Abstract: The present disclosure, in some embodiments, relates to an integrated chip structure. The integrated chip structure includes a first substrate having a first horizontally extending surface and a second horizontally extending surface above the first horizontally extending surface as viewed in a cross-sectional view. The first horizontally extending surface continuously wraps around an outermost perimeter of the second horizontally extending surface in a closed loop as viewed in a plan-view. A second substrate is disposed over the first substrate and includes a third horizontally extending surface above the second horizontally extending surface as viewed in the cross-sectional view. The second horizontally extending surface continuously wraps around an outermost perimeter of the third horizontally extending surface in a closed loop as viewed in the plan-view.

Abstract: A load port receives a wafer carrier. An equipment front end module (EFEM) transfers semiconductor wafers to and from the wafer carrier via an access opening of a housing of the EFEM, and also transfers wafers to and from a semiconductor processing or characterization tool. A gas flow device disposed inside the housing of the EFEM is connected to receive a low humidity gas having relative humidity of 10% or less, and is positioned to flow the received low humidity gas across the access opening. A saturated pressure layer of the gas flow device has a permeability for the low humidity gas that increases with increasing distance from a gas inlet edge of the saturated pressure layer, for example due to holes of varying diameter and/or density passing through the saturated pressure layer. A filter layer of the gas flow device uniformizes the gas exiting the saturated pressure layer.

Abstract: A portable robotic semiconductor pod loader may detect, with at least one sensor, receipt of a semiconductor pod on a load port of the portable robotic semiconductor pod loader. The at least one sensor is supported by the load port. The portable robotic semiconductor pod loader may cause a robot, of the portable robotic semiconductor pod loader, to align with the semiconductor pod provided on the load port. The portable robotic semiconductor pod loader may cause the robot to attach to the semiconductor pod, and may cause the robot to provide the semiconductor pod from the load port to a staging area of a semiconductor processing tool.

Abstract: A plurality of purge nozzles of a purge load port include a nozzle gasket and a nozzle structure to inject a purging fluid into and through an internal chamber of a container (e.g., a FOUP) that is configured to, in operation, transport wafers or workpieces between various locations within a FAB. The nozzle gasket includes a deformable structure that abuts against a surface of a nozzle structure and a sealing structure opposite to the deformable structure that forms a seal between the container and the nozzle gasket. A nozzle hole of a nozzle of the nozzle structure includes a threaded region or portion that is configured to receive a threaded stopper structure to seal off the nozzle hole.

Abstract: A load port is capable of monitoring various environmental parameters associated with a transport carrier to minimize and/or prevent exposure of the semiconductor substrates therein to increased humidity, increased oxygen, increased vibration, and/or one or more other elevated environmental conditions that might otherwise contaminate the semiconductor substrates, damage the semiconductor substrates, and/or cause processing defects. For example, the load port may monitor the environmental parameters as indicators of a potential blockage of a diffuser of the transport carrier, and a relief valve may be used to divert a gas away from the transport carrier based on a determination that a diffuser blockage has occurred. In this way, the gas may be diverted through the relief valve and away from the transport carrier to prevent increased humidity, contaminants, and/or vibration from contaminating and/or damaging the semiconductor substrates.

Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

Abstract: A multiple transport carrier docking device may be capable of storing and/or staging a plurality of transport carriers in a chamber of the multiple transport carrier docking device, and may be capable of forming an air-tight seal around a transport carrier in the chamber. Semiconductor wafers in the transport carrier may be accessed by a wafer transport tool while the air-tight seal around the transport carrier prevents and/or reduces the likelihood that contaminants in the semiconductor fabrication facility will reach the semiconductor wafers. The air-tight seal around the transport carrier may reduce defects of the semiconductor wafers that might otherwise be caused by the contaminants, may increase manufacturing yield and quality in the semiconductor fabrication facility, and/or may permit the continued reduction in device and/or feature sizes of integrated circuits and/or semiconductor devices that are to be formed on semiconductor wafers.

Abstract: A portable robotic semiconductor pod loader may detect, with at least one sensor, receipt of a semiconductor pod on a load port of the portable robotic semiconductor pod loader. The at least one sensor is supported by the load port. The portable robotic semiconductor pod loader may cause a robot, of the portable robotic semiconductor pod loader, to align with the semiconductor pod provided on the load port. The portable robotic semiconductor pod loader may cause the robot to attach to the semiconductor pod, and may cause the robot to provide the semiconductor pod from the load port to a staging area of a semiconductor processing tool.

Abstract: A method of cleaning a semiconductor wafer includes: loading a semiconductor wafer into a cell having an annular trough; moving a plurality of nozzles into operational orientations for spraying a cleaning solution onto a top surface of the loaded semiconductor wafer; spraying the cleaning solution from each nozzle onto the top surface of the loaded semiconductor wafer in a direction defined by each nozzle's operational orientation such that a patterned flow of cleaning solution is formed on the top surface of the loaded semiconductor wafer; and collecting the cleaning solution in the annular trough of the cell as it flows off the top surface of the loaded semiconductor wafer.

Abstract: Base plates of a substrate retainer transportation mechanism are provided with damping members to assist elastic members in damping and limiting movement of the substrate retainer transportation mechanism when the substrate transportation mechanism is subjected to unwanted external forces, e.g., seismic forces. By damping and limiting movement of the substrate retainer transportation mechanism, undesirable damage to substrates contained in a substrate retainer being carried by the substrate retainer transport mechanism can be minimized.

Abstract: A system includes a loader tool to load a plate to which a sandpaper sheet is to be affixed to a surface of the plate. The system includes a sandpaper affixing tool to remove a liner from the sandpaper sheet to expose an adhesive surface of the sandpaper sheet, and to affix the sandpaper sheet to the surface of the plate using the adhesive surface of the sandpaper sheet. The system includes a flatness detector to determine whether a surface of the sandpaper sheet is sufficiently flat after the sandpaper sheet is affixed to the surface of the plate. The system includes an unloader tool to store the plate after the sandpaper sheet is affixed to the surface of the plate.

Abstract: The present disclosure relates to methods for inserting a fastener into a wafer-carrying pod. The system includes a robotic arm with a screw tool assembly disposed at the far end of the robotic arm. The screw tool assembly includes a lower sleeve configured to receive a fastener. A screwdriver is disposed within an upper sleeve of the screw tool assembly, and a motor is provided to rotate the screwdriver. In use, the screw tool assembly is positioned over the fastener so the lower sleeve surrounds the fastener and the screwdriver engages the fastener. The fastener head is received within the lower sleeve, and the screwdriver screws the fastener into the pod.

Abstract: The present disclosure relates to systems and methods for affixing and/or removing a fastener from a wafer-carrying pod. The system includes a robotic arm with a screw tool assembly disposed at the far end of the robotic arm. The screw tool assembly includes a lower sleeve configured to receive a fastener. A screwdriver is disposed within an upper sleeve of the screw tool assembly, and a motor is provided to rotate the screwdriver. In use, the screw tool assembly is positioned over the fastener so the lower sleeve surrounds the fastener and the screwdriver engages the fastener. The screwdriver unscrews the fastener from the pod, and the fastener head is received within the lower sleeve.

Abstract: A system comprising a mini-environment and an air flow optimizer device to control air into the environment. An air flow optimizer device includes a modification device including the inlet opening and the outlet opening and at least one extension plate extending downward from the modification device. In some implementations, at least one extension plate is longer than a FOUP in a first direction. In an embodiment, the channel decreases in width from the inlet opening to the outlet opening.

Abstract: A load port is capable of monitoring various environmental parameters associated with a transport carrier to minimize and/or prevent exposure of the semiconductor substrates therein to increased humidity, increased oxygen, increased vibration, and/or one or more other elevated environmental conditions that might otherwise contaminate the semiconductor substrates, damage the semiconductor substrates, and/or cause processing defects. For example, the load port may monitor the environmental parameters as indicators of a potential blockage of a diffuser of the transport carrier, and a relief valve may be used to divert a gas away from the transport carrier based on a determination that a diffuser blockage has occurred. In this way, the gas may be diverted through the relief valve and away from the transport carrier to prevent increased humidity, contaminants, and/or vibration from contaminating and/or damaging the semiconductor substrates.

Abstract: In some implementations, a reeling device may receive material via a receiving end of a set of guiding blocks positioned around a reel. The set of guiding blocks are configured with an opening at the receiving end and with one or more inner surfaces configured to guide the material on a path around a surface of the reel. The one or more inner surfaces of the set of guiding blocks are arc-shaped to generally follow the surface of the reel. The reeling device may operate a motor that rotates the reel in a loading direction to facilitate loading the material onto the reel. The set of guiding blocks travel generally away from the surface of the reel based on the material being received and/or the motor operating in the loading direction.

Abstract: An airflow detection device is capable of detecting airflow issues associated with a transport carrier, such as a blockage of a diffuser in a transport carrier or leakage of a transition bracket, among other examples. The airflow detection device includes an air tunnel through which a gas in a transport carrier may flow. The airflow detection device includes an airflow sensor configured to generate airflow data based on a flow of the gas through the air tunnel. In some implementations, the airflow detection device is included in an airflow detection system to perform automated measurements and to determine, identify, and/or detect airflow issues associated with a transport carrier. In this way, the airflow detection system may perform one or more automated actions (or may cause one or more other devices to perform one or more automated actions) based on a detection of a diffuser blockage or a transition bracket leak.

Abstract: A system comprises a front opening universal pod (FOUP) configured to hold one or more semiconductor wafers and a load dock having a stage and a receiving portion extending above the stage. The FOUP is positioned on the stage. A fan filter unit (FFU) positioned above the load dock. An air flow optimizer device is disposed on the receiving portion and under the FFU. The air flow optimizer device has an inlet opening and an outlet opening and a channel extends between the inlet opening and the outlet opening.

Abstract: The present disclosure relates to systems and methods for reducing the humidity within a FOUP (Front Opening Unified Pod) when loaded on an EFEM (Equipment Front End Module) for transfer of a semiconductor wafer substrate during fabrication processes. A deflector of specified structure is placed inside the EFEM above the load port of the FOUP. The deflector directs airflow in the EFEM away from the load port. The deflector includes a body with a plurality of apertures in the deflector body, and with a sloped front surface. Thus, the degree of penetration of high-humidity air from the EFEM into the FOUP is reduced.

Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.