Abstract: A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.

Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

Abstract: Aspects of the disclosure provide a frame processor for processing frames with aliasing artifacts. For example, the frame processor can include a super-resolution (SR) and anti-aliasing (AA) engine and an attention reference frame generator coupled to the SR and AA engine. The SR and AA engine can be configured to enhance resolution and remove aliasing artifacts of a frame to generate a first high-resolution frame with aliasing artifacts and a second high-resolution frame with aliasing artifacts removed. The attention reference frame generator can be configured to generate an attention reference frame based on the first high-resolution frame and the second high-resolution frame.

Abstract: A semiconductor device includes a circuit layer and a nanopore layer. The nanopore layer is formed on the circuit layer and is formed with a pore therethrough. The circuit layer includes a circuit unit configured to drive a biomolecule through the pore and to detect a current associated with a resistance of the nanopore layer, whereby a characteristic of the biomolecule can be determined using the currents detected by the circuit unit.

Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

Abstract: A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.

Abstract: A high frequency vertical spring probe is provided in the present invention. The probe includes an unclosed ring structure having a gap disposed therein to provide an elastic property for vertical deformation. At least a first contacting component and a second contacting component are disposed on the ring structure of the probe to provide electrical connection of an external component when the probe is compressed. The first contacting component is located near two terminals of the ring structure adjacent to the gap and the second contacting component is disposed vertically corresponding to the first contacting component. The probe can serve as the electrical connection between two components or can be installed in the probe card to provide chip testing with high-frequency, high-speed and good-contacting environment.

Abstract: The invention provides a high-frequency vertical spring probe card structure including a plurality of probes. Each of the probes includes at least one conducting layer and at least one insulating layer. The conducting layer includes a first contact end and a second contact end used for electrically contacting an external component while the probe is compressed and includes a probe body including at least one plate portion and at least one resilient portion connected to each other. The plate portion is used for supporting deformation of the resilient portion while the resilient portion is compressed vertically. The insulating layer includes at least one plate member tightly attached to the plate portion of the conducting layer correspondingly. The probe structure of the invention is simple and can be formed as multi-layer stack structure by electroplating through Lithographie GaVanoformung Abformung (LIGA) technology.

Abstract: A high frequency vertical spring probe is provided in the present invention. The probe includes an unclosed ring structure having a gap disposed therein to provide an elastic property for vertical deformation. At least a first contacting component and a second contacting component are disposed on the ring structure of the probe to provide electrical connection of an external component when the probe is compressed. The first contacting component is located near two terminals of the ring structure adjacent to the gap and the second contacting component is disposed vertically corresponding to the first contacting component. The probe can serve as the electrical connection between two components or can be installed in the probe card to provide chip testing with high-frequency, high-speed and good-contacting environment.

Abstract: A method for manufacturing a multicolored three-dimensional candy has the steps of heating materials, mixing pigment with the heated materials, injecting the mixed materials into a mold, adding a supplementary material to the mold, cooling to form a product and releasing the product from the mold. Since the materials are divided in parts into inject into different areas of the mold, the multicolored three-dimensional candy manufactured by the method has different areas with different depths, contours, shapes and colors. The appearance of the candy can attract customers to buy it.

Abstract: A mold for making confections mainly includes a main body made of a flexible material and provided at one surface with a recess. The recess may show different shapes and is provided on an inner bottom surface with raised and depressed portions matching with the shape of the recess, dams lower than a top of the recess to divide the recess into several separated areas, and fine engraving ribs lower than the dams to show different curves or straight lines. Materials of different colors are separately poured into the separated areas in the recess to a level lower than the dams, and a binding stratum is formed between tops of the dams and the recess. After the materials and the binding stratum are set to form a molded confection, the main body is inverted and bent upward to separate the molded confection from the mold.