discharging power to the system, when the system is in a power-on state and the power value is greater than a charging stopping value, by using the battery, and controlling, according to the discharge power and the feed power, the adapter to selectively supply power to the system. The disclosure further provides an electronic device using the power management method.Type: GrantFiled: April 27, 2023Date of Patent: March 4, 2025Assignee: ASUSTEK COMPUTER INC.Inventors: Wen Che Chung, Hui Chuan Lo, Hao-Hsuan Lin, Chun Tsao, Jun-Fu Chen, Ming-Hung Yao, Jia-Wei Zhang, Kuan-Lun Chen, Ting-Chao Lin, Cheng-Yen Lin, Chunyen Lai
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Patent number: 12245519Abstract: A semiconductor memory device includes a substrate having a conductor region thereon, an interlayer dielectric layer on the substrate, and a conductive via electrically connected to the conductor region. The conductive via has a lower portion embedded in the interlayer dielectric layer and an upper portion protruding from a top surface of the interlayer dielectric layer. The upper portion has a rounded top surface. A storage structure conformally covers the rounded top surface.Type: GrantFiled: December 18, 2023Date of Patent: March 4, 2025Assignee: UNITED MICROELECTRONICS CORP.Inventors: Chia-Chang Hsu, Tang-Chun Weng, Cheng-Yi Lin, Yung-Shen Chen, Chia-Hung Lin
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Publication number: 20250063758Abstract: A titanium precursor is used to selectively form a titanium silicide (TiSix) layer in a semiconductor device. A plasma-based deposition operation is performed in which the titanium precursor is provided into an opening, and a reactant gas and a plasma are used to cause silicon to diffuse to a top surface of a transistor structure. The diffusion of silicon results in the formation of a silicon-rich surface of the transistor structure, which increases the selectivity of the titanium silicide formation relative to other materials of the semiconductor device. The titanium precursor reacts with the silicon-rich surface to form the titanium silicide layer. The selective titanium silicide layer formation results in the formation of a titanium silicon nitride (TiSixNy) on the sidewalls in the opening, which enables a conductive structure such as a metal source/drain contact to be formed in the opening without the addition of another barrier layer.Type: ApplicationFiled: November 5, 2024Publication date: February 20, 2025Inventors: Cheng-Wei CHANG, Chia-Hung CHU, Hsu-Kai CHANG, Sung-Li WANG, Kuan-Kan HU, Shuen-Shin LIANG, Kao-Feng LIN, Hung Pin LU, Yi-Ying LIU, Chuan-Hui SHEN
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Patent number: 12230740Abstract: A light-emitting device includes a semiconductor stack including a first semiconductor layer, a second semiconductor layer and an active area between the first semiconductor layer and the second semiconductor layer, wherein the first semiconductor layer including an upper surface; an exposed region formed in the semiconductor stack to expose the upper surface; a first protective layer covering the exposed region and a portion of the second semiconductor layer, wherein the first protective layer includes a first part with a first thickness formed on the upper surface and a second part with a second thickness formed on the second semiconductor layer, the first thickness is smaller than the second thickness; a first reflective structure formed on the second semiconductor layer and including one or multiple openings; and a second reflective structure formed on the first reflective structure and electrically connected to the second semiconductor layer through the one or multiple openings.Type: GrantFiled: April 22, 2021Date of Patent: February 18, 2025Assignee: EPISTAR CORPORATIONInventors: Jhih-Yong Yang, Hsin-Ying Wang, De-Shan Kuo, Chao-Hsing Chen, Yi-Hung Lin, Meng-Hsiang Hong, Kuo-Ching Hung, Cheng-Lin Lu
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Patent number: 12230558Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes an electronic device, a conductive pad having a first bottom surface, and a redistribution layer disposed between the conductive pad and the electronic device. The redistribution layer has a second bottom surface, and the conductive pad is electrically connected to the electronic device through the redistribution layer. The first bottom surface is closer to the electronic device than the second bottom in a normal direction of the electronic device.Type: GrantFiled: October 5, 2022Date of Patent: February 18, 2025Assignee: InnoLux CorporationInventors: Hsueh-Hsuan Chou, Chia-Chieh Fan, Kuan-Jen Wang, Cheng-Chi Wang, Yi-Hung Lin, Li-Wei Sung
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Publication number: 20250054750Abstract: The present disclosure provides a method of manufacturing a semiconductor device. The method includes: forming a first semiconductor layer on an inner surface of a trench of a substrate; forming a second semiconductor layer on the first semiconductor layer on the inner surface of the trench of the substrate; forming another first semiconductor layer on the second semiconductor layer on the inner surface of the trench of the substrate; forming another second semiconductor layer on the another first semiconductor layer on the inner surface of the trench of the substrate, in which the second semiconductor layer is sandwiched between the first semiconductor layer and the another first semiconductor layer, and the another first semiconductor layer is sandwiched between the second semiconductor layer and the another second semiconductor layer; and forming a third semiconductor layer on the another second semiconductor layer.Type: ApplicationFiled: October 27, 2024Publication date: February 13, 2025Inventors: Kai Hung LIN, Cheng Yan JI
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Patent number: 12224734Abstract: A surface acoustic wave device includes a piezoelectric substrate, a supportive layer, a cover layer and a pillar bump. The supportive layer is disposed on the piezoelectric substrate and around a transducer, the cover layer covers the supportive layer, and the pillar bump is located in a lower via hole of the supportive layer and an upper via hole of the cover layer. The upper via hole has a lateral opening located on a lateral surface of the cover layer, and the pillar bump in the cover layer protrudes from the lateral surface of the cover layer via the lateral opening.Type: GrantFiled: July 1, 2022Date of Patent: February 11, 2025Assignee: CHIPBOND TECHNOLOGY CORPORATIONInventors: Cheng-Hung Shih, Cheng-Fan Lin
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Patent number: 12224226Abstract: An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.Type: GrantFiled: August 29, 2022Date of Patent: February 11, 2025Assignee: InnoLux CorporationInventors: Chin-Lung Ting, Chung-Kuang Wei, Cheng-Chi Wang, Yeong-E Chen, Yi-Hung Lin
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Patent number: 12212599Abstract: The present invention discloses a hacking detection method, including: deploying a plurality of trap IP addresses in a trap IP address list; collecting access logs from a plurality of network devices to create a connection record list, wherein the connection record list includes a plurality of connection records; and comparing the trap IP address list and the connection record list to obtain a suspicious source list. The suspicious source list includes a plurality of suspicious source IP addresses. The suspicious source IP addresses match a portion of the trap IP addresses in the trap IP address list.Type: GrantFiled: May 14, 2021Date of Patent: January 28, 2025Assignee: QUANTA COMPUTER INC.Inventors: Chen-Chung Lee, Chia-Hung Lin, Cheng-Yao Wang, Li-Pin Tseng
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Publication number: 20250029910Abstract: An electronic component includes a first electronic unit including a plurality of pads, a first conductive layer, a second conductive layer, a first insulating layer having a first thickness, a second insulating layer having a second thickness, a second electronic unit, and a solder ball. The first conductive layer is disposed between the first electronic unit and the second conductive layer, and electrically connected to at least one of the pads through a conductive via. The first insulating layer is disposed between the first conductive layer and the second conductive layer. The second conductive layer is disposed between the first insulating layer and the second insulating layer. The first thickness is different from the second thickness. The second conductive layer is disposed between the first conductive layer and the second electronic unit. The second conductive layer is electrically connected to the second electronic unit through the solder ball.Type: ApplicationFiled: October 8, 2024Publication date: January 23, 2025Applicant: Innolux CorporationInventors: Yeong-E Chen, Yi-Hung Lin, Cheng-En Cheng, Wen-Hsiang Liao, Cheng-Chi Wang
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Patent number: 12203646Abstract: A wrist-wearable electronic device comprising a house, a display, and a lens module. The lens module is coupled to a sidewall of the housing and can include a first light emitting element, a lens, and a first Frensel structure. The lens includes a body, a lower surface, and an upper surface. The first Frensel structure is disposed on the lower surface of the lens and is configured to disperse light generated by the first light emitting element into the body of the lens.Type: GrantFiled: May 28, 2024Date of Patent: January 21, 2025Assignee: Garmin International, Inc.Inventors: Cheng-Yu Tsai, Minhung Lee, Yu-Hung Lin, Yung-Lang Yang
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Patent number: 12205854Abstract: The present disclosure provides an electronic device including a redistribution layer, a plurality of passive components, and an electronic component. The redistribution layer includes a first insulating layer, a second insulating layer, and a plurality of traces electrically connected to each other through a first opening of the first insulating layer and a second opening of the second insulating layer, wherein the first insulating layer has a first side away from the second insulating layer, and the second insulating layer has a second side away from the first insulating layer. The passive components are disposed on the first side. The electronic component is disposed on the second side. The plurality of passive components are electrically connected to the electronic component through the plurality of traces.Type: GrantFiled: September 19, 2023Date of Patent: January 21, 2025Assignee: InnoLux CorporationInventors: Yeong-E Chen, Kuang-Chiang Huang, Yu-Ting Liu, Yi-Hung Lin, Cheng-En Cheng
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Publication number: 20240355278Abstract: A pixel element includes an emissive pixel element; and a driving circuit, coupled to the emissive pixel element, comprising: a memory circuit; a current source circuit; and a modulation circuit, coupled to the memory circuit, the current source circuit and the emissive pixel element, configured to control the current source circuit to inject a modulation current into the emissive pixel element according to modulation signals received from the memory circuit.Type: ApplicationFiled: January 11, 2024Publication date: October 24, 2024Applicant: VisionChip Technology Ltd.Inventor: Cheng-Hung Lin
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Patent number: 12113299Abstract: A signal radiation device and an antenna structure are provided. The signal radiation device includes a first signal radiator, a second signal radiator, and a reflective signal radiator. The first signal radiator is configured to perform a transceiving operation on a first signal along a first direction. The second signal radiator is disposed by overlapping with the first signal radiator, and is configured to perform the transceiving operation on at least one second signal along a second direction and/or a third direction. The first direction, the second direction, and the third direction are different. The reflective signal radiator is disposed between the first signal radiator and the second signal radiator, and is configured to perform the transceiving operation on a third signal omnidirectionally. A frequency band of the third signal is lower than a frequency band of the first signal and a frequency band of the second signal.Type: GrantFiled: March 17, 2022Date of Patent: October 8, 2024Assignee: HTC CorporationInventors: Chia-Te Chien, Cheng-Hung Lin
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Publication number: 20240314976Abstract: A fluid immersion cooling system includes a fluid tank that contains a layer of a dual-phase coolant fluid and one or more layers of single-phase coolant fluids. The dual-phase and single-phase coolant fluids are immiscible, with the dual-phase coolant fluid having a lower boiling point and higher density than a single-phase coolant fluid. A substrate of an electronic system is submerged in the tank such that high heat-generating components are immersed at least in the layer of the dual-phase coolant fluid. Heat from the components is dissipated to the dual-phase coolant fluid to generate vapor bubbles of the dual-phase coolant fluid. The vapor bubbles rise to a layer of a single-phase coolant fluid that is above the layer of the dual-phase coolant fluid. The vapor bubbles condense to droplets of the dual-phase coolant fluid. The droplets fall down into the layer of the dual-phase coolant fluid.Type: ApplicationFiled: May 22, 2024Publication date: September 19, 2024Inventors: Yueh Ming LIU, Yu Hsiang HUANG, Yu Chuan CHANG, Tan Hsin CHANG, Hsiao Chung CHEN, Chia-Wei CHEN, Chih-Ta CHEN, Cheng-Hung LIN, Ming-Te HSU
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Patent number: 12068545Abstract: An antenna structure includes a first signal source, a second signal source, a first radiator, a second radiator, a third radiator, a first circuit, and a second circuit. The first signal source is used to generate a first wireless signal, and the second signal source is used to generate a second wireless signal. The first radiator is coupled to the first signal source to receive the first wireless signal, and the second radiator is coupled to the second signal source to receive the second wireless signal. The first circuit has a first end coupled to the third radiator and a second end coupled to the first radiator or the first signal source. The second circuit has a first end coupled to the third radiator and a second end coupled to the second radiator or the second signal source.Type: GrantFiled: August 18, 2023Date of Patent: August 20, 2024Assignee: HTC CorporationInventors: Cheng-Hung Lin, Szu-Po Wang, Chia-Te Chien, Chun-Chieh Wang, Kang-Ling Li, Chun-Hsien Lee, Yu-Chieh Chiu