Patents by Inventor Cheng Kangguo

Cheng Kangguo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for forming a buried plate
    Patent number: 7041553
    Abstract: A method of making a buried plate region in a semiconductor substrate is provided. A trench is formed in a semiconductor substrate, the trench having a trench sidewall, the sidewall including an upper portion, and a lower portion disposed below the upper portion. A liner is formed along at least a portion of the trench sidewall, and thereafter, a dopant source layer is formed over the liner along the lower portion of the trench sidewall. The semiconductor substrate is then annealed to drive a dopant into the semiconductor substrate adjacent to the lower portion of the trench sidewall, while preventing the dopant from being driven into the semiconductor substrate adjacent to the upper portion of the trench sidewall.
    Type: Grant
    Filed: June 2, 2004
    Date of Patent: May 9, 2006
    Assignee: International Business Machines Corporation
    Inventors: Cheng Kangguo, Ramachandra Divakaruni
  • IMPROVED PROCESS FOR FORMING A BURIED PLATE
    Publication number: 20050272201
    Abstract: A method of making a buried plate region in a semiconductor substrate is provided. A trench is formed in a semiconductor substrate, the trench having a trench sidewall, the sidewall including an upper portion, and a lower portion disposed below the upper portion. A liner is formed along at least a portion of the trench sidewall, and thereafter, a dopant source layer is formed over the liner along the lower portion of the trench sidewall. The semiconductor substrate is then annealed to drive a dopant into the semiconductor substrate adjacent to the lower portion of the trench sidewall, while preventing the dopant from being driven into the semiconductor substrate adjacent to the upper portion of the trench sidewall.
    Type: Application
    Filed: June 2, 2004
    Publication date: December 8, 2005
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Cheng Kangguo, Ramachandra Divakaruni