Abstract: An optical sensor including a substrate and a plurality of pixel units are provided. The pixel units are disposed on the substrate, and each of the pixel units includes a light source element, a light sensor element, a circuit unit, and an isolation element. Herein, the light source element emits light, the light sensor element senses an optical image. The circuit unit is configured to drive the light source element to emit light and to drive the light sensor element to sense the optical image. The isolation element isolates the light sensor element from the light source element. In addition, the light source element is disposed between the isolation element of the respective pixel unit and an isolation element of a neighboring pixel unit.

Abstract: An optical sensor including a substrate and a plurality of pixel units are provided. The pixel units are disposed on the substrate, and each of the pixel units includes a light source element, a light sensor element, a circuit unit, and an isolation element. Herein, the light source element emits light, the light sensor element senses an optical image. The circuit unit is configured to drive the light source element to emit light and to drive the light sensor element to sense the optical image. The isolation element isolates the light sensor element from the light source element. In addition, the light source element is disposed between the isolation element of the respective pixel unit and an isolation element of a neighboring pixel unit.

Abstract: A gesture determination method is utilized for an electronic device. The gesture determination method includes executing a program, determining a gesture content supported by the program to obtain a supporting gesture content, detecting and determining ambient light intensity around the electronic device to generate a light intensity determination result, deciding a first sensing process or a second sensing process to perform sensing and determining a gesture for operating the program according to the operating gesture content and the light intensity determination result.

Abstract: A pointing device includes two lenses with wide and narrow view angles respectively. In a short distance range, the pointing device utilizes the lens with wide view angle to increase visible range. In a long distance range, the pointing device utilizes the lens with narrow view angle to increase size of a formed image of a reference point. In addition, the pointing device senses images through both of the lenses with wide and narrow view angles to obtain rotational information. The pointing device can provide not only positional information but also angular information.

Abstract: A control device for an image display includes at least two reference points, a modulation unit and a remote controller. The modulation unit modulates the light of a predetermined spectrum generated by the reference points with a brightness variation cycle. The modulation unit controls the reference points to emit the light with a first brightness within a first period of the brightness variation cycle and to emit the light with a second brightness within a second period of the brightness variation cycle, wherein the first brightness and the second brightness are not zero gray level. The remote controller captures the light of the predetermined spectrum with a sampling cycle and demodulates an image variation of the reference points with respect to the remote controller. The present invention further provides a control method for an image display.

Abstract: A pointing device includes two lenses with wide and narrow view angles respectively. In a short distance range, the pointing device utilizes the lens with wide view angle to increase visible range. In a long distance range, the pointing device utilizes the lens with narrow view angle to increase size of a formed image of a reference point. In addition, the pointing device senses images through both of the lenses with wide and narrow view angles to obtain rotational information. The pointing device can provide not only positional information but also angular information.

Abstract: A control device of a temperature controller, for adjusting the temperature of an environment having at least one active object, includes a first image sensor, a second image sensor, a process unit and a control unit. The first image sensor is for capturing a first image containing the image of the active object. The second image sensor is for capturing a second image containing the image of the active object. The process unit calculates a distance between the active object and the temperature controller according to the first and second images. The control unit controls an operational status of the temperature controller according to the distance calculated by the process unit. The present invention further provides a control method of a temperature controller.

Abstract: A control device for an image display includes at least two reference points, a modulation unit and a remote controller. The modulation unit modulates the light of a predetermined spectrum generated by the reference points with a brightness variation cycle. The modulation unit controls the reference points to emit the light with a first brightness within a first period of the brightness variation cycle and to emit the light with a second brightness within a second period of the brightness variation cycle, wherein the first brightness and the second brightness are not zero gray level. The remote controller captures the light of the predetermined spectrum with a sampling cycle and demodulates an image variation of the reference points with respect to the remote controller. The present invention further provides a control method for an image display.

Abstract: An electronic apparatus with a virtual data input device includes a first body, a second body, a sensing plane, an image sensing module and a processor. A display is disposed on the second body. The sensing plane is disposed on the first body and configured for generating an initiating signal when a user presses the sensing plane. The image sensing module is disposed on the second body and configured for sensing the pressing action on the sensing plane by the user and generating an image signal that carries the information of the pressed position on the sensing plane. The processor is electrically connected with the sensing plane and the image sensing module, and configured for processing the image signal after the initiating signal is generated so that data corresponding to the pressing action of the user is input to the electronic apparatus.

Abstract: A control device of a temperature controller, for adjusting the temperature of an environment having at least one active object, includes a first image sensor, a second image sensor, a process unit and a control unit. The first image sensor is for capturing a first image containing the image of the active object. The second image sensor is for capturing a second image containing the image of the active object. The process unit calculates a distance between the active object and the temperature controller according to the first and second images. The control unit controls an operational status of the temperature controller according to the distance calculated by the process unit.

Abstract: A camera module is provided. The camera module comprises: a lens; a holder having a lower portion, the holder holding the lens; a circuit board; and an image sensing and processing unit including an image sensing device and an optional signal processing device stacked on and electrically connected to the image sensing device, the image sensing and processing unit being packaged on one side of the circuit board; wherein the holder is fixed on the circuit board, the image sensing and processing unit inside the lower portion of the holder. Further, if the circuit board is a flexible circuit board, then a hard plate can be disposed on the other side of the flexible PCB corresponding to the image sensing and processing unit in order to enhance the mechanical strength.

Abstract: The present invention provides a method for fabricating a quad flat no-lead package structure, comprising a chip carrier and at least a chip. The chip is disposed on the top surface of the chip carrier, while the back surface of the chip carrier includes a plurality of flat no-lead conductive leads as I/O pads of the chip carrier for the external circuitry. A plurality of pads, corresponding to bonding pads of the chip, is disposed on the top surface of the chip carrier. The aforementioned package structure can employ wiring bonding technology, flip chip technology or surface mount technology to attach the chip to the chip carrier.

Abstract: A camera module is provided. The camera module comprises: a holder having an upper portion, a lower portion, and a bottom; a lens member held on the upper portion of the holder; a hinge disposed on the bottom of the holder; a cover coupled to the hinge and to the bottom of the holder, the cover being allowed to open and close to cover the bottom of the holder, the cover and the lower portion of the holder forming a space; and an image sensing and processing device disposed on the cover, wherein when the cover is close, the space can accommodate the image sensing and processing device.

Abstract: The present invention provides a QFN package structure, comprising a chip carrier and at least a chip. The chip is disposed on the top surface of the chip carrier, while the back surface of the chip carrier includes a plurality of flat no-lead conductive leads as I/O pads of the chip carrier for the external circuitry. A plurality of pads, corresponding to bonding pads of the chip, is disposed on the top surface of the chip carrier. The aforementioned package structure can employ wiring bonding technology, flip chip technology or surface mount technology to attach the chip to the chip carrier.

Abstract: An image sensor including an image sensing device layer, a silicon-on-insulator (SOI) layer, an optical device array and a substrate is provided. The SOI layer has a first surface and a second surface. The image sensing device layer is formed on the first surface of the SOI layer. The optical device array is formed on the second surface of the SOI layer. The substrate is disposed above the second surface of the SOI layer; the optical device array is disposed between the substrate and the SOI layer. An incident light coming from the outside environment, passes through the optical device array and the SOI layer, and is received by sensing devices formed in the image sensing device layer. In this manner, the probability of absorption or reflection of the incident light is reduced. Therefore, the sensing performance and the yield of the image sensor of the present invention is improved.

Abstract: A process for fabricating a semiconductor device is provided. The process integrates a cutting film process into the front-end of semiconductor process. The cutting film is directly formed on the curved surface of the micro-lens or a passivation layer is formed on the micro-lens before covering the passivation layer with the cutting film. In addition to micro-particle contamination due to sawing, the process is able to simplify chip packaging and reduce the size of a photosensitive module.

Abstract: The present invention provides a method for fabricating a quad flat no-lead package structure, comprising a chip carrier and at least a chip. The chip is disposed on the top surface of the chip carrier, while the back surface of the chip carrier includes a plurality of flat no-lead conductive leads as I/O pads of the chip carrier for the external circuitry. A plurality of pads, corresponding to bonding pads of the chip, is disposed on the top surface of the chip carrier. The aforementioned package structure can employ wiring bonding technology, flip chip technology or surface mount technology to attach the chip to the chip carrier.

Abstract: An image sensor comprising an image sensing device layer, a silicon-on-insulator (SOI) layer, an optical device array and a substrate is provided. The SOI layer has a first surface and a second surface. The image sensing device layer is formed on the first surface of the SOI layer. The optical device array is formed on the second surface of the SOI layer. The substrate is disposed above the second surface of the SOI layer and the optical device array is disposed between the substrate and the SOI layer. An incident light coming from the outside environment, passes through the optical device array and the SOI layer, and is received by sensing devices formed in the image sensing device layer. In this manner, the probability of absorption or reflection of the incident light is reduced. Therefore, the sensing performance and the yield of the image sensor of the present invention is improved.

Abstract: An image sensor comprising an image sensing device layer, a silicon-on-insulator (SOI) layer, an optical device array and a substrate is provided. The SOI layer has a first surface and a second surface. The image sensing device layer is formed on the first surface of the SOI layer. The optical device array is formed on the second surface of the SOI layer. The substrate is disposed above the second surface of the SOI layer and the optical device array is disposed between the substrate and the SOI layer. An incident light coming from the outside environment, passes through the optical device array and the SOI layer, and is received by sensing devices formed in the image sensing device layer. In this manner, the probability of absorption or reflection of the incident light is reduced. Therefore, the sensing performance and the yield of the image sensor of the present invention is improved.

Abstract: A chip on photosensitive device package structure is provided. The package mainly comprises a photosensitive device, a transparent plate and a chip. The photosensitive device has an illumination area and a non-illumination area. The transparent plate has a first surface and a corresponding second surface. The transparent plate is set over the photosensitive device with the first surface covering both the illumination area and the non-illumination area. The chip is set on the second surface of the transparent plate above the non-illumination area of the photosensitive device.