Patents by Inventor Cheng-Lin Huang Huang

Cheng-Lin Huang Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface treatment in electroless process for adhesion enhancement
    Patent number: 9230934
    Abstract: An embodiment method of forming and a bump structure are disclosed. The bump structure includes a passivation layer formed over a metal pad, the passivation layer having a recess exposing a portion of the metal pad, and a metal bump formed over the metal pad, the metal bump having a lip extending beneath the passivation layer, the lip anchoring the metal bump to the passivation layer.
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: January 5, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jing-Cheng Lin, Cheng-Lin Huang Huang, Wei-An Tsao
  • Surface Treatment in Electroless Process for Adhesion Enhancement
    Publication number: 20140264841
    Abstract: An embodiment method of forming and a bump structure are disclosed. The bump structure includes a passivation layer formed over a metal pad, the passivation layer having a recess exposing a portion of the metal pad, and a metal bump formed over the metal pad, the metal bump having a lip extending beneath the passivation layer, the lip anchoring the metal bump to the passivation layer.
    Type: Application
    Filed: May 17, 2013
    Publication date: September 18, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jing-Cheng Lin, Cheng-Lin Huang Huang, Wei-An Tsao