Abstract: Systems, methods, and devices are described herein for integrated circuit (IC) layout validation. A plurality of IC patterns are collected which include a first set of patterns capable of being manufactured and a second set of patterns incapable of being manufactured. A machine learning model is trained using the plurality of IC patterns. The machine learning model generates a prediction model for validating IC layouts. The prediction model receives data including a set of test patterns comprising scanning electron microscope (SEM) images of IC patterns. Design violations associated with an IC layout are determined based on the SEM images and the plurality of IC patterns. A summary of the design violations is provided for further characterization of the IC layout.

Abstract: A patient brace system and method of using the same are disclosed for treatment of lower extremity injuries. Described brace systems include a crutch, at least one crutch sensor, a patient brace, at least one controller, and a rehabilitation application. The crutch sensor(s) measure one or more crutch parameters. The controller(s) are operable to receive and process a signal(s) indicative of the crutch parameter(s) and produces patient gait data that, in turn, is communicated to a data hub. In some embodiments, the patient brace may also include at least one brace sensor configured to similarly communicate with the data hub. The rehabilitation application is communication with the data hub and determines a response output based on the information fed to the data hub, the application then communicating the response output to at least one of a caregiver, a user of the patient brace, and/or to the patient brace.

Abstract: A wearable brain multi-stimulation pain control device is provided, comprising a main support unit, an auxiliary support unit, an audio stimulation unit, and an optical frequency-flashed stimulation unit. The main support unit includes two ear portions corresponding to a user’s ears and a front side portion, and the auxiliary support unit includes a mounting portion. Two opposite ends of the mounting portion are pivoted to the main support unit, and the audio stimulation unit includes two speakers that are respectively arranged on the ear portions and can broadcast a binaural beats with frequency following response. The optical frequency-flashed stimulation unit is arranged on the front side portion and can stimulate at least one eye of the user with flickering light, so that the user can obtain multiple stimulations at the same time in a single course of treatment to achieve the effect of improving pain.

Abstract: A blood pressure lowering training device comprises a head frame unit corresponding to a user's head shape, an audio stimulation unit for broadcasting binaural beats with frequency following response to both ears of the user, a display unit including a display module for displaying a virtual image and blood pressure information and a blood pressure measurement module for measuring blood pressure, and a control unit electrically connected with the audio stimulation unit and the display unit, so that the hypertensive patient can perform a variety of adjustable blood pressure lowering training in one use process, and effectively improve the use intention of the hypertensive patient.

Abstract: A joint mobilization apparatus includes a pulling unit and a power unit. The pulling unit includes a wearable member set for mounting on the patient's joint part, and a rope set connected to the wearable member set. The power unit provides power of reciprocatingly pulling the rope set, and includes a shell member, a motor, and a reciprocation mechanism connected to the motor and the rope set. The reciprocation mechanism is driven by the motor to reciprocate relative to the shell member, so as to pull the rope set to reciprocate the wearable member set and patient's joint part. By using the power unit to drive the pulling unit to pull reciprocatingly for mobilizing the patient's joint part, instead of the therapist's treatment, the therapist's burden in physical strength can be reduced. Furthermore, the joint mobilization apparatus can provide the user to execute various muscle training modes.

Abstract: A joint mobilization apparatus includes a pulling unit and a power unit. The pulling unit includes a wearable member set for mounting on the patient's joint part, and a rope set connected to the wearable member set. The power unit provides power of reciprocatingly pulling the rope set, and includes a shell member, a motor, and a reciprocation mechanism connected to the motor and the rope set. The reciprocation mechanism is driven by the motor to reciprocate relative to the shell member, so as to pull the rope set to reciprocate the wearable member set and patient's joint part. By using the power unit to drive the pulling unit to pull reciprocatingly for mobilizing the patient's joint part, instead of the therapist's treatment, the therapist's burden in physical strength can be reduced. Furthermore, the joint mobilization apparatus can provide the user to execute various muscle training modes.

Abstract: An edge-emitting laser having a small vertical emitting angle includes an upper cladding layer, a lower cladding layer and an active region layer sandwiched between the upper and lower cladding layers. By embedding a passive waveguide layer within the lower cladding to layer, an extended lower cladding layer is formed between the passive waveguide layer and the active region layer. In addition, the refractive index (referred as n-value) of the passive waveguide layer is larger than the n-value of the extended lower cladding layer. The passive waveguide layer with a larger n-value would guide the light field to extend downward. The extended lower cladding layer can separate the passive waveguide layer and the active region layer and thus expand the near-field distribution of laser light field in the resonant cavity, so as to obtain a smaller vertical emitting angle in the far-field laser light field.

Abstract: An edge-emitting laser having a small vertical emitting angle includes an upper cladding layer, a lower cladding layer and an active region layer sandwiched between the upper and lower cladding layers. By embedding a passive waveguide layer within the lower cladding to layer, an extended lower cladding layer is formed between the passive waveguide layer and the active region layer. In addition, the refractive index (referred as n-value) of the passive waveguide layer is larger than the n-value of the extended lower cladding layer. The passive waveguide layer with a larger n-value would guide the light field to extend downward. The extended lower cladding layer can separate the passive waveguide layer and the active region layer and thus expand the near-field distribution of laser light field in the resonant cavity, so as to obtain a smaller vertical emitting angle in the far-field laser light field.

Abstract: An edge-emitting laser having a small vertical emitting angle includes an upper cladding layer, a lower cladding layer and an active region layer sandwiched between the upper and lower cladding layers. By embedding a passive waveguide layer within the lower cladding layer, an extended lower cladding layer is formed between the passive waveguide layer and the active region layer. In addition, the refractive index (referred as n-value) of the passive waveguide layer is larger than the n-value of the extended lower cladding layer. The passive waveguide layer with a larger n-value would guide the light field to extend downward. The extended lower cladding layer can separate the passive waveguide layer and the active region layer and thus expand the near-field distribution of laser light field in the resonant cavity, so as to obtain a smaller vertical emitting angle in the far-field laser light field.

Abstract: An electron beam drift detection device and a method for detecting electron beam drift are provided in which the method includes placing a predetermined characteristic identification pattern on a surface of a workpiece; emitting an electron beam, and focusing and deflecting the electron beam such that the focused and deflected electron beam scans the surface of the workpiece and the characteristic identification pattern; detecting backscattered electrons and secondary electrons; and receiving detection signals and performing an image process on the detection signals to obtain an electronic image of the characteristic identification pattern, and measuring a drift degree by comparing the electronic image with the predetermined shape of the characteristic identification pattern.

Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.

Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.

Abstract: The present invention discloses a method for fabricating a heat-resistant, humidity-resistant oxide-confined vertical-cavity surface-emitting laser (VCSEL) by slowing down the oxidizing rate during a VCSEL oxidation process to thereby reduce stress concentration of an oxidation layer and by preventing moisture invasion using a passivation layer disposed on a laser window. The VCSEL device thus fabricated is heat-resistant, humidity-resistant, and highly reliable. In a preferred embodiment, the oxidation process takes place at an oxidizing rate of less than 0.4 ?m/min, and the passivation layer is a SiON passivation layer.

Abstract: The present invention discloses a manufacturing method of vertical cavity surface emitting laser. The method includes following steps: providing a substrate; forming an epitaxial layer stack including an aluminum-rich layer; forming an ion-doping mask including a ring-shaped opening; doping ions in the epitaxial layer stack through the ring-shaped opening and forming a ring-shaped ion-doped region over the aluminum-rich layer; forming an etching mask on the ion-doping mask for covering the ring-shaped opening of the ion-doping mask; etching the epitaxial layer stack through the etching mask and ion-doping mask for forming an island platform; oxidizing the aluminum-rich layer for forming a ring-shaped oxidized region. In addition, the present invention also discloses a vertical cavity surface emitting laser manufactured by the above mentioned method.

Abstract: A system for testing electromagnetic characteristics of an electromagnetic steel sheet includes: a driving unit operable based on a non-sinusoidal wave control signal from a control unit and a floating voltage to output a control output; a power output unit operable based on the control output from the driving unit to output a voltage output at an output side coupled across a first winding wound around the electromagnetic steel sheet such that an exciting current flowing through the first winding is generated in response to the voltage output, thereby resulting in an induced voltage across a second winding wound around the electromagnetic steel sheet; and a measuring unit outputting to the control unit an output corresponding to the exciting current and the induced voltage measured thereby such that the control unit obtains the electromagnetic characteristics of the electromagnetic steel sheet based on the output.

Abstract: The present invention discloses a manufacturing method of vertical cavity surface emitting laser. The method includes following steps: providing a substrate; forming an epitaxial layer stack including an aluminum-rich layer; forming an ion-doping mask including a ring-shaped opening; doping ions in the epitaxial layer stack through the ring-shaped opening and forming a ring-shaped ion-doped region over the aluminum-rich layer; forming an etching mask on the ion-doping mask for covering the ring-shaped opening of the ion-doping mask; etching the epitaxial layer stack through the etching mask and ion-doping mask for forming an island platform; oxidizing the aluminum-rich layer for forming a ring-shaped oxidized region. In addition, the present invention also discloses a vertical cavity surface emitting laser manufactured by the above mentioned method.

Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.

Abstract: An electron beam drift detection device and a method for detecting electron beam drift are provided in which the method includes placing a predetermined characteristic identification pattern on a surface of a workpiece; emitting an electron beam, and focusing and deflecting the electron beam such that the focused and deflected electron beam scans the surface of the workpiece and the characteristic identification pattern; detecting backscattered electrons and secondary electrons; and detection signals; and receives the receiving detection signals and performs performing an image process on the detection signals to obtain an electronic image of the characteristic identification pattern, and measuring a drift degree by comparing the electronic image with the predetermined shape of the characteristic identification pattern.

Abstract: A dual wavelength laser device including a cap, a header, a first laser chip and a second laser chip. The cap includes a cap body and a lens embedded on the cap body. The header forms an accommodating space with the cap. The first laser chip is arranged in the accommodating space and emitting a first laser beam toward the lens. The second laser chip is arranged in the accommodating space and emitting a second laser beam toward the lens.

Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.