Abstract: A white organic light-emitting diode includes two symmetric emission layers and a middle emission layer. The two symmetric emission layers emit a first color light with approximately the same frequency components. The middle emission layer is located between the two symmetric emission layers. The middle emission layer emits a second color light with frequency components different from main frequency components of the first color light. When the voltage applied to the organic light-emitting diode changes and leads to a decrease of luminescent intensity of one of the symmetric emission layers, the other symmetric emission layer automatically increases the luminescent intensity to compensate for the reduced light intensity.

Abstract: A phosphorescent OLED uses a phosphorescent dopant in the emissive layer, the dopant includes a metal complex containing a plurality of moieties linking to a transition metal ion. One or more of the moieties contain a ligand with a C—SP3 carbon center. The transition metal ion can be an iridium ion. The C—SP3 carbon is linked to a chalcogen atom in an ion form, a nitrogen-containing heterocylic ring and two functional groups, wherein each of the functional groups is selected from aryl, alkyl and heteroaryl. The tetrahedral structure of this carbon center hinders close packing and intermolecular interactions and, therefore, renders the transport of holes in the light-emitting device more efficient. With such chemical structure and property, the self-quenching characteristics of the dopant in high doping concentration can be effectively reduced.

Abstract: An organic electroluminescent device (OELD) is provided. The OELD includes a substrate, an anode, a cathode, a hole transport layer, an electron transport layer and an emission layer. The anode and the cathode are disposed on the substrate. The hole transport layer is disposed between the anode and the cathode. The electron transport layer is disposed between the hole transport layer and the cathode. The emission layer is disposed between the hole transport layer and the electron transport layer. The emission layer includes a host and a dopant. The chemical structure of the dopant is shown as the formula [I]: “M” is a metal atom whose atomic weight is greater than 40. “S” is selected from a group consisting of alkyl, alkoxy, haloalkyl, halogen, hydrogen and any other substituents.

Abstract: Organometallic compounds and display devices employing the same. Organometallic compounds can serve as host materials for an organic electroluminescent device. Furthermore, the organometallic compounds can also serve as green phosphorescent dopant material for display devices, by a way of the specific chemical structure.

Abstract: An organometallic complex having formula (I) wherein M is a transition metal; each A1 and A2 is independently a monodentate ligand, or A1 and A2 are covalently joined together to form a bidentate ligand; R1 is H, C1-18 alkyl, C1-18 alkoxy, C3-18 heteroalkyl, C3-20 aryl, C3-20 heteroaryl, or C3-20 cycloalkyl; R2 is the same or different and is H, C1-18 alkyl, C1-18 alkoxy, C3-18 heteroalkyl, C3-20 aryl, C3-20 heteroaryl, or C3-20 cycloalkyl, or two R2 groups link together with the carbon atoms to which they are attached to form a 4- to 12-member aromatic or heteroaromatic ring; R3 is the same or different and is H, CN, tricyanovinyl, halogen, CX3, C1-18 alkyl, C1-18 alkoxy, C3-18 heteroalkyl, C3-20 aryl, C3-20 heteroaryl, or C3-20 cycloalkyl, wherein X is halogen; m is the charge of M; n is 1, 2, or 3.

Abstract: A package socket system includes a positioning frame positioned on a circuit board. The positioning frame has an interior space defined between four side walls for receiving and accommodating a BGA socket that retains an array of contacts therein. The contacts have a lower ball end in contact engagement with and supported on conductive pads of the circuit board. A BGA package having an array of solder balls is received in the positioning frame and supported on the socket with the solder balls received in flared upper ends of the contacts of the socket. A heat sink has a flat base supported on the positioning frame and secured to the substrate to establish a firm contact engagement with the package thereby securely maintaining the package and the socket in position on the substrate. The positioning frame has a chamfered section and the socket and the package each have a corresponding chamfered corner for positioning purposes.

Abstract: A board adapter for electrically connecting an electrical card connector to a mother board, comprises 68 signal holes, 100 conductive pads, a plurality of signal traces, a first grounding means, a transforming unit and a second grounding contact. The first grounding contact surrounds the signal holes and is electrically connected with a corresponding grounding contact of the electrical connector, for providing the signal holes and the electrical connector with grounding protection. The second grounding contact is alternately juxtaposed with every two of the signal traces for providing grounding protection. The conductive pads are electrically connected with either the signal traces or the grounding contacts. The transforming unit includes two power traces to separately bear two different strength voltage induced currents. When either of the traces bears a corresponding voltage induced current, the other trace can be transformed into a grounding trace to protect the bearing trace.

Abstract: A socket connector (10) includes an housing (12) including a pair of side walls (14) and a pair of end walls (16) commonly defining a cavity (18) for receiving a chip carrier therein. A plurality of passageways (20) are disposed in two side walls (14) of the housing (12) for receiving a corresponding number of contacts (22) therein. A bottom surface (36) is provided with the housing (12) for supportably receiving the chip carrier in the cavity. A plurality of openings (38) are provided in the bottom surface (36) along two opposite sides thereof wherein each opening (38) corresponds to every two adjacent passageways (20). A dividing bar (40) of the bottom surface (36) is provided between every two adjacent openings (38).