Abstract: A light emitting device package structure includes a substrate, a plurality of light emitting chips, a diffusion glue layer, a patterned masking colloid, and a transparent protective layer. The substrate has a bearing surface. The p light emitting chips are arranged and disposed on the bearing surface and electrically connected to the substrate. The light emitting chips compose an arrangement pattern. The diffusion glue layer is disposed on the bearing surface and covers the light emitting chips. The patterned masking colloid is formed on the diffusion glue layer. The patterned masking colloid at least corresponds to the arrangement pattern of the plurality of light emitting chips and is located directly above the plurality of light emitting chips. The transparent protective layer is disposed on the diffusion glue layer and covers the patterned masking colloid. A manufacturing method of a light emitting element package structure is also provided.