Abstract: A two stage quick-release structure includes a first tubing member, a second tubing member, a first pivoting portion, a first buckling portion, an elastic hook and a safety fastener. When the user assembles the foldable bicycle for bicycling, the first tubing member is rotated to connect with the second tubing member via the first pivoting portion, so that the elastic hook correspondingly buckles with the first buckling portion to form a first stage buckle; then, the safety fastener is rotated to correspondingly buckle with the elastic hook so as to form a second stage buckle. The two stage buckle contributes the assembling of the foldable bicycle with ease and convenience. Furthermore, via the two stage buckle structures, the connection between the front bicycle frame body and the rear bicycle frame body are tightly secured.

Abstract: A two stage quick-release structure includes a first tubing member, a second tubing member, a first pivoting portion, a first buckling portion, an elastic hook and a safety fastener. When the user assembles the foldable bicycle for bicycling, the first tubing member is rotated to connect with the second tubing member via the first pivoting portion, so that the elastic hook correspondingly buckles with the first buckling portion to form a first stage buckle; then, the safety fastener is rotated to correspondingly buckle with the elastic hook so as to form a second stage buckle. The two stage buckle contributes the assembling of the foldable bicycle with ease and convenience. Furthermore, via the two stage buckle structures, the connection between the front bicycle frame body and the rear bicycle frame body are tightly secured.

Abstract: A method for manufacturing a semiconductor device includes providing a substrate having at least a gate structure formed thereon, forming LDDs in the substrate respectively at two side of the gate structure and a spacer at sidewalls of the gate structure, forming a source/drain in the substrate at two side of the gate structure, performing ant etching process to form recesses respectively in the source/drain, forming a barrier layer in the recesses; and performing a salicide process.

Abstract: To make an alternating current (AC) stress test easier to perform in a wafer, an AC stress test circuit for performing the AC stress test on a test device fabricated in a test region of the wafer includes an oscillator module fabricated in the test region, a diode module fabricated in the test region coupled to an output of the oscillator module, and a select transistor fabricated in the test region having a gate terminal coupled to an output of the diode module, a second terminal coupled to a gate of the test device, and a third terminal coupled to a test voltage source.

Abstract: A yield enhancement system has a fabrication line with semiconductor fabrication devices for fabricating a wafer, an inspection and measurement monitoring system coupled to the fabrication line for determining process data corresponding to semiconductor fabrication devices, and a post-process testing line coupled to the fabrication line for performing in-line wafer-level testing. The post-process testing line includes a wafer acceptance tester, a yield monitor coupled to the wafer acceptance tester, and a wafer level reliability tester coupled to the wafer acceptance tester for estimating a life span of a device on the wafer.

Abstract: A motor operation noise elimination circuit of a portable multimedia player is provided, in which a first sound sensor is utilized to sense a first sound signal generated by motor operation during recording and a second sound signal input in the portable multimedia player for recording. Then the first sound signal sensed by the second sound sensor is phase-reversed in the noise elimination unit and is combined into the first and second sound signals sensed by the first sound sensor during recording, comprising: a second sound sensor, used to sense a first sound signal generated by the motor, and a noise elimination unit, used to receive the first and second sound signals sensed by the first sound sensor, and the first sound signal sensed by the second sound sensor, then a combination operation is executed, thus eliminating the first sound signal and outputting the second sound signal.