Abstract: An adapter card for mounting expansion card to motherboard includes a card-board, a slot, and a plug. The card-board includes a connecting piece located in the slot for connecting the expansion card to the card-board. The post and the latch are configured for fixing the expansion card, the plug is configured for connecting the card-board to a motherboard. The expansion card is designed with special specifications which cannot be inserted into the regular slot on motherboard, but the adapter card can adapt the expansion card designed to the regular slot on the motherboard, without changing types of the slot on the motherboard, improving efficiency of mounting expansion card. A graphics card test device using the adapter card is also disclosed.

Abstract: An optical sensor package structure includes a substrate, a metal plate, an optical sensing chip, a plurality of bonding wires and a lens module. The substrate includes a top surface, a bottom surface and a hole penetrating the top surface and the bottom surface. The metal plate covers the hole from the bottom surface of the substrate. The optical sensing chip is received in the hole and mounted on the metal plate. The bonding wires interconnect the optical sensing chip and the top surface of substrate. The lens module is covering on the hole and mounting on the top surface of the substrate to enclose the optical sensing chip and the bonding wires. Because the optical sensing chip is received in the hole of the substrate, the height of the optical sensor package structure can be reduced to adapt to a compact size electrical device.

Abstract: An optical sensor package structure includes a substrate, a metal plate, an optical sensing chip, a plurality of bonding wires and a lens module. The substrate includes a top surface, a bottom surface and a hole penetrating the top surface and the bottom surface. The metal plate covers the hole from the bottom surface of the substrate. The optical sensing chip is received in the hole and mounted on the metal plate. The bonding wires interconnect the optical sensing chip and the top surface of substrate. The lens module is covering on the hole and mounting on the top surface of the substrate to enclose the optical sensing chip and the bonding wires. Because the optical sensing chip is received in the hole of the substrate, the height of the optical sensor package structure can be reduced to adapt to a compact size electrical device.

Abstract: A decorative button has a body, connector and an inner cap. The body has an outline, a front surface formed with a pattern and a rear surface. The connector is attached to the rear surface of the body and has a sleeve having a distal end and a proximal end and a flange being formed perpendicularly on the distal end of sleeve. The inner cap has a stopper and a plug. The plug is formed centrally on and protrudes perpendicularly from the stopper and is mounted through and fastened in the connector and has a proximal end. The decorative button is mounted through existing holes in any objects to improve aesthetic appeal without being dangerous or causing damage.

Abstract: A metal decorative button has a plastic buttony segment and a metal decorative segment. The decorative segment has a fastening protrusion being connected securely to the buttony segment. The buttony segment is buttoned to a native hole of an object to decorate the object without damaging the object. Therefore, the objects such as clothes, bags, shoes and the like that have native holes such as buttonholes can be decorated by the metal decorative button without being damaged.