Abstract: A method includes bonding a first wafer to a second wafer, with a first plurality of dielectric layers in the first wafer and a second plurality of dielectric layers in the second wafer bonded between a first substrate of the first wafer and a second substrate in the second wafer. A first opening is formed in the first substrate, and the first plurality of dielectric layers and the second wafer are etched through the first opening to form a second opening. A metal pad in the second plurality of dielectric layers is exposed to the second opening. A conductive plug is formed extending into the first and the second openings.

Abstract: A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.

Abstract: A mobile device includes a housing, a first radiation element, a second radiation element, a third radiation element, a first switch element, and a second switch element. The first radiation element has a first feeding point. The second radiation element has a second feeding point. The first radiation element, the second radiation element, and the third radiation element are distributed over the housing. The first switch element is closed or open, so as to selectively couple the first radiation element to the third radiation element. The second switch element is closed or open, so as to selectively couple the second radiation element to the third radiation element. An antenna structure is formed by the first radiation element, the second radiation element, and the third radiation element.

Abstract: A system and method for managing network devices via e-mail that accomplishes sending management commands to the management proxy device (140) and receiving status information on the managed device (150) via e-mail in a network management system. The system for managing network devices via e-mail comprised: at least one management base (100) that runs an e-mail client side program (113) as a network management tool to send e-mails containing management commands; at least one management proxy device that runs an e-mail service module (146) for receiving and analyzing e-mails containing management commands, and for sending e-mails containing status information on a managed device, said e-mail service module comprising an e-mail receiving sub-module (1461), a decryption sub-module (1462), a status information reporting sub-module (1463) and an e-mail sending sub-module (1464); and an e-mail server (160) that receives e-mails from the management base and the management proxy device.