Abstract: A laser color marking method for a semiconductor package has steps of: (a) providing a semiconductor element; (b) sputtering a metal layer on the semiconductor element; (c) obtaining a marking pattern; and (d) applying a laser light source on the marking region to form a mark according to the marking pattern. The mark is consisted of an optical oxide film converting ambient light to a corresponding color light, so a visible color mark is marked. Therefore, the present invention easily laser-marks the visible color mark on the semiconductor package.

Abstract: A method for laser marking includes steps of forming a test matter on a substrate; using a laser to form a laser path on the test matter; determining whether at least one of a first condition and a second condition occurs, wherein the first condition is a color of an abnormal area on the laser path is different from a color of the laser path and the second condition is a width of the abnormal area is larger than a width of the laser path; and when the at least one of the first condition and the second condition occurs, adjusting at least one laser parameter of the laser to prevent the at least one of the first condition and the second condition from occurring.