Abstract: A fast heat-sinking device for evaporators according to the present invention is disclosed, comprising at least one heat-sinking component which is formed by means of conjunctively assembling an outer wall board and an inner wall board; the interior of the outer wall board includes a semi-open first evaporation area; the interior of the inner wall board includes a semi-open second evaporation area, and the inner wall board is concavely configured with a gap; as such, the inner wall board is attached onto one side of the outer wall board thus further being assembled into the heat-sinking component, and the first evaporation area and the second evaporation area are connected in communication at the notch so as to together form an air concentration area, as a heat-sinking structure of the evaporator.

Abstract: A fast heat-sinking, current stabilization and pressure boosting device for condenser is disclosed, comprising a heat exchange module and an outer case. The heat exchange module is further divided into a high pressure area and a low pressure area, and an air in channel is installed in the high pressure area and a water out channel is installed in the low pressure area; also, the heat exchange module is provided with at least one channel, and the heat exchange module is assembled inside the outer case. As such, the pressure difference between the low pressure area and the high pressure area can drive the water in each of the inner channels to flow faster toward the low pressure area.

Abstract: A current stabilization and pressure boosting device for evaporator is disclosed, comprising a heat-sinking module and an outer case, wherein the heat-sinking module is assembled by successively stacking a large number of heat-sinking components, with each of the heat-sinking components having a first board surface, a second board surface and a third board surface, so that the insides of such heat-sinking components form a semi-open inner flow channel, and a fourth board surface is further respectively provided at the two ends of the heat-sinking components opposite to the inner flow channel, and the heat-sinking module is respectively configured with a water injection channel and an air exhausting channel, and the heat-sinking module is installed inside the outer case and the outer lid.

Abstract: A fast heat-sinking device for evaporators according to the present invention is disclosed, comprising at least one heat-sinking component which is formed by means of conjunctively assembling an outer wall board and an inner wall board; the interior of the outer wall board includes a semi-open first evaporation area; the interior of the inner wall board includes a semi-open second evaporation area, and the inner wall board is concavely configured with a gap; as such, the inner wall board is attached onto one side of the outer wall board thus further being assembled into the heat-sinking component, and the first evaporation area and the second evaporation area are connected in communication at the notch so as to together form an air concentration area, as a heat-sinking structure of the evaporator.

Abstract: A current stabilization and pressure boosting device for evaporator is disclosed, comprising a heat-sinking module and an outer case, wherein the heat-sinking module is assembled by successively stacking a large number of heat-sinking components, with each of the heat-sinking components having a first board surface, a second board surface and a third board surface, so that the insides of such heat-sinking components form a semi-open inner flow channel, and a fourth board surface is further respectively provided at the two ends of the heat-sinking components opposite to the inner flow channel, and the heat-sinking module is respectively configured with a water injection channel and an air exhausting channel, and the heat-sinking module is installed inside the outer case and the outer lid.

Abstract: A heat-sinking improved structure for evaporators includes at least one heat-sinking component having an outer wall board; an inner wall board extending upwards at the bottom of the outer wall board and dividing the lower portion of the interior of the outer wall board to form two water evaporation areas, and a gas concentration area formed at the top portion of the interior of the outer wall board; then, continuously arranging and combining such a plurality of heat-sinking components in the same direction thereby constituting a heat-sinking module which can be installed and sealed within an outer case in order to operate as a heat-sinking improved structure for the evaporator.

Abstract: An evaporator structure with improved layout of cooling fluid channels includes a heat exchange component, a thermal conductive shell and a top cap. The heat exchange component is accommodated in the thermal conductive shell; the top cap mounted on the thermal conductive shell encloses the heat exchange component; the heat exchange component includes a plurality of transverse channels thereon, two first lengthwise cooling fluid channels near two side edges at the bottom respectively and a plurality of minor second lengthwise cooling fluid channels near the center. When the thermal conductive shell is heated, cooling fluids flowing to first lengthwise cooling fluid channels at both sides through transverse channels are guided into second lengthwise cooling fluid channels via the first lengthwise cooling fluid channels and the transverse channels and distributed throughout heat sources uniformly for full-area heat dissipation.

Abstract: A heat-sinking improved structure for evaporators includes at least one heat-sinking component having an outer wall board; an inner wall board extending upwards at the bottom of the outer wall board and dividing the lower portion of the interior of the outer wall board to form two water evaporation areas, and a gas concentration area formed at the top portion of the interior of the outer wall board; then, continuously arranging and combining such a plurality of heat-sinking components in the same direction thereby constituting a heat-sinking module which can be installed and sealed within an outer case in order to operate as a heat-sinking improved structure for the evaporator.

Abstract: A fast heat-sinking, current stabilization and pressure boosting device for condenser is disclosed, comprising a heat exchange module and an outer case. The heat exchange module is further divided into a high pressure area and a low pressure area, and an air in channel is installed in the high pressure area and a water out channel is installed in the low pressure area; also, the heat exchange module is provided with at least one channel, and the heat exchange module is assembled inside the outer case. As such, the pressure difference between the low pressure area and the high pressure area can drive the water in each of the inner channels to flow faster toward the low pressure area.

Abstract: An evaporator structure comprises a heat exchange component, a thermal conductive shell and a top cap wherein: the heat exchange component is accommodated in the thermal conductive shell; the top cap mounted on the thermal conductive shell encloses the heat exchange component; the heat exchange component comprises a plurality of transverse channels thereon, two first lengthwise cooling fluid channels near two side edges at the bottom respectively and a plurality of minor second lengthwise cooling fluid channels near the center. When the thermal conductive shell is heated, cooling fluids flowing to first lengthwise cooling fluid channels at both sides through transverse channels are guided into second lengthwise cooling fluid channels via the first lengthwise cooling fluid channels and the transverse channels and distributed throughout heat sources uniformly for full-area heat dissipation.

Abstract: An exemplary method for manufacturing a heat pipe includes the following steps: providing a tube, a mandrel and an artery pipe, the tube defining an opening at one end thereof, a wick structure being positioned on an inner surface of the tube, a slot being defined in an outer surface of the mandrel; inserting the mandrel and the artery pipe into the tube via the opening, the artery pipe being received in the slot; baking the tube with the mandrel and the artery pipe to make the artery pipe join the wick structure; drawing the mandrel out of the tube via the opening; and injecting a working media into the tube, and evacuating and sealing the tube.

Abstract: A thermal module comprises a cooling fan, a heat pipe and a fin assembly. The cooling fan defines an air outlet therein. The fin assembly is mounted at the air outlet of the cooling fan. The heat pipe comprises an evaporating section attached to the cooling fan and a condensing section attached to the fin assembly. The evaporating section of the heat pipe is wholly located within an inner space of the cooling fan.

Abstract: A heat dissipation device includes a fin unit, a heat spreader and a heat isolation layer. The heat spreader contacts the fin unit and transfers heat to the fin unit for dissipation. The heat isolation layer is coated on an outer surface of the heat dissipation device. The heat isolation layer is polyurethane foam.

Abstract: A notebook computer includes a heat-generating component, a keyboard frame made of a heat conductive material and a heat pipe having an evaporator and a condenser. The evaporator of the heat pipe is in thermal communication with the heat-generating component and the condenser is attached to the keyboard frame and away from the heat-generating component.

Abstract: A heat dissipation device includes a fin unit, a heat spreader and a heat isolation layer. The heat spreader contacts the fin unit and transfers heat to the fin unit for dissipation. The heat isolation layer is coated on an outer surface of the heat dissipation device. The heat isolation layer is polyurethane foam.

Abstract: A notebook computer includes a heat-generating component, a keyboard frame made of a heat conductive material and a heat pipe having an evaporator and a condenser. The evaporator of the heat pipe is in thermal communication with the heat-generating component and the condenser is attached to the keyboard frame and away from the heat-generating component.

Abstract: A thermal module includes a heat sink (400), a heat pipe (200) and a fastening device (300). The heat pipe (200) includes an evaporator (240) and a condenser (220) connected with the heat sink. The fastening device includes a base member (320) and a spring member (340). The base member includes a contacting plate (322) and two locating pins (324). Each locating pin includes a head portion (3240) and a neck portion (3244). The spring member includes a pressing portion (342) pressing the evaporator towards the contacting plate. Two locating holes (348) are defined in the pressing portion. The spring member is mounted on the base member via engagement of the locating holes with the locating pins. The spring member has a thickness smaller than a length of each of the neck portions and is movable along the neck portions to suit for a size of the evaporator.