Patents by Inventor CHENG-KAI WANG

CHENG-KAI WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240356152
    Abstract: A battery module includes a housing, a cell set disposed inside the housing and at least one baffle assembly. The cell set and the housing defines at least one flame guiding channel. The baffle assembly is perpendicular to the flame guiding channel, and has at least slit communicating to the flame guiding channel, which generates routes of compression and expansion for cooling an airflow of a be expelled combustible gas.
    Type: Application
    Filed: April 18, 2024
    Publication date: October 24, 2024
    Inventors: Chia-Chun CHANG, Cheng-Chin CHOU, Chao-Kai WANG
  • Publication number: 20240355742
    Abstract: The present disclosure describes a method for the fabrication of ruthenium conductive structures over cobalt conductive structures. In some embodiments, the method includes forming a first opening in a dielectric layer to expose a first cobalt contact and filling the first opening with ruthenium metal to form a ruthenium contact on the first cobalt contact. The method also includes forming a second opening in the dielectric layer to expose a second cobalt contact and a gate structure and filling the second opening with tungsten to form a tungsten contact on the second cobalt contact and the gate structure. Further, the method includes forming a copper conductive structure on the ruthenium contact and the tungsten contact, where the copper from the copper conductive structure is in contact with the ruthenium metal from the ruthenium contact.
    Type: Application
    Filed: July 1, 2024
    Publication date: October 24, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Wei Chang, Chien-Shun Liao, Sung-Li Wang, Shuen-Shin Liang, Shu-Lan Chang, Yi-Ying Liu, Chia-Hung Chu, Hsu-Kai Chang
  • Publication number: 20240339497
    Abstract: A semiconductor device with dual side source/drain (S/D) contact structures and methods of fabricating the same are disclosed. The semiconductor device includes first and second S/D regions, a nanostructured channel region disposed between the first and second S/D regions, a gate structure surrounding the nanostructured channel region, first and second contact structures disposed on first surfaces of the first and second S/D regions, a third contact structure disposed on a second surface of the first S/D region, and an etch stop layer disposed on a second surface of the second S/D region. The third contact structure includes a metal silicide layer, a silicide nitride layer disposed on the metal silicide layer, and a conductive layer disposed on the silicide nitride layer.
    Type: Application
    Filed: June 18, 2024
    Publication date: October 10, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Wei Chang, Shuen-Shin Liang, Sung-Li Wang, Hsu-Kai Chang, Chia-Hung Chu, Chien-Shun Liao, Yi-Ying Liu
  • Publication number: 20240314998
    Abstract: A memory structure includes a pull-down transistor and a pull-up transistor stacked vertically in a Z-direction, a pass-gate transistor and a dummy transistor stacked vertically in the Z-direction, a dielectric structure, a connection structure, and a butt contact. The pull-down transistor and the pull-up transistor share a first gate structure. The pass-gate transistor and the dummy transistor share a second gate structure. The dielectric structure is between the first gate structure and the second gate structure in a Y-direction. The connection structure is over and electrically connected to the first gate structure and is over and electrically isolated from the second gate structure. The connection structure is an L-shape in a Y-Z cross-sectional view. The butt contact is directly over the connection structure and the second gate structure. The butt contact is electrically connected to the connection structure and a source/drain feature of the pass-gate transistor.
    Type: Application
    Filed: March 13, 2023
    Publication date: September 19, 2024
    Inventors: Cheng-Yin WANG, Szuya LIAO, Tsung-Kai CHIU, Shao-Tse HUANG, Ting-Yun WU, Wen-Yuan CHEN
  • Patent number: 12068252
    Abstract: The present disclosure describes a method for the fabrication of ruthenium conductive structures over cobalt conductive structures. In some embodiments, the method includes forming a first opening in a dielectric layer to expose a first cobalt contact and filling the first opening with ruthenium metal to form a ruthenium contact on the first cobalt contact. The method also includes forming a second opening in the dielectric layer to expose a second cobalt contact and a gate structure and filling the second opening with tungsten to form a tungsten contact on the second cobalt contact and the gate structure. Further, the method includes forming a copper conductive structure on the ruthenium contact and the tungsten contact, where the copper from the copper conductive structure is in contact with the ruthenium metal from the ruthenium contact.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: August 20, 2024
    Inventors: Cheng-Wei Chang, Chien-Shun Liao, Sung-Li Wang, Shuen-Shin Liang, Shu-Lan Chang, Yi-Ying Liu, Chia-Hung Chu, Hsu-Kai Chang
  • Publication number: 20240266335
    Abstract: An electronic package and the manufacturing method thereof are provided, in which a first electronic element and a second electronic element are disposed on a carrier structure, and the first electronic element and the second electronic element are electrically connected to each other by a wire. Therefore, by replacing some layers of the circuit layer of the carrier structure with the wire, the carrier structure can satisfy the functional signal transmission of the first and second electronic elements without configuring too many circuit layers, so as to shorten the process steps and time of the carrier structure, thereby effectively reducing the manufacturing cost of the electronic package.
    Type: Application
    Filed: May 2, 2023
    Publication date: August 8, 2024
    Inventors: Huan-Shiang LI, Yih-Jenn JIANG, Cheng-Kai CHANG, Wei-Son TSAI, Yi-Chieh WANG
  • Patent number: 12046634
    Abstract: A semiconductor device with dual side source/drain (S/D) contact structures and methods of fabricating the same are disclosed. The semiconductor device includes first and second S/D regions, a nanostructured channel region disposed between the first and second S/D regions, a gate structure surrounding the nanostructured channel region, first and second contact structures disposed on first surfaces of the first and second S/D regions, a third contact structure disposed on a second surface of the first S/D region, and an etch stop layer disposed on a second surface of the second S/D region. The third contact structure includes a metal silicide layer, a silicide nitride layer disposed on the metal silicide layer, and a conductive layer disposed on the silicide nitride layer.
    Type: Grant
    Filed: January 23, 2023
    Date of Patent: July 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Wei Chang, Shuen-Shin Liang, Sung-Li Wang, Hsu-Kai Chang, Chia-Hung Chu, Chien-Shun Liao, Yi-Ying Liu
  • Patent number: 12039093
    Abstract: An encrypted hard disk device is provided, including a near-field communication (NFC) sensing module, a processor, a storage unit, and a power switch. The NFC sensing module is configured to read a user identification (UID) of at least one sensor element. The processor is electrically connected to the NFC sensing module and the storage unit. The processor receives the UID and generates a control signal when the UID is approved. The power switch is electrically connected to the processor and the storage unit and maintains a conducting state according to the control signal and supplies power to the storage unit for accessing the storage unit.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: July 16, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Cheng-Yu Wang, Shao-Kai Liu, Yu-Hsiang Huang, Bo-Hua Yang
  • Patent number: 12002253
    Abstract: A feature point integration positioning system includes a moving object, an image input source, an analyzing module and a positioning module. The image input source is disposed at the moving object to shoot an environment for obtaining a sequential image dataset. The analyzing module includes a machine vision detecting unit configured to generate a plurality of first feature points in each of the images based on each of the images, a deep learning detecting unit configured to generate a plurality of second feature points in each of the images based on each of the images, and an integrating unit configured to integrate the first feature points and the second feature points in each of the images into a plurality of integrated feature points in each of the images. The positioning module confirms a position of the moving object relative to the environment at each of the time points.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: June 4, 2024
    Assignee: Automotive Research & Testing Center
    Inventors: Yu-Fang Wang, Yi-Jie Lin, Cheng-Kai Wang
  • Publication number: 20230169747
    Abstract: A feature point integration positioning system includes a moving object, an image input source, an analyzing module and a positioning module. The image input source is disposed at the moving object to shoot an environment for obtaining a sequential image dataset. The analyzing module includes a machine vision detecting unit configured to generate a plurality of first feature points in each of the images based on each of the images, a deep learning detecting unit configured to generate a plurality of second feature points in each of the images based on each of the images, and an integrating unit configured to integrate the first feature points and the second feature points in each of the images into a plurality of integrated feature points in each of the images. The positioning module confirms a position of the moving object relative to the environment at each of the time points.
    Type: Application
    Filed: November 29, 2021
    Publication date: June 1, 2023
    Inventors: Yu-Fang WANG, Yi-Jie LIN, Cheng-Kai WANG
  • Patent number: 11580666
    Abstract: A localization and mapping method is for localizing and mapping a moving apparatus in a moving process. The localization and mapping method includes an image capturing step, a feature point extracting step, a flag object identifying step, and a localizing and mapping step. The image capturing step includes capturing an image frame at a time point of a plurality of time points in the moving process by a camera unit. The flag object identifying step includes identifying whether the image frame includes a flag object among a plurality of the feature points in accordance with a flag database. The flag database includes a plurality of dynamic objects, and the flag object is corresponding to one of the dynamic objects. The localizing and mapping step includes performing localization and mapping in accordance with the image frames captured and the flag object thereof in the moving process.
    Type: Grant
    Filed: November 26, 2020
    Date of Patent: February 14, 2023
    Assignee: Automotive Research & Testing Center
    Inventors: Hung-Pang Lin, Cheng-Kai Wang
  • Publication number: 20220164982
    Abstract: A localization and mapping method is for localizing and mapping a moving apparatus in a moving process. The localization and mapping method includes an image capturing step, a feature point extracting step, a flag object identifying step, and a localizing and mapping step. The image capturing step includes capturing an image frame at a time point of a plurality of time points in the moving process by a camera unit. The flag object identifying step includes identifying whether the image frame includes a flag object among a plurality of the feature points in accordance with a flag database. The flag database includes a plurality of dynamic objects, and the flag object is corresponding to one of the dynamic objects. The localizing and mapping step includes performing localization and mapping in accordance with the image frames captured and the flag object thereof in the moving process.
    Type: Application
    Filed: November 26, 2020
    Publication date: May 26, 2022
    Inventors: Hung-Pang LIN, Cheng-Kai WANG
  • Patent number: 11010927
    Abstract: A method and a system for generating dynamic map information with environment information are provided, wherein the system includes a cloud server, multiple relay hosts distributed around the environment and multiple vehicle devices each installed respectively in different vehicles. Each vehicle device includes a LiDAR sensor and a camera for sensing the environment to respectively generate point cloud data and image data. When the point cloud data from different vehicles are transmitted to a neighboring relay host, the relay host performs a multi-vehicle data integration mode to merge the point cloud data and obtain 3D coordinates information of objects in the environment according to the merged data. Based on the 3D coordinates information of objects, the cloud server generates and transmits dynamic map information to the vehicles. By sharing sensing data of different vehicles, the sensing area of each vehicle is expanded to mitigate dark zones or blind zones.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: May 18, 2021
    Assignee: AUTOMOTIVE RESEARCH & TESTING CENTER
    Inventors: Hsuan-Ta Lin, Cheng-Kai Wang, Chun-Yao Shih
  • Publication number: 20210118183
    Abstract: A method and a system for generating dynamic map information with environment information are provided, wherein the system includes a cloud server, multiple relay hosts distributed around the environment and multiple vehicle devices each installed respectively in different vehicles. Each vehicle device includes a LiDAR sensor and a camera for sensing the environment to respectively generate point cloud data and image data. When the point cloud data from different vehicles are transmitted to a neighboring relay host, the relay host performs a multi-vehicle data integration mode to merge the point cloud data and obtain 3D coordinates information of objects in the environment according to the merged data. Based on the 3D coordinates information of objects, the cloud server generates and transmits dynamic map information to the vehicles. By sharing sensing data of different vehicles, the sensing area of each vehicle is expanded to mitigate dark zones or blind zones.
    Type: Application
    Filed: October 16, 2019
    Publication date: April 22, 2021
    Applicant: AUTOMOTIVE RESEARCH & TESTING CENTER
    Inventors: Hsuan-Ta LIN, Cheng-Kai WANG, Chun-Yao SHIH
  • Patent number: 9201530
    Abstract: A touch panel includes first electrodes, second electrodes, first conductive lines, second conductive lines and a conductive particle layer. The first and second electrodes are respectively formed on an upper surface of a first transparent substrate and a bottom surface of a second transparent substrate. The upper surface is adhered to the bottom surface. The first and second conductive lines are formed on a periphery area of the upper surface, and the first conductive lines are electrically connected to the first electrodes. The conducting particle layer, disposed between the first and the second transparent substrate, includes conducting particles, which are electrically connected to the second conductive lines and the second electrodes.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: December 1, 2015
    Assignee: Henghao Technology Co. Ltd.
    Inventor: Cheng-Kai Wang
  • Patent number: 9110530
    Abstract: Configurations of patterns on a touch panel and methods thereof are proposed. The proposed pattern uses a design unparallel to either one of the X axis and the Y axis of a black matrix of a pixel layout of an LCD panel to resolve the Moiré Phenomenon resulting from the interference between the touch panel and the pixel layout.
    Type: Grant
    Filed: December 16, 2013
    Date of Patent: August 18, 2015
    Assignee: Henghao Technology Co., Ltd.
    Inventors: Cheng-Kai Wang, Wei-Wen Wang
  • Publication number: 20150227243
    Abstract: Configurations of a touch panel having a dummy area and a space area, and methods thereof are disclosed. The proposed touch panel includes the dummy area having a first width and the space area having a second width, wherein the second width and the first width have a ratio being no larger than 0.2.
    Type: Application
    Filed: June 24, 2014
    Publication date: August 13, 2015
    Inventors: Cheng-Kai Wang, Pei-Chen Tang, Wei-Wen Wang
  • Publication number: 20150055029
    Abstract: A touch panel includes first electrodes, second electrodes, first conductive lines, second conductive lines and a conductive particle layer. The first and second electrodes are respectively formed on an upper surface of a first transparent substrate and a bottom surface of a second transparent substrate. The upper surface is adhered to the bottom surface. The first and second conductive lines are formed on a periphery area of the upper surface, and the first conductive lines are electrically connected to the first electrodes. The conducting particle layer, disposed between the first and the second transparent substrate, includes conducting particles, which are electrically connected to the second conductive lines and the second electrodes.
    Type: Application
    Filed: November 4, 2013
    Publication date: February 26, 2015
    Applicant: HengHao Technology Co., Ltd.
    Inventor: CHENG-KAI WANG
  • Publication number: 20150015498
    Abstract: Configurations of patterns on a touch panel and methods thereof are proposed. The proposed pattern uses a design unparallel to either one of the X axis and the Y axis of a black matrix of a pixel layout of an LCD panel to resolve the Moiré Phenomenon resulting from the interference between the touch panel and the pixel layout.
    Type: Application
    Filed: December 16, 2013
    Publication date: January 15, 2015
    Applicant: Henghao Technology Co., Ltd.
    Inventors: Cheng-Kai Wang, Wei-Wen Wang
  • Patent number: 8934093
    Abstract: The invention relates to a crystal fiber, a Raman spectrometer using the same and a inspection method thereof. The crystal fiber comprises a sapphire crystal is doped with two transition metals having different concentrations. An excitation light beam at a specific wavelength can propagate along the crystal fiber to generate a narrow-band light beam and a wide-band light beam to project on a specimen. Raman scattered light is emitted from the specimen. The wavelength of the Raman scattered light falls within the wavelength range of the wide-band light beam so that the wide-band light beam is enhanced at some characteristic wavelengths to facilitate Raman spectroscopy.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: January 13, 2015
    Assignee: National Taiwan University
    Inventors: Pi Ling Huang, Kuang-Yu Hsu, Cheng-Kai Wang, Edmund Sun, Sheng-Lung Huang