Abstract: A switching regulator includes a boost power stage circuit and a control circuit. The boost power stage circuit includes: at least one power switch configured to switch a terminal of an inductor according to an operation signal during a normal operation period, such that the terminal of the inductor is switched between an output voltage and ground level; and a power line switch connected in series to the inductor between the input voltage and the output voltage. The power line switch is turned OFF when the output voltage is short to ground level, to prevent a short current from flowing from input voltage to ground level. The control circuit generates the operation signal according to the output voltage and determines whether the power line switch is P-type or N-type MOS device, so as to turn OFF the power line switch when the output voltage is short to ground level.

Abstract: System boot-up can be enabled in low temperature environments. A laptop or other battery-powered computing device can include multiple batteries and a battery architecture that allows the multiple batteries to simultaneously discharge to thereby provide adequate power to boot the system in low temperature environments. The battery architecture may also allow a battery with a higher relative state of charge to charge another battery with a lower relative state of charge to thereby equalize the batteries' relative states of charge.

Abstract: System boot-up can be enabled in low temperature environments. A laptop or other battery-powered computing device can include multiple batteries and a battery architecture that allows the multiple batteries to simultaneously discharge to thereby provide adequate power to boot the system in low temperature environments. The battery architecture may also allow a battery with a higher relative state of charge to charge another battery with a lower relative state of charge to thereby equalize the batteries' relative states of charge.

Abstract: An information handling system implemented as a convertible notebook may include a first assembly, a second assembly hingedly coupled to the first assembly, a magnet housed in the first assembly, a giant magnetoresistance sensor housed in the second assembly, a Hall effect sensor housed in the second assembly, and a management controller communicatively coupled to the giant magnetoresistance sensor and the Hall effect sensor, and configured to, based on a first signal received from the giant magnetoresistance sensor and a second signal received from the Hall effect sensor, determine a position of the first assembly relative to the second assembly.

Abstract: In one embodiment, a method for preventing an operable state in a plurality of components of an information handling system in response to a reset of a power supply includes: receiving, by an embedded controller of the information handling system, power from the power supply after the reset of the power supply; causing a platform controller hub of the information handling system to receive the power from the power supply; receiving a signal from the platform controller hub indicating that the plurality of components should be placed in the operable state from an inoperable state; determining that the reset of the power supply was caused by the power supply being previously removed from the information handling system; determining that a position of a lid of the information handling system is in a closed position; and causing the plurality of components to remain in the inoperable state.

Abstract: An information handling system implemented as a convertible notebook may include a first assembly, a second assembly hingedly coupled to the first assembly, a magnet housed in the first assembly, a giant magnetoresistance sensor housed in the second assembly, a Hall effect sensor housed in the second assembly, and a management controller communicatively coupled to the giant magnetoresistance sensor and the Hall effect sensor, and configured to, based on a first signal received from the giant magnetoresistance sensor and a second signal received from the Hall effect sensor, determine a position of the first assembly relative to the second assembly.

Abstract: A composite material based building material structure includes a metal member and a combination member. The metal member includes a connection plate and two lateral plates disposed on two ends of the connection plate. The two lateral plates extend toward an identical side of the connection plate, forming a combination groove. The metal member includes a plurality of first connection portions on an outer periphery of each lateral plate. The combination member is formed of wood plastic composites, and has a recess for receiving the metal member. The combination member includes a plurality of second connection portions on an inner periphery of the recess, for correspondingly receiving the first connection portions, such that the combination member is mounted on an outer side of the metal member. Thus, the metal member is prevented from moisture, achieving increased life span of the building material structure.

Abstract: A combination frame material comprises an outer frame and an inner frame. The outer frame has an outer side and an inner side, with the inner side provided with two parallel combining grooves with a middle pillar disposed therebetween for dividing the two combining grooves. The inner frame has two parallel combining parts for being transversely received in the two combining grooves, with a pillar groove disposed between the two combining parts for receiving the middle pillar. Thus, the outer frame and the inner frame are allowed to be combined easily and efficiently.

Abstract: A combination frame material includes an outer frame and an inner frame. Therein, the outer frame has an outer side and an inner side, with the inner side provided with two parallel combining grooves with a middle pillar disposed therebetween for dividing the two combining grooves. The inner frame has two parallel combining parts for being received in the two combining grooves, with a pillar groove disposed between the two combining parts for receiving the middle pillar. Thus, the outer frame and the inner frame are allowed to be combined easily and efficiently.

Abstract: A light emitting diode (LED) package structure is provided. The LED package structure comprises a substrate, at least one LED chip, an encapsulating compound and a curing material. The substrate has a first surface and a second surface opposite to the first surface. The LED chip is disposed on the first surface. The encapsulating compound covers the LED chip. The encapsulating compound has a plurality of particulate phosphors therein. The phosphors are centralized near a side of the encapsulating compound away from the substrate. The curing material is adhered to the side of the encapsulating compound away from the substrate.

Abstract: An illumination component package includes a substrate, at least one illumination component, a dam and an encapsulating glue. The illumination component is mounted on the substrate. The dam surrounds the illumination component to form a accommodating space. The inner wall of the dam includes a plurality of glue adhering microstructures. The encapsulating glue is filled in the accommodating space.

Abstract: A lamp including a carrier and a plurality of light source modules stacked to the carrier is provided. Each light source module includes a circuit board and a plurality of light-emitting diodes, wherein the light-emitting diodes are disposed on at least one side of the circuit board and electrically connected to the circuit board.

Abstract: A package substrate of the present invention at least comprises a metal substrate and a plurality of light emitting dies. The metal substrate is provided thereon with at least one trench. The trench is recessed into the surface of the metal substrate through an insulating layer. The light emitting dies are secured in the trench and electrically connected to a predetermined wiring layer on the metal substrate by metal wires, thereby obtaining a light emitting die package substrate with good thermal conductivity, high heat dissipation, separate electrical and thermal paths and a simple and firm structure.

Abstract: A fixing mechanism for fixing a heat-dissipating device includes a plurality of thermal fins whereon a ditch is formed, and a positioning device disposed on the plurality of thermal fins. The positioning device includes a supporting portion, and a first side of the supporting portion is for supporting the heat-dissipating device. The positioning device further includes a first constraining portion connected to a second side of the supporting portion and engaged with the ditch for preventing the supporting portion from moving relative to the plurality of thermal fins in a first direction, and a second constraining portion connected to the second side of the supporting portion and contacting against the plurality of thermal fins for preventing the supporting portion from moving relative to the plurality of thermal fins in a second direction different from the first direction.

Abstract: A lamp including a carrier and a plurality of light source modules stacked to the carrier is provided. Each light source module includes a circuit board and a plurality of light-emitting diodes, wherein the light-emitting diodes are disposed on at least one side of the circuit board and electrically connected to the circuit board.

Abstract: A package substrate of the present invention at least comprises a metal substrate and a plurality of light emitting dies. The metal substrate is provided thereon with at least one trench. The trench is recessed into the surface of the metal substrate through an insulating layer. The light emitting dies are secured in the trench and electrically connected to a predetermined wiring layer on the metal substrate by metal wires, thereby obtaining a light emitting die package substrate with good thermal conductivity, high heat dissipation, separate electrical and thermal paths and a simple and firm structure.

Abstract: A docking station is used for cooperating with a computer host, and the computer host has a first power connecting portion and a first peripheral component connecting portion. The docking station includes a casing, a second power connecting portion and a second peripheral component connecting portion. The casing is used for disposing the computer host. The second power connecting portion and the second peripheral component connecting portion are disposed at the casing. When the computer host is disposed at the casing, the second power connecting portion is connected to the first power connecting portion to transmit a power signal to the computer host, and the second peripheral component connecting portion is connected to the first peripheral component connecting portion to transmit at least one peripheral component signal to the computer host. An expandable computer system is also disclosed.