Patents by Inventor Cheng Kim

Cheng Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10565487
    Abstract: Embodiments of the invention provide an integrated chip (IC) module having contact pads which are accessible by single-bond holes and module-side antenna contact pads which are accessible by multi-bond holes. Each multi-bond hole is apportioned by an encapsulation into adjoining bonding channels for separately receiving wire bond(s) and antenna-connecting element. Each module-side antenna contact pad is apportioned by the encapsulation into adjoining but electrically connected bonding areas to allow establishment of electrical connection of both wire bond(s) and antenna-connecting element to an IC chip. The first and the second bonding area are partitioned from each other, by the encapsulant, without requiring a presence of substrate therebetween.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: February 18, 2020
    Assignee: SMARTFLEX TECHNOLOGY PTE LTD
    Inventors: Eng Seng Ng, Sze Yong Pang, Cheng Kim Heng
  • Publication number: 20190294943
    Abstract: Embodiments of the invention provide an integrated chip (IC) module having contact pads which are accessible by single-bond holes and module-side antenna contact pads which are accessible by multi-bond holes. Each multi-bond hole is apportioned by an encapsulation into adjoining bonding channels for separately receiving wire bond(s) and antenna-connecting element. Each module-side antenna contact pad is apportioned by the encapsulation into adjoining but electrically connected bonding areas to allow establishment of electrical connection of both wire bond(s) and antenna-connecting element to an IC chip. The first and the second bonding area are partitioned from each other, by the encapsulant, without requiring a presence of substrate therebetween.
    Type: Application
    Filed: February 15, 2018
    Publication date: September 26, 2019
    Inventors: Eng Seng Ng, Sze Yong Pang, Cheng Kim Heng
  • Patent number: 5752229
    Abstract: The detection and cancellation of echo in a communications system is enhanced by taking advantage of the accumulated knowledge relating to the echo path delay that an adaptive filter acquires as a result of its adaptation process. Such knowledge improves significantly the ability of an associated Near-End-Speech (NES) detector to detect for the presence of near end speech.
    Type: Grant
    Filed: June 28, 1996
    Date of Patent: May 12, 1998
    Assignee: Lucent Technologies Inc.
    Inventors: Donald Lars Duttweiler, Toshiro Kawahara, Cheng Kim, Toshio Miki
  • Patent number: 5668865
    Abstract: The detection of echo is enhanced using a coarse near-end speech detector at a Y-side of an echo canceler and using a more accurate near-end speech detector at the E-side of the echo canceler, such that the latter detector uses a representation of far-end speech and a threshold value to determine if the magnitude of the echo canceler output is larger than that of an echo signal only. If it is, and there is an absence of an indication of the presence of near-end speech from the coarse detector, then the more accurate speech detector adjusts the value of the threshold in a first direction, otherwise it adjusts the threshold in a second direction, to more "finely tone" such accuracy.
    Type: Grant
    Filed: February 26, 1996
    Date of Patent: September 16, 1997
    Assignee: Lucent Technologies Inc.
    Inventors: Donald Lars Duttweiler, Cheng Kim, Ying Get Tao