Abstract: A capacitive biosensor is provided. The capacitive biosensor includes: a transistor, an interconnect structure on the transistor, and a passivation layer on the interconnect structure. The interconnect structure includes a first metal structure on the transistor, a second metal structure on the first metal structure, and a third metal structure on the second metal structure. The third metal structure includes a first conductive layer, a second conductive layer, and a third conductive layer that are sequentially stacked. The passivation has an opening exposing a portion of the third metal structure. The capacitive biosensor further includes a sensing region on the interconnect structure. The sensing region includes a first sensing electrode and a second sensing electrode. The first sensing electrode is formed of the third conductive layer, and the second sensing electrode is disposed on the passivation layer.

Abstract: A semiconductor device and a method of forming the same are provided. The method includes forming a bottom electrode layer over a substrate. A magnetic tunnel junction (MTJ) layers are formed over the bottom electrode layer. A top electrode layer is formed over the MTJ layers. The top electrode layer is patterned. After patterning the top electrode layer, one or more process cycles are performed on the MTJ layers and the bottom electrode layer. A patterned top electrode layer, patterned MTJ layers and a patterned bottom electrode layer form MTJ structures. Each of the one or more process cycles includes performing an etching process on the MTJ layers and the bottom electrode layer for a first duration and performing a magnetic treatment on the MTJ layers and the bottom electrode layer for a second duration.

Abstract: A method for producing a transferable array of light emitting devices includes forming a plurality of light emitting devices on a temporary substrate, forming at least one supporting member that is directly connected to a release layer of at least one of the light emitting devices, connecting a supporting substrate only with the at least one supporting member so that the at least one supporting member extends from the release layer of the at least one of the light emitting devices to the supporting substrate and so that the light emitting devices are spaced apart from the supporting substrate, and removing the temporary substrate. The transferable array produced by the method is also disclosed.

Abstract: The present disclosure generally relates to underwater user interfaces.

Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.

Abstract: An apparatus includes a six-axis correction stage, an auto-collimation measurement device, a light splitter, a telecentric image measurement device, and a controller. The six-axis correction stage carries a device under test; the auto-collimation measurement device is arranged above the six-axis correction stage along a measurement optical axis; the light splitter is arranged on the measurement optical axis and is interposed between the six-axis correction stage and the auto-collimation measurement device. A method controls the six-axis correction stage to correct rotation errors in at least two degrees of freedom of the device under test according to a measurement result of the auto-collimation measurement device, and controls the six-axis correction stage to correct translation and yaw errors in at least three degrees of freedom of the device under test according to a measurement result of the telecentric image measurement device by means of the controller.

Abstract: A light-emitting diode device includes an epitaxial structure that contains first-type and second-type semiconductor units and an active layer interposed therebetween, a light transmittable dielectric element that is disposed on the first-type semiconductor unit opposite to the active layer and is formed with a first through hole, an adhesive layer that is disposed on the dielectric element and is formed with a second through hole corresponding in position to the first through hole, and a metal contact element that is disposed on the adhesive layer. The adhesive layer has a thickness of at most one fifth of that of the dielectric element. The metal contact element extends into the first and second through holes, and electrically contacts the first-type semiconductor unit. A method for manufacturing the LED device is also disclosed.

Abstract: The present disclosure provides a package structure including a redistribution layer and a die. The redistribution layer includes a switch circuit portion and a redistribution portion, the switch circuit portion includes a transistor, and the redistribution portion is adjacent to the switch circuit portion. The die overlaps the redistribution portion, wherein the transistor is electrically connected to the die.

Abstract: The present disclosure provides a package structure including a redistribution layer and a die. The redistribution layer includes a switch circuit portion and a redistribution portion, the switch circuit portion includes a transistor, and the redistribution portion is adjacent to the switch circuit portion. The die overlaps the redistribution portion, wherein the transistor is electrically connected to the die.

Abstract: A backlight module includes a light-emitting unit, and a controller to receive a first control signal and generate a second control signal to control the light-emitting unit. The controller controls a frequency of the second control signal according to a duty cycle of the first control signal.

Abstract: A driving device, a light emitting diode (LED) driving device and a method thereof are provided. The driving device includes a driving unit and a plurality of selection units. The driving unit produces a driving signal to drive a light emitting diode. The selection units are coupled to the driving unit and respectively correspond to a current value. The driving unit selects one of the selection units according a first pulse width modulation (PWM) signal. The current value corresponding to the selected selection unit is taken as the current value of the driving signal. The driving unit generates a duty cycle of a second PWM signal according to the duty cycle of the first PWM signal to serve as a duty cycle of the driving signal. In this way, power consumption of the LED is reduced.

Abstract: A driving device, a light emitting diode (LED) driving device and a method thereof are provided. The driving device includes a driving unit and a plurality of selection units. The driving unit produces a driving signal to drive a light emitting diode. The selection units are coupled to the driving unit and respectively correspond to a current value. The driving unit selects one of the selection units according a first pulse width modulation (PWM) signal. The current value corresponding to the selected selection unit is taken as the current value of the driving signal. The driving unit generates a duty cycle of a second PWM signal according to the duty cycle of the first PWM signal to serve as a duty cycle of the driving signal. In this way, power consumption of the LED is reduced.

Abstract: A backlight module includes a light-emitting unit, and a controller to receive a first control signal and generate a second control signal to control the light-emitting unit. The controller controls a frequency of the second control signal according to a duty cycle of the first control signal.

Abstract: A liquid crystal display panel includes an upper substrate, a lower substrate, and a plurality of pixels located between the upper substrate and the lower substrate. Each of the pixels has at least a compensating capacitor for providing an approximately identical feed-through voltage for each of the pixels, thus reducing a flicker effect of the liquid crystal display device.

Abstract: A thin film transistor liquid crystal display (TFT LCD) has row pairs of pixels. Each row pair of pixels includes first row pixels arrayed in a first row, and second row pixels arrayed in a second row, together forming columns of pixels. First and second data drivers are provided for each column of pixels. Scan line drivers are provided for each row pair of pixels so that every pixel in a row pair of pixels is connected to the same scan line driver. Every first row pixel in a column of pixels is connected to the same first data driver, and every second row pixel in a column of pixels is connected to the same second data driver.

Abstract: A thin film transistor liquid crystal display (TFT LCD) has row pairs of pixels. Each row pair of pixels includes first row pixels arrayed in a first row, and second row pixels arrayed in a second row, together forming columns of pixels. First and second data drivers are provided for each column of pixels. Scan line drivers are provided for each row pair of pixels so that every pixel in a row pair of pixels is connected to the same scan line driver. Every first row pixel in a column of pixels is connected to the same first data driver, and every second row pixel in a column of pixels is connected to the same second data driver.

Abstract: A liquid crystal display panel includes an upper substrate, a lower substrate, and a plurality of pixels located between the upper substrate and the lower substrate. Each of the pixels has at least a compensating capacitor for providing an approximately identical feed-through voltage for each of the pixels, thus reducing a flicker effect of the liquid crystal display device.