Patents by Inventor Cheng-Lun Chen

Cheng-Lun Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12242321
    Abstract: The disclosure provides a power management method. The power management method is applicable to an electronic device. The electronic device is electrically coupled to an adapter, and includes a system and a battery. The adapter has a feed power. The battery has a discharge power. The power management method of the disclosure includes: reading a power value of the battery; determining a state of the system; and discharging power to the system, when the system is in a power-on state and the power value is greater than a charging stopping value, by using the battery, and controlling, according to the discharge power and the feed power, the adapter to selectively supply power to the system. The disclosure further provides an electronic device using the power management method.
    Type: Grant
    Filed: April 27, 2023
    Date of Patent: March 4, 2025
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Wen Che Chung, Hui Chuan Lo, Hao-Hsuan Lin, Chun Tsao, Jun-Fu Chen, Ming-Hung Yao, Jia-Wei Zhang, Kuan-Lun Chen, Ting-Chao Lin, Cheng-Yen Lin, Chunyen Lai
  • Patent number: 12230744
    Abstract: A light-emitting device includes a substrate including a top surface, a first side surface and a second side surface, wherein the first side surface and the second side surface of the substrate are respectively connected to two opposite sides of the top surface of the substrate; a semiconductor stack formed on the top surface of the substrate, the semiconductor stack including a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a first electrode pad formed adjacent to a first edge of the light-emitting device; and a second electrode pad formed adjacent to a second edge of the light-emitting device, wherein in a top view of the light-emitting device, the first edge and the second edge are formed on different sides or opposite sides of the light-emitting device, the first semiconductor layer adjacent to the first edge includes a first sidewall directly connected to the first side surface of the substrate,
    Type: Grant
    Filed: September 20, 2023
    Date of Patent: February 18, 2025
    Assignee: EPISTAR CORPORATION
    Inventors: Chao-Hsing Chen, Cheng-Lin Lu, Chih-Hao Chen, Chi-Shiang Hsu, I-Lun Ma, Meng-Hsiang Hong, Hsin-Ying Wang, Kuo-Ching Hung, Yi-Hung Lin
  • Patent number: 12211790
    Abstract: The present disclosure describes a semiconductor structure and a method for forming the same. The semiconductor structure can include a substrate, a first vertical structure and a second vertical structure formed over the substrate, and a conductive rail structure between the first and second vertical structures. A top surface of the conductive rail structure can be substantially coplanar with top surfaces of the first and the second vertical structures.
    Type: Grant
    Filed: August 10, 2023
    Date of Patent: January 28, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Bo Liao, Wei Ju Lee, Cheng-Ting Chung, Hou-Yu Chen, Chun-Fu Cheng, Kuan-Lun Cheng
  • Publication number: 20240321672
    Abstract: An electronic package and a manufacturing method thereof are provided, in which an electronic structure and a wall structure surrounding the electronic structure are disposed on a carrier structure, a heat conducting layer is formed on the electronic structure, and the wall structure and the heat conducting layer are covered by a heat dissipation element. Therefore, a thermal stress can be effectively dispersed by the arrangement of the wall structure, such that a warpage of the electronic structure and a heat dissipation body can be effectively controlled.
    Type: Application
    Filed: July 12, 2023
    Publication date: September 26, 2024
    Inventors: Cheng-Lun CHEN, Liang-Yi HUNG, Yu-Po WANG
  • Publication number: 20020159791
    Abstract: An electrophotographic device uses a closed loop controller that receives a feedback signal from an encoder connected to the OPC drum to improve the rotational velocity control of the drum. The encoder provides the rotational position or angular velocity of the drum to the closed loop controller as the feedback signal. In one embodiment, the electrophotographic device uses a closed loop controller that incorporates a model of the human visual system, such as the human contrast sensitivity function, to help reduce noticeable banding artifacts. The human contrast sensitivity function incorporated into the primary control loop helps filter out low frequency and non-periodic drum rotational velocity fluctuations in producing banding artifacts. The electrophotographic device may also include a repetitive controller in a secondary control loop to help reduce the effect of periodic drum rotational velocity fluctuations in producing banding artifacts.
    Type: Application
    Filed: March 7, 2001
    Publication date: October 31, 2002
    Inventors: Cheng-Lun Chen, George Tsu-Chih Chiu
  • Patent number: 6456808
    Abstract: Systems and methods for reducing banding artifact in electrophotographic devices are provided. One such electrophotographic device uses a closed loop controller that receives a feedback signal from an encoder connected to the OPC drum to improve the rotational velocity control of the drum. The encoder provides the rotational position or angular velocity of the drum to the closed loop controller as the feedback signal. Optionally, the electrophotographic device uses a closed loop controller that incorporates a model of the human visual system, such as the human contrast sensitivity function, to help reduce noticeable banding artifacts. The human contrast sensitivity function incorporated into the primary control loop helps filter out low frequency and non-periodic drum rotational velocity fluctuations in producing banding artifacts.
    Type: Grant
    Filed: March 7, 2001
    Date of Patent: September 24, 2002
    Assignees: Hewlett-Packard Company, Purdue Research Foundation
    Inventors: Cheng-Lun Chen, George Tsu-Chih Chiu
  • Patent number: D486458
    Type: Grant
    Filed: October 11, 2002
    Date of Patent: February 10, 2004
    Assignee: High Tech Computer, Corp.
    Inventors: Cheng-Lun Chen, Chia-Sheng Ho