Abstract: A decoupling device includes a lead frame, a capacitor unit, a metal layer, and a high dielectric organic-inorganic composite material layer. The lead frame includes a cathode terminal portion and an anode terminal portion. The capacitor unit is disposed on the lead frame. The capacitor unit includes a cathode portion, an anode portion, and an insulation portion located between the cathode portion and the anode portion. The cathode portion is electrically connected to the cathode terminal portion, and the anode portion is electrically connected to the anode terminal portion. The high dielectric organic-inorganic composite material layer is connected to the capacitor unit in parallel via the metal layer.

Abstract: A through hole capacitor at least including a substrate, an anode layer, a dielectric layer, a first cathode layer, and a second cathode layer is provided. The substrate has a plurality of through holes. The anode layer is disposed on the inner surface of at least one through hole, and the surface of the anode layer is a porous structure. The dielectric layer is disposed on the porous structure of the anode layer. The first cathode layer covers a surface of the dielectric layer. The second cathode layer covers a surface of the first cathode layer, and the conductivity of the second cathode layer is greater than that of the first cathode layer. The through hole capacitor can be used for impedance control, as the cathode layers of the through hole are used for signal transmission.

Abstract: A hybrid capacitor is provided which includes a substrate, at least one plate capacitor and at least one through hole capacitor. The substrate has through holes and the plate capacitors are on the substrate. At least one through hole capacitor and at least one plate capacitor are in parallel. The through hole capacitor at least includes an anode layer, a first dielectric layer, a first cathode layer and a second cathode layer. The anode layer is disposed on an inner surface of at least one through hole, and a surface of the anode layer is a porous structure. The first dielectric layer is disposed on the porous structure of the anode layer and covered with the first cathode layer. The first cathode layer is covered with the second cathode layer. A conductivity of the second cathode layer is larger than a conductivity of the first cathode layer.

Abstract: A through hole capacitor at least including a substrate, an anode layer, a dielectric layer, a first cathode layer, and a second cathode layer is provided. The substrate has a plurality of through holes. The anode layer is disposed on the inner surface of at least one through hole, and the surface of the anode layer is a porous structure. The dielectric layer is disposed on the porous structure of the anode layer. The first cathode layer covers a surface of the dielectric layer. The second cathode layer covers a surface of the first cathode layer, and the conductivity of the second cathode layer is greater than that of the first cathode layer. The through hole capacitor can be used for impedance control, as the cathode layers of the through hole are used for signal transmission.

Abstract: A hybrid capacitor is provided which includes a substrate, at least one plate capacitor and at least one through hole capacitor. The substrate has through holes and the plate capacitors are on the substrate. At least one through hole capacitor and at least one plate capacitor are in parallel. The through hole capacitor at least includes an anode layer, a first dielectric layer, a first cathode layer and a second cathode layer. The anode layer is disposed on an inner surface of at least one through hole, and a surface of the anode layer is a porous structure. The first dielectric layer is disposed on the porous structure of the anode layer and covered with the first cathode layer. The first cathode layer is covered with the second cathode layer. A conductivity of the second cathode layer is larger than a conductivity of the first cathode layer.

Abstract: A solid electrolytic capacitor having multiple capacitor elements and a lead frame is provided. Each capacitor element includes an anode part, a cathode part, an insulating part and at least one first slit. The cathode part is disposed opposite to the anode part. The insulating part is disposed between the anode part and the cathode part. The first slit is disposed at the anode part. The lead frame has an upper surface and a lower surface where the capacitor elements are stacked on. The lead frame includes an anode terminal part electrically connected to the anode part, and includes a cathode terminal part electrically connected to the cathode part. Specially, the anode terminal part includes at least one first projecting part, which projects toward the upper surface. The capacitor elements are stacked on the upper surface and the first slit is inserted into the first projecting part.

Abstract: A solid electrolytic capacitor having multiple capacitor elements and a lead frame is provided. Each capacitor element includes an anode part, a cathode part, an insulating part and at least one first slit. The cathode part is disposed opposite to the anode part. The insulating part is disposed between the anode part and the cathode part. The first slit is disposed at the anode part. The lead frame has an upper surface and a lower surface where the capacitor elements are stacked on. The lead frame includes an anode terminal part electrically connected to the anode part, and includes a cathode terminal part electrically connected to the cathode part. Specially, the anode terminal part includes at least one first projecting part, which projects toward the upper surface. The capacitor elements are stacked on the upper surface and the first slit is inserted into the first projecting part.

Abstract: A solid electrolytic capacitor having multiple capacitor elements and a lead frame is provided. Each capacitor element includes an anode part, a cathode part, and at least one slit or hole, wherein the cathode part is disposed opposite to the anode part and the slit is disposed in the capacitor element. The lead frame has an upper surface and a lower surface where the capacitor elements are stacked on respectively for clipping the lead frame. The lead frame includes an anode terminal part, a cathode terminal part, a first projecting part, and a second projecting part. Wherein, the first and the second projecting parts are disposed at the cathode terminal part, and project towards the upper surface or the lower surface respectively. Especially, the first and second projecting parts are embedded into corresponding slits or holes so as to directly electrically connect the capacitor elements by the lead frame.