Abstract: Aspects of the disclosure provide a frame processor for processing frames with aliasing artifacts. For example, the frame processor can include a super-resolution (SR) and anti-aliasing (AA) engine and an attention reference frame generator coupled to the SR and AA engine. The SR and AA engine can be configured to enhance resolution and remove aliasing artifacts of a frame to generate a first high-resolution frame with aliasing artifacts and a second high-resolution frame with aliasing artifacts removed. The attention reference frame generator can be configured to generate an attention reference frame based on the first high-resolution frame and the second high-resolution frame.

Abstract: A structure and a method of forming are provided. The structure includes a first dielectric layer overlying a first substrate. A first connection pad is disposed in a top surface of the first dielectric layer and contacts a first redistribution line. A first dummy pad is disposed in the top surface of the first dielectric layer, the first dummy pad contacting the first redistribution line. A second dielectric layer overlies a second substrate. A second connection pad and a second dummy pad are disposed in the top surface of the second dielectric layer, the second connection pad bonded to the first connection pad, and the first dummy pad positioned in a manner that is offset from the second dummy pad so that the first dummy pad and the second dummy pad do not contact each other.

Abstract: The present disclosure provides a chemical mechanical polishing system having a unitary platen. The platen includes one or more recesses within the platen to house various components for the polishing/planarization process. In one embodiment, the platen includes a first recess and a second recess. The first recess is located under the second recess. An end point detector is placed in the first recess and a detector cover may be placed in the second recess. A sealing mean is provided in a space between the end point detector and the detector cover to prevent any external or foreign materials from coming in contact with the end point detector. A fastener used for fastening the detector cover to the platen also provides addition protection to prevent foreign materials from coming in contact with components received in the recesses.

Abstract: A wafer lift pin system is capable of dynamically modulating or adjusting the flow of gas into and out of lift pins of the wafer lift pin system to achieve and maintain a consistent pressure in supply lines that supply the gas to the lift pins. This enables the wafer lift pin system to precisely control the speed, acceleration, and deceleration of the lift pins to achieve consistent and repeatable lift pin rise times and fall times. A controller and various sensors and valves may control the gas pressures in the wafer lift pin system based on various factors, such as historic rise times, historic fall times, and/or the condition of the lift pins. This enables smoother and more controlled automatic operation of the lift pins, which reduces and/or minimizes wafer shifting and wafer instability, which may reduce processing defects and maintain or improve processing yields.

Abstract: An image analysis device may align an image to determine a position of a wafer within the image. The wafer may include a plurality of wafer bumps. The image analysis device may mask, based on the position of the wafer, the image to obtain an image of a portion of the wafer. The image analysis device may binarize the image of the portion of the wafer to create a binarized image of the portion of the wafer. The image analysis device may determine a bump pattern, associated with the plurality of wafer bumps, based on the binarized image of the portion of the wafer. The image analysis device may perform a defect analysis of the determined bump pattern. The defect analysis may be associated with detecting regions of the portion of the wafer in which one or more wafer bumps have abnormal bump heights.

Abstract: In some embodiments, the present disclosure relates to a wafer edge trimming apparatus that includes a processing chamber defined by chamber housing. Within the processing chamber is a wafer chuck configured to hold onto a wafer structure. Further, a blade is arranged near an edge of the wafer chuck and configured to remove an edge potion of the wafer structure and to define a new sidewall of the wafer structure. A laser sensor apparatus is configured to direct a laser beam directed toward a top surface of the wafer chuck. The laser sensor apparatus is configured to measure a parameter of an analysis area of the wafer structure. Control circuitry is to the laser sensor apparatus and the blade. The control circuitry is configured to start a damage prevention process when the parameter deviates from a predetermined threshold value by at least a predetermined shift value.

Abstract: A semiconductor device includes a circuit layer and a nanopore layer. The nanopore layer is formed on the circuit layer and is formed with a pore therethrough. The circuit layer includes a circuit unit configured to drive a biomolecule through the pore and to detect a current associated with a resistance of the nanopore layer, whereby a characteristic of the biomolecule can be determined using the currents detected by the circuit unit.

Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.

Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

Abstract: A method for object detection includes: extracting a plurality of identification features from a plurality of reference images that are related to a target object; selecting a plurality of selected identification features respectively from the identification features so as to obtain a first feature dataset, and storing the first feature dataset, a quantity of selected identification features being smaller than a quantity of the identification features; in response to receipt of a to-be-detected image, performing a feature extraction operation on the to-be-detected image to obtain a second feature dataset; performing a similarity determination operation with respect to the to-be-detected image based on the first feature dataset and the second feature dataset, and calculating a quantity of instances of the target object in the to-be-detected image.

Abstract: A heat dissipation structure assembly includes an elastic limiting member, a thermal grease wall, a fitting member, a phase-change metal, and an assembling plate. The elastic limiting member is adapted to be disposed at a periphery of a heat source. The thermal grease wall is adapted to be in contact with the periphery of the heat source. The fitting member is in contact with the thermal grease wall and engaged with the elastic limiting member. The phase-change metal is adapted to be filled into a region among the fitting member, the thermal grease wall, and the heat source. When a temperature of the phase-change metal exceeds a critical temperature, a state of the phase-change metal is changed to a liquid state. The assembling plate is connected to the fitting member, and the assembling plate is in contact with the thermal grease wall.

Abstract: A method for automatically placing a to-be-packed object into a container that defines an accommodation space is provided. A processing unit obtains an object dimension data piece that indicates dimensions of the to-be-packed object, and obtains, through a camera unit that captures images of the to-be-packed object and the accommodation space, an unoccupied area related to the accommodation space. Based on the object dimension data piece and the unoccupied area, the processing unit determines whether the container is capable of accommodating the to-be-packed object.

Abstract: There is provided a method for picking up an object from a bin to be implemented by a robotic arm including a controller and a picking-up module. The method includes: recognizing, by the controller, at least one object in the bin based on an image of an interior of the bin so as to determine a type of each object; determining, by the controller, a score for each object based on the type thereof; determining, by the controller, whether a greatest score among the score(s) of the at least one TBT object is greater than a predetermined value; and by the picking-up module, picking up one of the at least one TBT object that has the greatest score when it is determined that the greatest score is greater than the predetermined value.

Abstract: A method includes steps of: capturing an image of a container; recognizing at least one object in the container based on the image; determining at least one first coordinate set corresponding to the at least one object; determining at least one second coordinate set that corresponds to target one (s) of the at least one first coordinate set and that relates to a fixed picking device of a robotic arm; adjusting position(s) of unfixed picking device(s) of the robotic arm if necessary; controlling the robotic arm to pick up one (s) of the at least one object that correspond(s) to the at least one second coordinate set with the fixed picking device and/or at least one unfixed picking device.

Abstract: A heat dissipation structure assembly includes an elastic limiting member, a paste-type heat dissipation wall, a fitting member, a phase-change metal, and an assembling plate. The elastic limiting member is adapted to be disposed at a periphery of a heat source. The paste-type heat dissipation wall is adapted to be in contact with the periphery of the heat source. The fitting member is in contact with the paste-type heat dissipation wall and engaged with the elastic limiting member. The phase-change metal is adapted to be filled into a region among the fitting member, the paste-type heat dissipation wall, and the heat source. When a temperature of the phase-change metal exceeds a critical temperature, a state of the phase-change metal is changed to a liquid state. The assembling plate is connected to the fitting member, and the assembling plate is in contact with the paste-type heat dissipation wall.

Abstract: A heat dissipation system of a portable electronic device including a first processing element, a second processing element, a heat dissipation module located between the first processing element and the second processing element, a first heat transferring member, and a second heat transferring member, is provided. The first processing element has a first region and a second region. The first heat transferring member is in thermal contact with the first region, the second processing element, and the heat dissipation module. The second heat transferring member is in thermal contact with the second region and the heat dissipation module.

Abstract: There is provided a method for picking up an object from a bin to be implemented by a robotic arm including a controller and a picking-up module. The method includes: recognizing, by the controller, at least one object in the bin based on an image of an interior of the bin so as to determine a type of each object; determining, by the controller, a score for each object based on the type thereof; determining, by the controller, whether a greatest score among the score(s) of the at least one TBT object is greater than a predetermined value; and by the picking-up module, picking up one of the at least one TBT object that has the greatest score when it is determined that the greatest score is greater than the predetermined value.

Abstract: A transferring system for transferring an object disposed in a storage area includes telescopic units, sucking disc units respectively connected to the telescopic units, and a control unit. The control unit calculates an area related to an object according to an image obtained by an imaging unit, and calculates a value of N based on the area. The value of N is a number of the sucking disc units used for picking up the object and is equal to or greater than one. The control unit determines N positions on the object, controls N telescopic units to move N sucking disc units toward the N positions, and controls the N sucking disc units to adhere respectively to the N positions so as to pick up the object from the storage area.

Abstract: A method of automated order picking is provided. A control device uses camera devices and a code reader unit to acquire identification codes and volumes of multiple objects when controlling a robotic arm to bring the objects from a first platform to a second platform one by one. Upon determining that the objects on the second platform include all order items of an order based on the identification codes, the control devices selects a packing box that fits the order items in volume, and controls another robotic arm to take the order items from the second platform to the packing box.

Abstract: A transferring system for transferring an object disposed in a storage area includes telescopic units, sucking disc units respectively connected to the telescopic units, and a control unit. The control unit calculates an area related to an object according to an image obtained by an imaging unit, and calculates a value of N based on the area. The value of N is a number of the sucking disc units used for picking up the object and is equal to or greater than one. The control unit determines N positions on the object, controls N telescopic units to move N sucking disc units toward the N positions, and controls the N sucking disc units to adhere respectively to the N positions so as to pick up the object from the storage area.