Patents by Inventor Cheng-Lin HO
Cheng-Lin HO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11946591Abstract: A foldable stand has a base, a riser, and a switching mechanism. The riser is located on the base. The switching mechanism connects the base and the riser such that the riser selectively pivots relative to the base from an upright position to a folded position. The switching mechanism has a locked status and a released status. In the locked status, the switching mechanism prevents the riser from pivoting relative to the base. In the released status, the switching mechanism allows the riser to pivot relative to the base from an upright position to a folded position. The switching mechanism is configured to be switched from the locked status to the released status by rotation of the riser around a centerline of the riser.Type: GrantFiled: February 23, 2022Date of Patent: April 2, 2024Assignee: Reliance International Corp.Inventors: Chi-Chia Huang, Cheng-Lin Ho, Eric Langenhahn
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Publication number: 20240088001Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.Type: ApplicationFiled: September 19, 2023Publication date: March 14, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Cheng-Lin HO, Chih-Cheng LEE, Chun Chen CHEN, Cheng Yuan CHEN
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Publication number: 20240030120Abstract: A substrate includes a first dielectric layer having a first surface and a second dielectric layer having a first surface disposed adjacent to the first surface of the first dielectric layer. The substrate further includes a first conductive via disposed in the first dielectric layer and having a first end adjacent to the first surface of the first dielectric layer and a second end opposite the first end. The substrate further includes a second conductive via disposed in the second dielectric layer and having a first end adjacent to the first surface of the second dielectric layer. A width of the first end of the first conductive via is smaller than a width of the second end of the first conductive via, and a width of the first end of the second conductive via is smaller than the width of the first end of the first conductive via.Type: ApplicationFiled: September 29, 2023Publication date: January 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Cheng-Lin HO, Chih-Cheng LEE
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Publication number: 20230361014Abstract: An electronic package includes an electronic structure, a first circuit pattern structure, a plurality of first solders and an encapsulant. The electronic structure includes an electronic device, and has a top surface and a bottom surface opposite to the top surface. The first circuit pattern structure is disposed over the top surface of the electronic structure. The first solders are disposed on the bottom surface of the electronic structure. The encapsulant encapsulates the electronic structure. At least a portion of the encapsulant is disposed between at least two of the plurality of first solders.Type: ApplicationFiled: May 6, 2022Publication date: November 9, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Cheng-Lin HO
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Patent number: 11776885Abstract: A substrate includes a first dielectric layer having a first surface and a second dielectric layer having a first surface disposed adjacent to the first surface of the first dielectric layer. The substrate further includes a first conductive via disposed in the first dielectric layer and having a first end adjacent to the first surface of the first dielectric layer and a second end opposite the first end. The substrate further includes a second conductive via disposed in the second dielectric layer and having a first end adjacent to the first surface of the second dielectric layer. A width of the first end of the first conductive via is smaller than a width of the second end of the first conductive via, and a width of the first end of the second conductive via is smaller than the width of the first end of the first conductive via.Type: GrantFiled: August 9, 2021Date of Patent: October 3, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Cheng-Lin Ho, Chih-Cheng Lee
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Publication number: 20230304626Abstract: A stand adjustment device has a tripod-connecting member, a connecting seat, a proximal clamping plate, a boom-connecting tube, a locking shaft, and a manual operating member. The connecting seat is rotatably located around the tripod-connecting member. The proximal clamping plate is detachably attached to a side of the connecting seat. One end of the locking shaft is movably disposed in the boom-connecting tube. The boom is slidably mounted through the boom-connecting tube and the locking shaft. The locking shaft is slidably mounted through the boom-connecting tube, the proximal clamping plate, and the connecting seat such that the boom-connecting tube is rotatable relative to the connecting seat. The manual operating member and the locking shaft are configured to clamp the boom-connecting tube, the proximal clamping plate, and the connecting seat therebetween into a locked condition.Type: ApplicationFiled: May 30, 2023Publication date: September 28, 2023Inventors: PEI-CHI CHU, Cheng-Lin HO, CHI-CHIA HUANG, Wei-Ting CHEN
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Publication number: 20230296204Abstract: A stand adjustment device has a tripod-connecting member, a connecting seat, a distal clamping plate, a boom-connecting tube, a locking shaft, and a manual operating member. The connecting seat is rotatably located around the tripod-connecting member. The distal clamping plate is detachably attached to a side of the connecting seat. One end of the locking shaft is movably disposed in the boom-connecting tube. The boom is slidably mounted through the boom-connecting tube and the locking shaft. The locking shaft is slidably mounted through the boom-connecting tube, the distal clamping plate, and the connecting seat such that the boom-connecting tube is rotatable relative to the connecting seat. The manual operating member and the locking shaft are configured to clamp the boom-connecting tube, the distal clamping plate, and the connecting seat therebetween into a locked condition.Type: ApplicationFiled: May 30, 2023Publication date: September 21, 2023Inventors: PEI-CHI CHU, Cheng-Lin HO, CHI-CHIA HUANG, Wei-Ting CHEN
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Patent number: 11764137Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.Type: GrantFiled: January 4, 2021Date of Patent: September 19, 2023Inventors: Cheng-Lin Ho, Chih-Cheng Lee, Chun Chen Chen, Cheng Yuan Chen
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Patent number: 11756904Abstract: A semiconductor device package includes a substrate, a reflector, a radiator and a first director. The reflector is disposed on a surface of the substrate. The radiator is disposed over the reflector. The first director is disposed over the radiator. The reflector, the radiator and the first director have different elevations with respect to the surface of the substrate. The radiator and the first director define an antenna.Type: GrantFiled: June 8, 2020Date of Patent: September 12, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yuanhao Yu, Cheng-Lin Ho, Yu-Lin Shih, Shih-Chun Li
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Patent number: 11713843Abstract: A stand adjustment device has a tripod-connecting member, a connecting seat, two clamping plates, a boom-connecting tube, a locking shaft, and a manual operating member. The connecting seat is rotatably located around the tripod-connecting member. The two clamping plates are detachably attached to two opposite sides of the connecting seat respectively. One end of the locking shaft is movably disposed in the boom-connecting tube. The boom is slidably mounted through the boom-connecting tube and the locking shaft. The locking shaft is slidably mounted through the boom-connecting tube, the two clamping plates, and the connecting seat such that the boom-connecting tube is rotatable relative to the connecting seat. The manual operating member and the locking shaft are configured to clamp the boom-connecting tube, the two clamping plates, and the connecting seat therebetween into a locked condition.Type: GrantFiled: March 10, 2021Date of Patent: August 1, 2023Assignee: Reliance International Corp.Inventors: Pei-Chi Chu, Cheng-Lin Ho, Chi-Chia Huang, Wei-Ting Chen
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Publication number: 20230235848Abstract: A foldable stand has a base, a riser, and a switching mechanism. The riser is located on the base. The switching mechanism connects the base and the riser such that the riser selectively pivots relative to the base from an upright position to a folded position. The switching mechanism has a locked status and a released status. In the locked status, the switching mechanism prevents the riser from pivoting relative to the base. In the released status, the switching mechanism allows the riser to pivot relative to the base from an upright position to a folded position. The switching mechanism is configured to be switched from the locked status to the released status by rotation of the riser around a centerline of the riser.Type: ApplicationFiled: February 23, 2022Publication date: July 27, 2023Inventors: CHI-CHIA HUANG, CHENG-LIN HO, ERIC LANGENHAHN
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Publication number: 20230223676Abstract: A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.Type: ApplicationFiled: March 7, 2023Publication date: July 13, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Cheng-Lin HO, Chih-Cheng LEE, Chun Chen CHEN, Yuanhao YU
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Patent number: 11680680Abstract: A multi-functional and extendable mounting stand has a clamp and an extending assembly including at least one coupling joint and at least one extending rod arranged alternately and connected sequentially. Each coupling joint has a first connecting seat, a mounting seat mounted on the first connecting seat, a second connecting seat mounted through the first connecting seat and the mounting seat, and a knob connected to the second connecting seat. At least one ends of the extending rod is connected to at least one ends of the at least one coupling joint. The clamp is connected to one end of the extending assembly. A holder, a lighting apparatus or a recording apparatus is connected to the extending assembly and can be adjusted to a height and an angular position that allow a user to use the holder in a comfortable pose or to the best recoding or lighting position.Type: GrantFiled: March 16, 2022Date of Patent: June 20, 2023Assignee: RELIANCE INTERNATIONAL CORP.Inventors: Chi-Chia Huang, Cheng-Lin Ho
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Patent number: 11600901Abstract: A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.Type: GrantFiled: July 9, 2019Date of Patent: March 7, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Cheng-Lin Ho, Chih-Cheng Lee, Chun Chen Chen, Yuanhao Yu
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Publication number: 20220290799Abstract: A stand adjustment device has a tripod-connecting member, a connecting seat, two clamping plates, a boom-connecting tube, a locking shaft, and a manual operating member. The connecting seat is rotatably located around the tripod-connecting member. The two clamping plates are detachably attached to two opposite sides of the connecting seat respectively. One end of the locking shaft is movably disposed in the boom-connecting tube. The boom is slidably mounted through the boom-connecting tube and the locking shaft. The locking shaft is slidably mounted through the boom-connecting tube, the two clamping plates, and the connecting seat such that the boom-connecting tube is rotatable relative to the connecting seat. The manual operating member and the locking shaft are configured to clamp the boom-connecting tube, the two clamping plates, and the connecting seat therebetween into a locked condition.Type: ApplicationFiled: March 10, 2021Publication date: September 15, 2022Inventors: Pei-Chi Chu, Cheng-Lin Ho, Chi-Chia Huang, Wei-Ting Chen
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Electrical connection placement of semiconductor device package and method of manufacturing the same
Patent number: 11233022Abstract: A semiconductor device package includes a redistribution structure and an electrical connection. The redistribution structure has an electrical terminal adjacent to a surface of the redistribution structure and a seed layer covering a side surface of the electrical terminal. The electrical connection is disposed on a first surface of the electrical terminal. The seed layer extends to the first surface of the electrical terminal.Type: GrantFiled: January 6, 2020Date of Patent: January 25, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Cheng-Lin Ho, Chih-Cheng Lee -
Publication number: 20210398904Abstract: A semiconductor device package includes a substrate, and interconnection structure and a package body. The interconnection structure is disposed on the substrate. The interconnection structure has a conductive structure and a first dielectric layer covering a portion of the conductive structure. The conductive structure defines an antenna feeding point. The package body is disposed on the substrate and covers the interconnection structure.Type: ApplicationFiled: June 19, 2020Publication date: December 23, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Cheng-Lin HO, Chih-Cheng LEE
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Patent number: 11201386Abstract: A semiconductor device package and a method for manufacturing the same are provided. The semiconductor device package includes a circuit layer and an antenna module. The circuit layer has a first surface, a second surface opposite to the first surface and a lateral surface. The lateral surface extends between the first surface and the second surface. The circuit layer has an interconnection structure. The antenna module has an antenna pattern layer and is disposed on the first surface of the circuit layer. The lateral surface of the circuit layer is substantially coplanar with a lateral surface of the antenna module.Type: GrantFiled: October 31, 2019Date of Patent: December 14, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Cheng-Lin Ho, Chih-Cheng Lee, Chun Chen Chen, Yuanhao Yu
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Publication number: 20210384148Abstract: A semiconductor device package includes a substrate, a reflector, a radiator and a first director. The reflector is disposed on a surface of the substrate. The radiator is disposed over the reflector. The first director is disposed over the radiator. The reflector, the radiator and the first director have different elevations with respect to the surface of the substrate. The radiator and the first director define an antenna.Type: ApplicationFiled: June 8, 2020Publication date: December 9, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yuanhao YU, Cheng-Lin HO, Yu-Lin SHIH, Shih-Chun LI
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Publication number: 20210366816Abstract: A substrate includes a first dielectric layer having a first surface and a second dielectric layer having a first surface disposed adjacent to the first surface of the first dielectric layer. The substrate further includes a first conductive via disposed in the first dielectric layer and having a first end adjacent to the first surface of the first dielectric layer and a second end opposite the first end. The substrate further includes a second conductive via disposed in the second dielectric layer and having a first end adjacent to the first surface of the second dielectric layer. A width of the first end of the first conductive via is smaller than a width of the second end of the first conductive via, and a width of the first end of the second conductive via is smaller than the width of the first end of the first conductive via.Type: ApplicationFiled: August 9, 2021Publication date: November 25, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Cheng-Lin HO, Chih-Cheng LEE