Patents by Inventor Cheng-Lin HO

Cheng-Lin HO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250183517
    Abstract: A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.
    Type: Application
    Filed: February 11, 2025
    Publication date: June 5, 2025
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Lin HO, Chih-Cheng LEE, Chun Chen CHEN, Yuanhao YU
  • Publication number: 20250105122
    Abstract: A substrate includes a first dielectric layer having a first surface and a second dielectric layer having a first surface disposed adjacent to the first surface of the first dielectric layer. The substrate further includes a first conductive via disposed in the first dielectric layer and having a first end adjacent to the first surface of the first dielectric layer and a second end opposite the first end. The substrate further includes a second conductive via disposed in the second dielectric layer and having a first end adjacent to the first surface of the second dielectric layer. A width of the first end of the first conductive via is smaller than a width of the second end of the first conductive via, and a width of the first end of the second conductive via is smaller than the width of the first end of the first conductive via.
    Type: Application
    Filed: December 10, 2024
    Publication date: March 27, 2025
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Lin HO, Chih-Cheng LEE
  • Patent number: 12224481
    Abstract: A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.
    Type: Grant
    Filed: March 7, 2023
    Date of Patent: February 11, 2025
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Lin Ho, Chih-Cheng Lee, Chun Chen Chen, Yuanhao Yu
  • Patent number: 12165963
    Abstract: A substrate includes a first dielectric layer having a first surface and a second dielectric layer having a first surface disposed adjacent to the first surface of the first dielectric layer. The substrate further includes a first conductive via disposed in the first dielectric layer and having a first end adjacent to the first surface of the first dielectric layer and a second end opposite the first end. The substrate further includes a second conductive via disposed in the second dielectric layer and having a first end adjacent to the first surface of the second dielectric layer. A width of the first end of the first conductive via is smaller than a width of the second end of the first conductive via, and a width of the first end of the second conductive via is smaller than the width of the first end of the first conductive via.
    Type: Grant
    Filed: September 29, 2023
    Date of Patent: December 10, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Lin Ho, Chih-Cheng Lee
  • Patent number: 12007063
    Abstract: A stand adjustment device has a tripod-connecting member, a connecting seat, a distal clamping plate, a boom-connecting tube, a locking shaft, and a manual operating member. The connecting seat is rotatably located around the tripod-connecting member. The distal clamping plate is detachably attached to a side of the connecting seat. One end of the locking shaft is movably disposed in the boom-connecting tube. The boom is slidably mounted through the boom-connecting tube and the locking shaft. The locking shaft is slidably mounted through the boom-connecting tube, the distal clamping plate, and the connecting seat such that the boom-connecting tube is rotatable relative to the connecting seat. The manual operating member and the locking shaft are configured to clamp the boom-connecting tube, the distal clamping plate, and the connecting seat therebetween into a locked condition.
    Type: Grant
    Filed: May 30, 2023
    Date of Patent: June 11, 2024
    Assignee: RELIANCE INTERNATIONAL CORP.
    Inventors: Pei-Chi Chu, Cheng-Lin Ho, Chi-Chia Huang, Wei-Ting Chen
  • Patent number: 11976776
    Abstract: A stand adjustment device has a tripod-connecting member, a connecting seat, a proximal clamping plate, a boom-connecting tube, a locking shaft, and a manual operating member. The connecting seat is rotatably located around the tripod-connecting member. The proximal clamping plate is detachably attached to a side of the connecting seat. One end of the locking shaft is movably disposed in the boom-connecting tube. The boom is slidably mounted through the boom-connecting tube and the locking shaft. The locking shaft is slidably mounted through the boom-connecting tube, the proximal clamping plate, and the connecting seat such that the boom-connecting tube is rotatable relative to the connecting seat. The manual operating member and the locking shaft are configured to clamp the boom-connecting tube, the proximal clamping plate, and the connecting seat therebetween into a locked condition.
    Type: Grant
    Filed: May 30, 2023
    Date of Patent: May 7, 2024
    Assignee: RELIANCE INTERNATIONAL CORP.
    Inventors: Pei-Chi Chu, Cheng-Lin Ho, Chi-Chia Huang, Wei-Ting Chen
  • Patent number: 11946591
    Abstract: A foldable stand has a base, a riser, and a switching mechanism. The riser is located on the base. The switching mechanism connects the base and the riser such that the riser selectively pivots relative to the base from an upright position to a folded position. The switching mechanism has a locked status and a released status. In the locked status, the switching mechanism prevents the riser from pivoting relative to the base. In the released status, the switching mechanism allows the riser to pivot relative to the base from an upright position to a folded position. The switching mechanism is configured to be switched from the locked status to the released status by rotation of the riser around a centerline of the riser.
    Type: Grant
    Filed: February 23, 2022
    Date of Patent: April 2, 2024
    Assignee: Reliance International Corp.
    Inventors: Chi-Chia Huang, Cheng-Lin Ho, Eric Langenhahn
  • Publication number: 20240088001
    Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.
    Type: Application
    Filed: September 19, 2023
    Publication date: March 14, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Lin HO, Chih-Cheng LEE, Chun Chen CHEN, Cheng Yuan CHEN
  • Publication number: 20240030120
    Abstract: A substrate includes a first dielectric layer having a first surface and a second dielectric layer having a first surface disposed adjacent to the first surface of the first dielectric layer. The substrate further includes a first conductive via disposed in the first dielectric layer and having a first end adjacent to the first surface of the first dielectric layer and a second end opposite the first end. The substrate further includes a second conductive via disposed in the second dielectric layer and having a first end adjacent to the first surface of the second dielectric layer. A width of the first end of the first conductive via is smaller than a width of the second end of the first conductive via, and a width of the first end of the second conductive via is smaller than the width of the first end of the first conductive via.
    Type: Application
    Filed: September 29, 2023
    Publication date: January 25, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Lin HO, Chih-Cheng LEE
  • Publication number: 20230361014
    Abstract: An electronic package includes an electronic structure, a first circuit pattern structure, a plurality of first solders and an encapsulant. The electronic structure includes an electronic device, and has a top surface and a bottom surface opposite to the top surface. The first circuit pattern structure is disposed over the top surface of the electronic structure. The first solders are disposed on the bottom surface of the electronic structure. The encapsulant encapsulates the electronic structure. At least a portion of the encapsulant is disposed between at least two of the plurality of first solders.
    Type: Application
    Filed: May 6, 2022
    Publication date: November 9, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Cheng-Lin HO
  • Patent number: 11776885
    Abstract: A substrate includes a first dielectric layer having a first surface and a second dielectric layer having a first surface disposed adjacent to the first surface of the first dielectric layer. The substrate further includes a first conductive via disposed in the first dielectric layer and having a first end adjacent to the first surface of the first dielectric layer and a second end opposite the first end. The substrate further includes a second conductive via disposed in the second dielectric layer and having a first end adjacent to the first surface of the second dielectric layer. A width of the first end of the first conductive via is smaller than a width of the second end of the first conductive via, and a width of the first end of the second conductive via is smaller than the width of the first end of the first conductive via.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: October 3, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Lin Ho, Chih-Cheng Lee
  • Publication number: 20230304626
    Abstract: A stand adjustment device has a tripod-connecting member, a connecting seat, a proximal clamping plate, a boom-connecting tube, a locking shaft, and a manual operating member. The connecting seat is rotatably located around the tripod-connecting member. The proximal clamping plate is detachably attached to a side of the connecting seat. One end of the locking shaft is movably disposed in the boom-connecting tube. The boom is slidably mounted through the boom-connecting tube and the locking shaft. The locking shaft is slidably mounted through the boom-connecting tube, the proximal clamping plate, and the connecting seat such that the boom-connecting tube is rotatable relative to the connecting seat. The manual operating member and the locking shaft are configured to clamp the boom-connecting tube, the proximal clamping plate, and the connecting seat therebetween into a locked condition.
    Type: Application
    Filed: May 30, 2023
    Publication date: September 28, 2023
    Inventors: PEI-CHI CHU, Cheng-Lin HO, CHI-CHIA HUANG, Wei-Ting CHEN
  • Publication number: 20230296204
    Abstract: A stand adjustment device has a tripod-connecting member, a connecting seat, a distal clamping plate, a boom-connecting tube, a locking shaft, and a manual operating member. The connecting seat is rotatably located around the tripod-connecting member. The distal clamping plate is detachably attached to a side of the connecting seat. One end of the locking shaft is movably disposed in the boom-connecting tube. The boom is slidably mounted through the boom-connecting tube and the locking shaft. The locking shaft is slidably mounted through the boom-connecting tube, the distal clamping plate, and the connecting seat such that the boom-connecting tube is rotatable relative to the connecting seat. The manual operating member and the locking shaft are configured to clamp the boom-connecting tube, the distal clamping plate, and the connecting seat therebetween into a locked condition.
    Type: Application
    Filed: May 30, 2023
    Publication date: September 21, 2023
    Inventors: PEI-CHI CHU, Cheng-Lin HO, CHI-CHIA HUANG, Wei-Ting CHEN
  • Patent number: 11764137
    Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: September 19, 2023
    Inventors: Cheng-Lin Ho, Chih-Cheng Lee, Chun Chen Chen, Cheng Yuan Chen
  • Patent number: 11756904
    Abstract: A semiconductor device package includes a substrate, a reflector, a radiator and a first director. The reflector is disposed on a surface of the substrate. The radiator is disposed over the reflector. The first director is disposed over the radiator. The reflector, the radiator and the first director have different elevations with respect to the surface of the substrate. The radiator and the first director define an antenna.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: September 12, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yuanhao Yu, Cheng-Lin Ho, Yu-Lin Shih, Shih-Chun Li
  • Patent number: 11713843
    Abstract: A stand adjustment device has a tripod-connecting member, a connecting seat, two clamping plates, a boom-connecting tube, a locking shaft, and a manual operating member. The connecting seat is rotatably located around the tripod-connecting member. The two clamping plates are detachably attached to two opposite sides of the connecting seat respectively. One end of the locking shaft is movably disposed in the boom-connecting tube. The boom is slidably mounted through the boom-connecting tube and the locking shaft. The locking shaft is slidably mounted through the boom-connecting tube, the two clamping plates, and the connecting seat such that the boom-connecting tube is rotatable relative to the connecting seat. The manual operating member and the locking shaft are configured to clamp the boom-connecting tube, the two clamping plates, and the connecting seat therebetween into a locked condition.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: August 1, 2023
    Assignee: Reliance International Corp.
    Inventors: Pei-Chi Chu, Cheng-Lin Ho, Chi-Chia Huang, Wei-Ting Chen
  • Publication number: 20230235848
    Abstract: A foldable stand has a base, a riser, and a switching mechanism. The riser is located on the base. The switching mechanism connects the base and the riser such that the riser selectively pivots relative to the base from an upright position to a folded position. The switching mechanism has a locked status and a released status. In the locked status, the switching mechanism prevents the riser from pivoting relative to the base. In the released status, the switching mechanism allows the riser to pivot relative to the base from an upright position to a folded position. The switching mechanism is configured to be switched from the locked status to the released status by rotation of the riser around a centerline of the riser.
    Type: Application
    Filed: February 23, 2022
    Publication date: July 27, 2023
    Inventors: CHI-CHIA HUANG, CHENG-LIN HO, ERIC LANGENHAHN
  • Publication number: 20230223676
    Abstract: A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.
    Type: Application
    Filed: March 7, 2023
    Publication date: July 13, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Lin HO, Chih-Cheng LEE, Chun Chen CHEN, Yuanhao YU
  • Patent number: 11680680
    Abstract: A multi-functional and extendable mounting stand has a clamp and an extending assembly including at least one coupling joint and at least one extending rod arranged alternately and connected sequentially. Each coupling joint has a first connecting seat, a mounting seat mounted on the first connecting seat, a second connecting seat mounted through the first connecting seat and the mounting seat, and a knob connected to the second connecting seat. At least one ends of the extending rod is connected to at least one ends of the at least one coupling joint. The clamp is connected to one end of the extending assembly. A holder, a lighting apparatus or a recording apparatus is connected to the extending assembly and can be adjusted to a height and an angular position that allow a user to use the holder in a comfortable pose or to the best recoding or lighting position.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: June 20, 2023
    Assignee: RELIANCE INTERNATIONAL CORP.
    Inventors: Chi-Chia Huang, Cheng-Lin Ho
  • Patent number: 11600901
    Abstract: A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: March 7, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Lin Ho, Chih-Cheng Lee, Chun Chen Chen, Yuanhao Yu