Patents by Inventor CHENG-LUN CHU

CHENG-LUN CHU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip package module including flip-chip ground pads and power pads, and wire-bonding ground pads and power pads
    Patent number: 11424206
    Abstract: A chip package module is provided. The chip package module includes a package substrate, a chip, and a conductive connector assembly. The chip having a first surface and a second surface opposite thereto is disposed on the package substrate. The first surface is divided into a first region, a second region, and a third region, and the second region is located between the first and third regions. The chip includes a flip-chip pad group disposed in the first region, a wire-bonding pad group disposed in the third region, and a signal pad group disposed in the second region. The conductive connector assembly is electrically connected between the chip and the package substrate. One of the flip-chip pad group and the wire-bonding pad group is electrically and physically connected to the conductive connector assembly, and the other one is not physically connected to the conductive connector assembly.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: August 23, 2022
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Sheng-Feng Chung, Cheng-Lun Chu
  • CHIP PACKAGE MODULE
    Publication number: 20210104480
    Abstract: A chip package module is provided. The chip package module includes a package substrate, a chip, and a conductive connector assembly. The chip having a first surface and a second surface opposite thereto is disposed on the package substrate. The first surface is divided into a first region, a second region, and a third region, and the second region is located between the first and third regions. The chip includes a flip-chip pad group disposed in the first region, a wire-bonding pad group disposed in the third region, and a signal pad group disposed in the second region. The conductive connector assembly is electrically connected between the chip and the package substrate. One of the flip-chip pad group and the wire-bonding pad group is electrically and physically connected to the conductive connector assembly, and the other one is not physically connected to the conductive connector assembly.
    Type: Application
    Filed: May 18, 2020
    Publication date: April 8, 2021
    Inventors: SHENG-FENG CHUNG, CHENG-LUN CHU