Abstract: An apparatus for automated wafer carrier handling includes a base plate and an active expansion component movably coupled to the base plate. The active expansion component is configured to change from a contracted form to an expanded form so as to be engaged with a top flange mounted on a wafer carrier.

Abstract: An image analysis device may align an image to determine a position of a wafer within the image. The wafer may include a plurality of wafer bumps. The image analysis device may mask, based on the position of the wafer, the image to obtain an image of a portion of the wafer. The image analysis device may binarize the image of the portion of the wafer to create a binarized image of the portion of the wafer. The image analysis device may determine a bump pattern, associated with the plurality of wafer bumps, based on the binarized image of the portion of the wafer. The image analysis device may perform a defect analysis of the determined bump pattern. The defect analysis may be associated with detecting regions of the portion of the wafer in which one or more wafer bumps have abnormal bump heights.

Abstract: An apparatus and an operating method for automated wafer carrier handling are provided. The operation method includes bring a base frame and an engaging mechanism of an automated wafer carrier handling apparatus into abutting contact with a top flange mounted on a wafer carrier to limit at least one degree of freedom of movement of the top flange, where the engaging mechanism is disposed on the base frame; transporting the wafer carrier to a destination location by the automated wafer carrier handling apparatus; and releasing the top flange mounted on the wafer carrier from the automated wafer carrier handling apparatus at the destination location.

Abstract: A fixture for clamping a workpiece is disclosed. The fixture includes a supporting stand and an elastic contacting assembly. The supporting stand has a first accommodating space and a plural of fixing portions. The elastic contacting assembly is disposed in a corner of the supporting stand. The elastic contacting assembly includes a cylinder, a pushing block driven by the cylinder and moved toward the first accommodating space to lean against the workpiece, and an elastic component disposed between the cylinder and the pushing block. Thereby, an elastic pushing force will be provided to the workpiece for positioning the workpiece, and there will be no damages to the workpiece.