Patents by Inventor CHENG-JIA LI
CHENG-JIA LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11950371Abstract: A method for manufacturing a transparent circuit board includes the following steps. A composite substrate including a conductive layer and a transparent insulating layer on the conductive layer is provided. A wiring groove is formed on the transparent insulating layer by laser ablation and a carbon black layer is formed on an inner wall of the wiring groove. The wiring groove penetrates the transparent insulating layer, the wiring groove extends toward the conductive layer to pass through a part of the conductive layer. A conductive wiring corresponding to the wiring groove is formed and fully fills the wiring groove. A black oxide treatment is performed on a surface of the conductive wiring facing away from the conductive layer to form a blackened layer. A transparent cover film is pressed on a side of the transparent insulating layer facing away from the conductive layer. The conductive layer is removed.Type: GrantFiled: August 22, 2019Date of Patent: April 2, 2024Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.Inventors: Cheng-Jia Li, Mei Yang
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Publication number: 20230155055Abstract: A method of manufacturing a display module which is able to present a split-screen display without a black line prominent at the boundary includes: providing a first circuit substrate including a plurality of first pads, providing a second circuit substrate including a plurality of second pads; bonding the first circuit substrate and the second circuit sub state onto a surface of a heat dissipation plate through a first heat conductive adhesive; and mounting a plurality of light emitting diodes onto the first conductive wiring layer and the third conductive wiring layer, where one light emitting diodes is electrically connected to two first pad, one light emitting diode is electrically connected to one first pad and one second pad, and one light emitting diode is electrically connected to two second pads. A display module including light emitting diodes is also disclosed.Type: ApplicationFiled: December 20, 2021Publication date: May 18, 2023Inventor: CHENG-JIA LI
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Publication number: 20230089856Abstract: A transparent circuit board includes a conductive wiring, a transparent insulating layer, and a cover film. The transparent insulating layer and the cover film are stacked along a stacking direction. The conductive wiring penetrates the transparent insulating layer along the stacking direction, and is at least partially embedded in the transparent insulating layer. A blackened layer is formed on a surface of the conductive wiring combined with the cover film, a carbon black layer is formed on a surface of the conductive wiring without the blackened layer, thereby improving a light transmittance of the transparent circuit board. The present invention also provides a method for manufacturing the transparent circuit board.Type: ApplicationFiled: August 22, 2019Publication date: March 23, 2023Inventors: CHENG-JIA LI, MEI YANG
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Patent number: 11582885Abstract: A method for manufacturing a circuit board includes providing an insulating substrate, defining a through hole in the insulating substrate, forming a first conductive layer on two surfaces of the insulating substrate and on an inner wall of the through hole, forming a phase change material layer on a surface of each first conductive layer, forming a seed layer on a surface of the first conductive layer, forming a second conductive layer on a surface of the seed layer, and etching the seed layer, the first conductive layer, and the second conductive layer, so that a first conductive circuit layer and a second conductive circuit layer are respectively formed on two opposite surfaces of the insulating substrate, so that the phase change material layer is embedded in the first conductive circuit layer and in the second conductive circuit layer. The application also provides a circuit board.Type: GrantFiled: January 15, 2020Date of Patent: February 14, 2023Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTDInventor: Cheng-Jia Li
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Publication number: 20220418101Abstract: A multi-layer circuit board with embedded components (100) in multiple layers and miniaturized form, with embedded electronic elements in a higher element density and shorter voltage paths includes a circuit board (10) provided with a mounting groove (101), and a plurality of elements (20). The elements (20) are arranged in the mounting groove (101), and the circuit board (10) includes several vertically-stacked circuit substrates (11, 12, 13, 14) arranged around the mounting groove (101), The multi-layer circuit board with embedded components circuit board (100) includes a conductive member (30) arranged in the mounting groove (101) and electrically connecting the elements (20) and the layers of conductive circuits.Type: ApplicationFiled: April 27, 2020Publication date: December 29, 2022Inventor: CHENG-JIA LI
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Publication number: 20220124935Abstract: A method for manufacturing a circuit board includes providing an insulating substrate, defining a through hole in the insulating substrate, forming a first conductive layer on two surfaces of the insulating substrate and on an inner wall of the through hole, forming a phase change material layer on a surface of each first conductive layer, forming a seed layer on a surface of the first conductive layer, forming a second conductive layer on a surface of the seed layer, and etching the seed layer, the first conductive layer, and the second conductive layer, so that a first conductive circuit layer and a second conductive circuit layer are respectively formed on two opposite surfaces of the insulating substrate, so that the phase change material layer is embedded in the first conductive circuit layer and in the second conductive circuit layer. The application also provides a circuit board.Type: ApplicationFiled: January 15, 2020Publication date: April 21, 2022Applicants: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTDInventor: CHENG-JIA LI
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Publication number: 20220095451Abstract: A method for manufacturing such multilayer printed circuit board includes providing a metal laminated structure including a first type metal layer and a second type metal layer, pressing a patterned dry film layer and a protective film layer on two surfaces of the metal laminated structure, the dry film layer exposing the second type metal layer; etching the second type metal layer to form a first conductive circuit layer; etching a first type metal layer to form a second conductive circuit layer, the first conductive circuit layer and the second conductive circuit layer defining an inner circuit laminated structure; removing the dry film layer; and forming a first adding-layer circuit base board and a second adding-layer circuit base board on two surfaces of the inner laminated structure.Type: ApplicationFiled: December 6, 2021Publication date: March 24, 2022Inventors: CHENG-JIA LI, MEI YANG
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Patent number: 11234331Abstract: A multilayer printed circuit board providing large current and high power includes an inner circuit laminated structure, a first adding-layer circuit base board, and second adding-layer circuit base board. The inner circuit laminated structure includes at least one first type and second type conductive circuit layer alternately stacked. The first and second type conductive circuit layer are respectively made of first and second type metal layer, the first and second type metal layer have different etching ability. The second adding-layer circuit base board and the first adding-layer circuit base board are formed on opposite surfaces of the inner circuit laminated structure. The first and second adding-layer circuit base boards are electrically connected to the inner circuit laminated structure. The disclosure also provides a method for manufacturing such multilayer printed circuit board.Type: GrantFiled: May 29, 2020Date of Patent: January 25, 2022Assignees: HongQiSheng Precision Electronics (QingHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.Inventors: Cheng-Jia Li, Mei Yang
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Publication number: 20210337665Abstract: A multilayer printed circuit board providing large current and high power includes an inner circuit laminated structure, a first adding-layer circuit base board, and second adding-layer circuit base board. The inner circuit laminated structure includes at least one first type and second type conductive circuit layer alternately stacked. The first and second type conductive circuit layer are respectively made of first and second type metal layer, the first and second type metal layer have different etching ability. The second adding-layer circuit base board and the first adding-layer circuit base board are formed on opposite surfaces of the inner circuit laminated structure. The first and second adding-layer circuit base boards are electrically connected to the inner circuit laminated structure. The disclosure also provides a method for manufacturing such multilayer printed circuit board.Type: ApplicationFiled: May 29, 2020Publication date: October 28, 2021Inventors: CHENG-JIA LI, MEI YANG
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Patent number: 11140785Abstract: A flexible printed circuit board includes a base layer and a pattern line. At least one communication hole penetrating opposite surfaces of the base layer. The pattern line includes two conductive circuit layers formed on the opposite surfaces of the base layer. At least one conductive pole are formed in the at least one communication hole and electrically connects the two conductive circuit layers. A gap being is formed between the conductive pole and the base layer.Type: GrantFiled: December 11, 2019Date of Patent: October 5, 2021Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.Inventors: Xian-Qin Hu, Cheng-Jia Li
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Patent number: 10638606Abstract: A composite circuit board includes an insulation layer, an inner circuit layer, a first conductive layer and a second conductive layer embedded in the insulation layer, a third conductive layer and a fourth conductive layer formed on opposite surfaces of the insulation layer. The third conductive layer electrically connects with the first conductive layer. The fourth conductive layer electrically connects with the second conductive layer. The inner circuit layer is in a middle portion of the insulation layer. The first conductive layer and the second conductive layer respectively forms on opposite sides of the inner circuit layer. The insulation layer forms a plurality of first through holes between the first conductive layer and the inner circuit layer, a plurality of second through holes between the second conductive layer and the inner circuit layer.Type: GrantFiled: October 25, 2018Date of Patent: April 28, 2020Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.Inventors: Xian-Qin Hu, Mei Yang, Cheng-Jia Li
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Publication number: 20200113064Abstract: A flexible printed circuit board includes a base layer and a pattern line. At least one communication hole penetrating opposite surfaces of the base layer. The pattern line includes two conductive circuit layers formed on the opposite surfaces of the base layer. At least one conductive pole are formed in the at least one communication hole and electrically connects the two conductive circuit layers. A gap being is formed between the conductive pole and the base layer.Type: ApplicationFiled: December 11, 2019Publication date: April 9, 2020Inventors: XIAN-QIN HU, CHENG-JIA LI
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Patent number: 10542627Abstract: A method for manufacturing a flexible printed circuit board includes having a base layer, and creating a pattern line and at least one conductive pole. The base layer defines at least one communication hole penetrating through the base layer. The pattern line includes two conductive circuit layers formed on opposite surfaces of the base layer. The at least one conductive pole is formed in the at least one communication hole and electrically connects the two conductive circuit layers. A diameter of each conductive pole is less than a diameter of a communication hole.Type: GrantFiled: July 31, 2018Date of Patent: January 21, 2020Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.Inventors: Xian-Qin Hu, Cheng-Jia Li
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Publication number: 20190116674Abstract: A method for manufacturing a flexible printed circuit board includes having a base layer, and creating a pattern line and at least one conductive pole. The base layer defines at least one communication hole penetrating through the base layer. The pattern line includes two conductive circuit layers formed on opposite surfaces of the base layer. The at least one conductive pole is formed in the at least one communication hole and electrically connects the two conductive circuit layers. A diameter of each conductive pole is less than a diameter of a communication hole.Type: ApplicationFiled: July 31, 2018Publication date: April 18, 2019Inventors: XIAN-QIN HU, CHENG-JIA LI
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Publication number: 20190069406Abstract: A composite circuit board includes an insulation layer, an inner circuit layer, a first conductive layer and a second conductive layer embedded in the insulation layer, a third conductive layer and a fourth conductive layer formed on opposite surfaces of the insulation layer. The third conductive layer electrically connects with the first conductive layer. The fourth conductive layer electrically connects with the second conductive layer. The inner circuit layer is in a middle portion of the insulation layer. The first conductive layer and the second conductive layer respectively forms on opposite sides of the inner circuit layer. The insulation layer forms a plurality of first through holes between the first conductive layer and the inner circuit layer, a plurality of second through holes between the second conductive layer and the inner circuit layer.Type: ApplicationFiled: October 25, 2018Publication date: February 28, 2019Inventors: XIAN-QIN HU, MEI YANG, CHENG-JIA LI
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Patent number: 10159149Abstract: A composite circuit board includes an insulation layer, an inner circuit layer, a first conductive layer and a second conductive layer embedded in the insulation layer, a third conductive layer and a fourth conductive layer formed on opposite surfaces of the insulation layer. The third conductive layer electrically connects with the first conductive layer. The fourth conductive layer electrically connects with the second conductive layer. The inner circuit layer is in a middle portion of the insulation layer. The first conductive layer and the second conductive layer respectively forms on opposite sides of the inner circuit layer. The insulation layer forms a plurality of first through holes between the first conductive layer and the inner circuit layer, a plurality of second through holes between the second conductive layer and the inner circuit layer.Type: GrantFiled: April 28, 2017Date of Patent: December 18, 2018Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co, Avary Holding (Shenzhen) Co., Limited.Inventors: Xian-Qin Hu, Mei Yang, Cheng-Jia Li
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Publication number: 20180192516Abstract: A composite circuit board includes an insulation layer, an inner circuit layer, a first conductive layer and a second conductive layer embedded in the insulation layer, a third conductive layer and a fourth conductive layer formed on opposite surfaces of the insulation layer. The third conductive layer electrically connects with the first conductive layer. The fourth conductive layer electrically connects with the second conductive layer. The inner circuit layer is in a middle portion of the insulation layer. The first conductive layer and the second conductive layer respectively forms on opposite sides of the inner circuit layer. The insulation layer forms a plurality of first through holes between the first conductive layer and the inner circuit layer, a plurality of second through holes between the second conductive layer and the inner circuit layer.Type: ApplicationFiled: April 28, 2017Publication date: July 5, 2018Inventors: XIAN-QIN HU, MEI YANG, CHENG-JIA LI
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Patent number: 9860977Abstract: A transparent flexible printed circuit board (FPCB) of reduced thickness but good conductivity and transparency includes an insulating resin layer. The insulating resin layer has a first surface and a second surface. At least one through hole is defined in the insulating resin layer through the first surface and the second surface. A conductive wiring layer is formed on the first surface and a wiring layer is formed on the second surface. The conductive wiring layers are made of electrically conductive resin, and have wiring openings. A cover film covers each of the conductive wiring layers, and further infills the wiring openings.Type: GrantFiled: August 2, 2017Date of Patent: January 2, 2018Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.Inventors: Cheng-Jia Li, Ming-Hua Du, Gang Yuan
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Patent number: 9832888Abstract: A method of manufacture of a circuit board without annular through-hole rings and thus allowing a higher component density includes a base layer, a first wire pattern layer, and a second wire pattern layer on both sides of the base layer. A portion of the base layer not covered by the first wire pattern layer defines at least one first hole. The circuit board further includes a wire layer. The wire layer includes at least a first portion and a second portion connecting to the first portion. The first portion is filled in the first hole. The second portion is formed on the first portion extending away from the base layer. A diameter of the second portion is less than an aperture diameter of the first hole. The wire layer is electrically conductive between the first wire pattern layer and the second wire pattern layer through the first portion.Type: GrantFiled: June 24, 2016Date of Patent: November 28, 2017Assignees: Avary Holding (Shenzhen) Co., Limited, HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., GARUDA TECHNOLOGY CO., LTD.Inventors: Yan-Lu Li, Mei Yang, Cheng-Jia Li
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Publication number: 20170339795Abstract: A method of manufacture of a circuit board without annular through-hole rings and thus allowing a higher component density includes a base layer, a first wire pattern layer, and a second wire pattern layer on both sides of the base layer. A portion of the base layer not covered by the first wire pattern layer defines at least one first hole. The circuit board further includes a wire layer. The wire layer includes at least a first portion and a second portion connecting to the first portion. The first portion is filled in the first hole. The second portion is formed on the first portion extending away from the base layer. A diameter of the second portion is less than an aperture diameter of the first hole. The wire layer is electrically conductive between the first wire pattern layer and the second wire pattern layer through the first portion.Type: ApplicationFiled: June 24, 2016Publication date: November 23, 2017Inventors: YAN-LU LI, MEI YANG, CHENG-JIA LI