Patents by Inventor Cheng-Lay ANG

Cheng-Lay ANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical sensor package including a cavity formed in an image sensor die
    Patent number: 10749067
    Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: August 18, 2020
    Assignee: STMICROELECTRONICS PTE LTD
    Inventors: Loic Pierre Louis Renard, Cheng-Lay Ang
  • OPTICAL SENSOR PACKAGE INCLUDING A CAVITY FORMED IN AN IMAGE SENSOR DIE
    Publication number: 20190288155
    Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.
    Type: Application
    Filed: June 4, 2019
    Publication date: September 19, 2019
    Inventors: Loic Pierre Louis RENARD, Cheng-Lay ANG
  • Optical sensor package including a cavity formed in an image sensor die
    Patent number: 10347786
    Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: July 9, 2019
    Assignee: STMICROELECTRONICS PTE LTD
    Inventors: Loic Pierre Louis Renard, Cheng-Lay Ang
  • OPTICAL SENSOR PACKAGE INCLUDING A CAVITY FORMED IN AN IMAGE SENSOR DIE
    Publication number: 20180151772
    Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.
    Type: Application
    Filed: January 25, 2018
    Publication date: May 31, 2018
    Inventors: Loic Pierre Louis RENARD, Cheng-Lay ANG
  • Optical sensor package including a cavity formed in an image sensor die
    Patent number: 9911890
    Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: March 6, 2018
    Assignee: STMICROELECTRONICS PTE LTD
    Inventors: Loic Pierre Louis Renard, Cheng-Lay Ang
  • OPTICAL SENSOR PACKAGE INCLUDING A CAVITY FORMED IN AN IMAGE SENSOR DIE
    Publication number: 20180006182
    Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.
    Type: Application
    Filed: June 30, 2016
    Publication date: January 4, 2018
    Inventors: Loic Pierre Louis RENARD, Cheng-Lay ANG