Abstract: A fitting for an upper brush in a double brush scrubbing chamber of a wafer cleaning system is disclosed. The fitting includes a base plate, a flanged pipe, and a threaded connector. The base plate includes a threaded hole with a stop surface therein and a channel extending from the stop surface through a lower surface of the base plate. The flanged pipe is inserted into the base plate such that the flange at the top end of a hollow tube rests on the stop surface and the hollow tube passes through the channel of the base plate. The threaded connector has a passage therethrough, and engages the threaded hole of the base plate to fix the flanged pipe in place. This structure is able to provide fluid while minimizing particle generation.

Abstract: A fitting for an upper brush in a double brush scrubbing chamber of a wafer cleaning system is disclosed. The fitting includes a base plate, a flanged pipe, and a threaded connector. The base plate includes a threaded hole with a stop surface therein and a channel extending from the stop surface through a lower surface of the base plate. The flanged pipe is inserted into the base plate such that the flange at the top end of a hollow tube rests on the stop surface and the hollow tube passes through the channel of the base plate. The threaded connector has a passage therethrough, and engages the threaded hole of the base plate to fix the flanged pipe in place. This structure is able to provide fluid while minimizing particle generation.

Abstract: A semiconductor device includes a first conductive layer, a second conductive layer, a third conductive layer, a first organic layer, a first inorganic layer and a first silicon-containing layer. The third conductive layer is disposed between and electrically isolated from the first conductive layer and the second conductive layer. The first organic layer continuously covers the first conductive layer and the third conductive layer. The first inorganic layer is disposed over the first organic layer. The first silicon-containing layer is inserted between the first organic layer and the first inorganic layer, wherein the second conductive layer is disposed on and disposed in the first organic layer, the first silicon-containing layer and the first inorganic layer, to electrically connect to the first conductive layer.

Abstract: An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.

Abstract: A display panel and a pixel circuit thereof are provided. A pulse width signal generator turns on a charge sharing switch during a light-emitting period, and performs charge sharing with a control end of a positive feedback switch of a positive feedback circuit, so as to control the positive feedback switch to provide a positive feedback voltage to the pulse width signal generator to increase a voltage at an output end of the pulse width signal generator and thus to accelerate a rising speed of a voltage for controlling a driving current generator to provide a driving current.

Abstract: A method for determining a pose of a target object is to be implemented by a computing device that stores a database related to a specific type of object. The database includes a plurality of template images. The method includes: obtaining an input image that contains the target object belonging to the specific type; selecting a matching image that best matches with the input image from among the template images; performing a keypoint matching procedure to identify a plurality of first feature points that are related an the appearance of the target object shown in the input image, and a plurality of second feature points that are shown in the matching image and that respectively match with the first feature points; and generating a pose-determination result that indicates the pose of the target object based on relationships among the first feature points and the second feature points.

Abstract: The disclosure provides an electronic assembly, a method for manufacturing electronic assembly, and a composite thermally conductive sheet. The electronic assembly includes a circuit board, a heat source, an anti-overflow element, a thermally conductive block and a thermally conductive sheet. The heat source is disposed on and electrically connected to the circuit board. The anti-overflow element is disposed on a side of the heat source located farthest away from the circuit board and has an opening. The thermally conductive block is disposed on a side of the anti-overflow element located farthest away from the heat source. The thermally conductive sheet is made of a phase change material. The thermally conductive sheet is located in the opening of the anti-overflow element to be surrounded by the anti-overflow element. Opposite sides of the thermally conductive sheet are in thermal contact with the heat source and the thermally conductive block, respectively.

Abstract: A method for object detection includes: extracting a plurality of identification features from a plurality of reference images that are related to a target object; selecting a plurality of selected identification features respectively from the identification features so as to obtain a first feature dataset, and storing the first feature dataset, a quantity of selected identification features being smaller than a quantity of the identification features; in response to receipt of a to-be-detected image, performing a feature extraction operation on the to-be-detected image to obtain a second feature dataset; performing a similarity determination operation with respect to the to-be-detected image based on the first feature dataset and the second feature dataset, and calculating a quantity of instances of the target object in the to-be-detected image.

Abstract: A heat dissipation structure assembly includes an elastic limiting member, a thermal grease wall, a fitting member, a phase-change metal, and an assembling plate. The elastic limiting member is adapted to be disposed at a periphery of a heat source. The thermal grease wall is adapted to be in contact with the periphery of the heat source. The fitting member is in contact with the thermal grease wall and engaged with the elastic limiting member. The phase-change metal is adapted to be filled into a region among the fitting member, the thermal grease wall, and the heat source. When a temperature of the phase-change metal exceeds a critical temperature, a state of the phase-change metal is changed to a liquid state. The assembling plate is connected to the fitting member, and the assembling plate is in contact with the thermal grease wall.

Abstract: A method for automatically placing a to-be-packed object into a container that defines an accommodation space is provided. A processing unit obtains an object dimension data piece that indicates dimensions of the to-be-packed object, and obtains, through a camera unit that captures images of the to-be-packed object and the accommodation space, an unoccupied area related to the accommodation space. Based on the object dimension data piece and the unoccupied area, the processing unit determines whether the container is capable of accommodating the to-be-packed object.

Abstract: There is provided a method for picking up an object from a bin to be implemented by a robotic arm including a controller and a picking-up module. The method includes: recognizing, by the controller, at least one object in the bin based on an image of an interior of the bin so as to determine a type of each object; determining, by the controller, a score for each object based on the type thereof; determining, by the controller, whether a greatest score among the score(s) of the at least one TBT object is greater than a predetermined value; and by the picking-up module, picking up one of the at least one TBT object that has the greatest score when it is determined that the greatest score is greater than the predetermined value.

Abstract: A method includes steps of: capturing an image of a container; recognizing at least one object in the container based on the image; determining at least one first coordinate set corresponding to the at least one object; determining at least one second coordinate set that corresponds to target one (s) of the at least one first coordinate set and that relates to a fixed picking device of a robotic arm; adjusting position(s) of unfixed picking device(s) of the robotic arm if necessary; controlling the robotic arm to pick up one (s) of the at least one object that correspond(s) to the at least one second coordinate set with the fixed picking device and/or at least one unfixed picking device.

Abstract: A heat dissipation structure assembly includes an elastic limiting member, a paste-type heat dissipation wall, a fitting member, a phase-change metal, and an assembling plate. The elastic limiting member is adapted to be disposed at a periphery of a heat source. The paste-type heat dissipation wall is adapted to be in contact with the periphery of the heat source. The fitting member is in contact with the paste-type heat dissipation wall and engaged with the elastic limiting member. The phase-change metal is adapted to be filled into a region among the fitting member, the paste-type heat dissipation wall, and the heat source. When a temperature of the phase-change metal exceeds a critical temperature, a state of the phase-change metal is changed to a liquid state. The assembling plate is connected to the fitting member, and the assembling plate is in contact with the paste-type heat dissipation wall.

Abstract: A heat dissipation system of a portable electronic device including a first processing element, a second processing element, a heat dissipation module located between the first processing element and the second processing element, a first heat transferring member, and a second heat transferring member, is provided. The first processing element has a first region and a second region. The first heat transferring member is in thermal contact with the first region, the second processing element, and the heat dissipation module. The second heat transferring member is in thermal contact with the second region and the heat dissipation module.

Abstract: There is provided a method for picking up an object from a bin to be implemented by a robotic arm including a controller and a picking-up module. The method includes: recognizing, by the controller, at least one object in the bin based on an image of an interior of the bin so as to determine a type of each object; determining, by the controller, a score for each object based on the type thereof; determining, by the controller, whether a greatest score among the score(s) of the at least one TBT object is greater than a predetermined value; and by the picking-up module, picking up one of the at least one TBT object that has the greatest score when it is determined that the greatest score is greater than the predetermined value.

Abstract: A transferring system for transferring an object disposed in a storage area includes telescopic units, sucking disc units respectively connected to the telescopic units, and a control unit. The control unit calculates an area related to an object according to an image obtained by an imaging unit, and calculates a value of N based on the area. The value of N is a number of the sucking disc units used for picking up the object and is equal to or greater than one. The control unit determines N positions on the object, controls N telescopic units to move N sucking disc units toward the N positions, and controls the N sucking disc units to adhere respectively to the N positions so as to pick up the object from the storage area.

Abstract: A method of automated order picking is provided. A control device uses camera devices and a code reader unit to acquire identification codes and volumes of multiple objects when controlling a robotic arm to bring the objects from a first platform to a second platform one by one. Upon determining that the objects on the second platform include all order items of an order based on the identification codes, the control devices selects a packing box that fits the order items in volume, and controls another robotic arm to take the order items from the second platform to the packing box.

Abstract: A transferring system for transferring an object disposed in a storage area includes telescopic units, sucking disc units respectively connected to the telescopic units, and a control unit. The control unit calculates an area related to an object according to an image obtained by an imaging unit, and calculates a value of N based on the area. The value of N is a number of the sucking disc units used for picking up the object and is equal to or greater than one. The control unit determines N positions on the object, controls N telescopic units to move N sucking disc units toward the N positions, and controls the N sucking disc units to adhere respectively to the N positions so as to pick up the object from the storage area.

Abstract: A method includes steps of: capturing an image of a container; recognizing at least one object in the container based on the image; determining at least one first coordinate set corresponding to the at least one object; determining at least one second coordinate set that corresponds to target one (s) of the at least one first coordinate set and that relates to a fixed picking device of a robotic arm; adjusting position(s) of unfixed picking device(s) of the robotic arm if necessary; controlling the robotic arm to pick up one (s) of the at least one object that correspond(s) to the at least one second coordinate set with the fixed. picking device and/or at least one unfixed picking device.

Abstract: A portable laser engraving/cutting apparatus includes a casing, a working laser source, a lens unit, a first axis galvanometric unit and a second axis galvanometric unit. The working laser source, the lens unit, the first axis galvanometric unit and the second axis galvanometric unit all are installed within the casing to implement the portable laser engraving cutting apparatus with a small volume.