Abstract: Aspects of the disclosure provide an evolutionary neural architecture search (ENAS) method. For example, the ENAS method can include steps (a) performing one or more evolutionary operations on an initial population of neural architectures to generate offspring neural architectures, (b) evaluating performance of each of the offspring neural architectures to obtain at least one evaluation value of the offspring neural architecture with respect to a performance metric, (c) adjusting the evaluation values of the offspring neural architectures based on at least one constraint on the evaluation values, (d) selecting at least one of the offspring neural architectures as a new population of neural architectures, and (e) outputting the new population of neural architectures as a last population of neural architectures when a stopping criterion is achieved, or (f) iterating steps (a) to (d) with the new population of neural architectures being taken as the initial population of neural architectures.

Abstract: The present disclosure describes a method for forming metallization layers that include a ruthenium metal liner and a cobalt metal fill. The method includes depositing a first dielectric on a substrate having a gate structure and source/drain (S/D) structures, forming an opening in the first dielectric to expose the S/D structures, and depositing a ruthenium metal on bottom and sidewall surfaces of the opening. The method further includes depositing a cobalt metal on the ruthenium metal to fill the opening, reflowing the cobalt metal, and planarizing the cobalt and ruthenium metals to form S/D conductive structures with a top surface coplanar with a top surface of the first dielectric.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: A method for controlling a fan in a fan start-up stage including a first time period and a second time period comprises the following steps of: during the first time period, continuously providing a first driving signal to drive the fan; and during the second time period, continuously providing a second driving signal to drive the fan; wherein, the signal value of the first driving signal gradually decreases until being equal to the signal value of the second driving signal. Wherein the signal value of the first driving signal non-linearly decreases, the signal value of the second driving signal is an unchanged value. Wherein, the first time period and the second time period are adjusted for a different fan but the sum of the first time period and the second time period is always the same. A fan is also disclosed.

Abstract: One video encoding method includes: performing a first part of a video encoding operation by a software engine with instructions, wherein the first part of the video encoding operation comprises at least a motion estimation function; delivering a motion estimation result generated by the motion estimation function to a hardware engine; and performing a second part of the video encoding operation by the hardware engine. Another video encoding method includes: performing a first part of a video encoding operation by a software engine with instructions and a cache buffer; performing a second part of the video encoding operation by a hardware engine; performing data transfer between the software engine and the hardware engine through the cache buffer; and performing address synchronization to ensure that a same entry of the cache buffer is correctly addressed and accessed by both of the software engine and the hardware engine.

Abstract: Systems for displaying images are provided. An embodiment of a system comprises a liquid crystal display module, and the liquid crystal display module comprises a backlight assembly. The backlight module primarily includes a circuit board and at least an LED disposed on a first planar side of the circuit board. The circuit board comprises at least a hole and a heat conductor extending through the hole. Heat from the LED on the first planar side is dissipated to a second planar side of the circuit board by the heat conductor through the hole.

Abstract: Systems for displaying images are provided. An embodiment of a system comprises a liquid crystal display module, and the liquid crystal display module comprises a backlight assembly. The backlight module primarily includes a circuit board and at least an LED disposed on a first planar side of the circuit board. The circuit board comprises at least a hole and a heat conductor extending through the hole. Heat from the LED on the first planar side is dissipated to a second planar side of the circuit board by the heat conductor through the hole.