Patents by Inventor Cheng Li

Cheng Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230071180
    Abstract: The invention refers to negative electrode plate, preparation method thereof and electrochemical device. The negative electrode plate comprises: a negative current collector, a negative active material layer, and an inorganic dielectric layer which are provided in a stacked manner; the negative active material layer comprises opposite first surface and second surface, wherein the first surface is disposed away from the negative current collector; the inorganic dielectric layer is disposed on the first surface of the negative active material layer and consists of an inorganic dielectric material. The negative electrode plate provided by the application is useful in an electrochemical device, and can result in an electrochemical device having simultaneously excellent safety performance and cycle performance.
    Type: Application
    Filed: October 12, 2022
    Publication date: March 9, 2023
    Applicant: Contemporary Amperex Technology Co., Limited
    Inventors: Cheng LI, Changliang SHENG, Huafeng HUANG, Qisen Huang
  • Publication number: 20230069502
    Abstract: A system and network devices for packet processing, a network device including a processor and instructions for receiving a first packet sent by a second network node, the first packet including a format of a segment identifier of the second network node describing a length and a location of each field in the segment identifier, obtaining the format based on the first packet, the segment identifier having a first field, and including a determined value of the first field in the segment identifier in a second packet sent to the second network node, the value of the first field in the segment identifier being determined based on a segment routing policy and the format, and the determined value of the first field indicating to the second network node to process the second packet.
    Type: Application
    Filed: November 7, 2022
    Publication date: March 2, 2023
    Inventors: Cheng Li, Guoyi Chen
  • Publication number: 20230061855
    Abstract: An obstacle avoidance method for a robot arm is provided, including a modeling step, a collecting and evaluating coordinates step, an obtaining control parameter step, an establishing an occupation function step, and a finding an obstacle avoiding posture step. The present invention pre-stores the data obtained in performing the modeling step, the step of collecting and evaluating coordinates, the step of obtaining control parameter, and the step of establishing the occupation function into a database, thereby allowing the robot arm to quickly evaluate whether a collision behavior will occur in subsequent execution of a task. If a collision will occur, the robot arm executes the step of the finding the obstacle avoiding posture to dodge obstacles. The invention uses a non-contact approach for anti-collision design, which can improve the shortcomings faced by the existing contact type anti-collision design.
    Type: Application
    Filed: September 14, 2021
    Publication date: March 2, 2023
    Inventors: Po Ting Lin, Chao Yi Lin, Shih Wei Lin, Kun Cheng Li, Chang Yun Yang, Pei Fen Wu, Shun Chien Lan
  • Patent number: 11594419
    Abstract: A method for reducing wiggling in a line includes forming a silicon patterning layer over a substrate and depositing a mask layer over the silicon patterning layer. The mask layer is patterned to form one or more openings therein. The mask layer is thinned and the one or more openings are widened, to provide a smaller height-to-width ratio. The pattern of the mask layer is then used to pattern the silicon patterning layer. The silicon patterning layer is used, in turn, to pattern a target layer where a metal line will be formed.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: February 28, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jiann-Horng Lin, Cheng-Li Fan, Chih-Hao Chen
  • Patent number: 11587966
    Abstract: A fingerprint acquisition apparatus includes a plurality of photoelectric conversion units and a first shading pattern. The first shading pattern includes at least one first shading block including a first opening, and an orthographic projection of the first opening in the first shading block on the base substrate is within an orthographic projection of a target photoelectric conversion unit corresponding to the first shading block on the base substrate.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: February 21, 2023
    Assignees: Beijing BOE Sensor Technology Co., LTD, BOE Technology Group Co., LTD.
    Inventors: Yajie Feng, Cheng Li, Yue Geng, Kuiyuan Wang, Chaoyang Qi, Yi Dai, Zefei Li
  • Publication number: 20230037293
    Abstract: Systems and systems for hybrid centralized distributive scheduling and conflict resolution of multiple scheduler instances that share physical resources in a cloud computing system. The cloud computing system includes a plurality of scheduler instances, a global resource manager (GRM) for high-level resource management and conflict resolution for the scheduler instances, and a plurality of physical hosts. Each physical host has a respective local resource manager (LRM). The scheduler instances are responsible for initially processing of scheduling and resource allocation for resource requests, and proposing candidate physical hosts (and respective resource allocation) for the resource requests to the GRM. The GRM is responsible for conflict resolution through its general conflict resolvers of filtering, sorting and counting. The GRM decides which physical hosts among the candidate physical hosts will run the runtime instances of the resource requests after resolving conflicts among the scheduler instances.
    Type: Application
    Filed: October 14, 2022
    Publication date: February 9, 2023
    Inventors: Zhenhua Hu, Lei GUO, Jun WANG, Rui LUO, Feng WANG, Cheng LI
  • Patent number: 11574438
    Abstract: A method and system for generating a three-dimensional (3D) virtual scene are disclosed. The method includes: identifying a two-dimensional (2D) object in a 2D picture and the position of the 2D object in the 2D picture; obtaining the three-dimensional model of the 3D object corresponding to the 2D object; calculating the corresponding position of the 3D object corresponding to the 2D object in the horizontal plane of the 3D scene according to the position of the 2D object in the picture; and simulating the falling of the model of the 3D object onto the 3D scene from a predetermined height above the 3D scene, wherein the position of the landing point the model of the 3D object in the horizontal plane is the corresponding position of the 3D object in the horizontal plane of the 3D scene.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: February 7, 2023
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hao Chen, Guo Qiang Hu, Qi Cheng Li, Li Jun Mei, Jian Wang, Yi Min Wang, Zi Yu Zhu
  • Patent number: 11570285
    Abstract: A packet processing method, a network node, and a system includes obtaining, by a first network node, a first packet that includes a segment list, where the segment list includes a segment identifier of a network node on a path used to forward the first packet, obtaining, by the first network node, a segment identifier of a second network node from the segment list, where the second network node is a next-hop segment node of the first network node on the path, replacing, by the first network node, a destination address of the first packet with the segment identifier of the second network node, and adding a network performance parameter of the first network node to the segment list to generate a second packet, and sending, by the first network node, the second packet to the second network node.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: January 31, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Cheng Li, Guoyi Chen
  • Patent number: 11567809
    Abstract: Methods and systems for deploying images to computing systems include predicting an environment for a plurality of processing nodes. Image deployment to the plurality of processing nodes is simulated to determine a subset of the plurality of processing nodes for deployment. One or more images is pre-loaded to the subset of the plurality of processing nodes in advance of a deployment time.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: January 31, 2023
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Yuan Wang, Guang Cheng Li, Jing Min Xu, Xiao Xi Liu, Jian Ma, Lin Yang
  • Publication number: 20230025263
    Abstract: A texture recognition device and a manufacturing method thereof are provided. The texture recognition device includes a backlight component and a photosensitive component. The photosensitive component is on a light-outputting side of the backlight component and configured to detect light emitted by the backlight component and reflected by a texture of a detection object to recognize an image of the texture of the detection object. The photosensitive component includes a plurality of photosensitive sensors and an antistatic layer on a side, away from the backlight component, of the plurality of photosensitive sensors, and orthographic projections of the plurality of photosensitive sensors on a plane where the antistatic layer is located are within the antistatic layer.
    Type: Application
    Filed: November 28, 2019
    Publication date: January 26, 2023
    Inventors: Yajie FENG, Cheng LI, Yanna XUE, Xiaozhou ZHAN, Yue GENG, Kuiyuan WANG, Haibo HUANG, Jingfu TAO
  • Publication number: 20230024980
    Abstract: A service execution method and apparatus, a system, and a storage medium related to the communications field are provided. The method includes: a first network device generates a first packet, where the first packet includes a segment routing header (SRH), the SRH includes a service identifier, and the service identifier is related to first service information and second service information. The first network device sends the first packet to a second network device, wherein the service identifier indicates the second network device to execute at least one service based on the first service information, the second service information, and the first packet. According to this application, a problem that a network service cannot be provided for an actual service packet in an SRv6 network can be resolved.
    Type: Application
    Filed: October 3, 2022
    Publication date: January 26, 2023
    Inventors: Cheng Li, Ruizhao Hu
  • Patent number: 11560601
    Abstract: Methods, compositions, and kits for predicting and controlling fruit color in palm.
    Type: Grant
    Filed: May 1, 2020
    Date of Patent: January 24, 2023
    Assignee: Malaysian Palm Oil Board
    Inventors: Rajinder Singh, Leslie Ooi Cheng Li, Leslie Low Eng Ti, Rahimah Abdul Rahman, Meilina Ong Abdullah, Jayanthi Nagappan, Rozana Rosli, Mohd Amin Ab Halim, Rajanaidu Nookiah, Chan Kuang Lim, Norazah Azizi, Ravigadevi Sambanthamurthi, Rob Martienssen, Steven W. Smith, Nathan D. Lakey, Andrew Van Brunt, Jared Ordway, Michael Hogan, Chunyan Wang
  • Publication number: 20230019633
    Abstract: A method includes forming a fin extending from a substrate; depositing a liner over a top surface and sidewalls of the fin, where the minimum thickness of the liner is dependent on selected according to a first germanium concentration of the fin; forming a shallow trench isolation (STI) region adjacent the fin; removing a first portion of the liner on sidewalls of the fin, the first portion of the liner being above a topmost surface of the STI region; and forming a gate stack on sidewalls and a top surface of the fin, where the gate stack is in physical contact with the liner.
    Type: Application
    Filed: May 5, 2022
    Publication date: January 19, 2023
    Inventors: Yi-Cheng Li, Pin-Ju Liang, Ta-Chun Ma, Pei-Ren Jeng, Yee-Chia Yeo
  • Patent number: 11552087
    Abstract: Various embodiments of the present application are directed towards an integrated memory chip comprising a memory array with a strap-cell architecture that reduces the number of distinct strap-cell types and that reduces strap-line density. In some embodiments, the memory array is limited to three distinct types of strap cells: a source line/erase gate (SLEG) strap cell; a control gate/word line (CGWL) strap cell; and a word-line strap cell. The small number of distinct strap-cell types simplifies design of the memory array and further simplifies design of a corresponding interconnect structure. Further, in some embodiments, the three distinct strap-cell types electrically couple word lines, erase gates, and control gates to corresponding strap lines in different metallization layers of an interconnect structure. By spreading the strap lines amongst different metallization layers, strap-line density is reduced.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: January 10, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Tuo Huang, Ping-Cheng Li, Hung-Ling Shih, Po-Wei Liu, Yu-Ling Hsu, Yong-Shiuan Tsair, Chia-Sheng Lin, Shih Kuang Yang
  • Publication number: 20230004823
    Abstract: New question and answer (QA) pairs can be automatically discovered from a corpus of data such as online chats and conversations. Newly discovered QA pairs can augment QA database, which can be used by a computer processor or device, e.g., by a chatbot, an automated machine, and/or another. Existing QA knowledge can be used to learn the structures of QA knowledge distribution in conversations, and new QA knowledge can be automatically learned through the structure of learned QA knowledge distribution in conversations. The structure of learned QA knowledge distribution can be refined by adding more semantics based on labeled data.
    Type: Application
    Filed: June 30, 2021
    Publication date: January 5, 2023
    Inventors: Lijun Mei, Qi Cheng Li, Xue Han, Xin Zhou, Zi Ming Huang, Ya Bin Dang
  • Patent number: 11544538
    Abstract: The present invention relates to a pulse driving apparatus for minimising an asymmetric image between long-term potentiation (LTP) and long-term depression (LTD) in a hardware neural network, and a method therefor; and can minimise asymmetry between the LTP process and the LTD process, thereby improving a match rate of actual results by separately performing a first operation that performs on the LTP process, and a second operation that performs the LTP process and the LTD process.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: January 3, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yun Heub Song, Cheng Li
  • Patent number: 11538848
    Abstract: Provided a fingerprint identification substrate and a manufacturing method therefor, a identification method, and a display apparatus. The fingerprint identification substrate includes a substrate and at least two kinds of identification pixels disposed on the substrate, a first identification pixel includes a first photodiode and a second identification pixel includes a second photodiode. The first photodiode includes a first electrode, a first photoelectric conversion layer and a second electrode, the second photodiode includes the first electrode, a second photoelectric conversion layer and the second electrode, and the first photoelectric conversion layer and the second photoelectric conversion layer have different spectral response characteristics to red light or infrared light.
    Type: Grant
    Filed: June 26, 2021
    Date of Patent: December 27, 2022
    Assignees: Beijing BOE Sensor Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Yue Geng, Cheng Li, Zhonghuan Li, Kuiyuan Wang, Yi Dai, Zefei Li, Chaoyang Qi, Yajie Feng, Xiaoguan Li
  • Publication number: 20220406652
    Abstract: A semiconductor isolation structure includes a silicon-on-insulator wafer, a first deep trench isolation structure and a second deep trench isolation structure. The silicon-on-insulator wafer includes a semiconductor substrate, a buried insulation layer disposed on the semiconductor substrate, and a semiconductor layer disposed on the buried insulation layer. The semiconductor layer has a functional region. The first deep trench isolation structure penetrates the semiconductor layer and the buried insulation layer, and surrounds the functional region. The second deep trench isolation structure penetrates semiconductor layer and the buried insulation layer, and surrounds the first deep trench isolation structure.
    Type: Application
    Filed: June 17, 2021
    Publication date: December 22, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tsung-Yu YANG, Po-Wei LIU, Yun-Chi WU, Yu-Wen TSENG, Chia-Ta HSIEH, Ping-Cheng LI, Tsung-Hua YANG, Yu-Chun CHANG
  • Patent number: 11533254
    Abstract: A system and network devices for packet processing, a network device including a processor and instructions for receiving a first packet sent by a second network node, the first packet including a format of a segment identifier of the second network node describing a length and a location of each field in the segment identifier, obtaining the format based on the first packet, the segment identifier having a first field, and including a determined value of the first field in the segment identifier in a second packet sent to the second network node, the value of the first field in the segment identifier being determined based on a segment routing policy and the format, and the determined value of the first field indicating to the second network node to process the second packet.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: December 20, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Cheng Li, Guoyi Chen
  • Patent number: D972522
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: December 13, 2022
    Assignee: HMD Global Oy
    Inventor: Cheng-Li Hung