Abstract: An electronic device is provided, including a main body and a camera module. The camera module has a frame, a lens unit disposed in the frame, a guiding member, and a hinge. The guiding member is affixed to the main body and has a rail and a spring sheet. The hinge pivotally connects to the frame and the guiding member. When the camera module is in the retracted position, the camera module is hidden in a recess of the main body. When the camera module slides out of the recess from the retracted position along the rail into the operational position, the spring sheet is pressed by the hinge to increase the friction between the hinge and the guiding member.

Abstract: Disclosed are a time delay integration (TDI)-based image sensor and an imaging method thereof. The TDI-based image sensor includes: a multi-stage linear array including a plurality of single-stage linear arrays arranged along a scanning direction of the image sensor. Each single-stage linear array includes a plurality of pixels arranged along the linear array direction. Each single-stage linear array enters a count mode in response to a first control signal, and enters a transfer mode in response to a second control signal. In the count mode, each single-stage linear array counts optical signals incident on the pixels and obtains a count value, and in the transfer mode, each single-stage linear array stops counting, except for the last single-stage linear array, other single-stage linear arrays each output the obtained current count value to the next single-stage linear array, and the last single-stage linear array outputs the obtained current count value.

Abstract: A leak detection sensor is disclosed for detecting a leaking liquid spilled from an adapter-coupling position, and includes a first conductive layer, an insulator and a second conductive layer. The first conductive layer includes a first through hole. The adapter-coupling position is located adjacent to the first through hole. The insulator includes a second through hole. The second conductive layer is connected to the first conductive layer through the insulator, and includes a conducting surface in fluid communication with the adapter-coupling position through the second through hole and the first through hole. The first conductive layer and the second conductive layer are insulated from each other through the insulator. When the leaking liquid is spilled into the first through hole and the second through hole, and contacts the conducting surface, the second conductive layer is conducted to the first conductive layer to form a conducting-resistance value.

Abstract: A touch pad structure includes a base, a guiding component rotatably disposed on the base, a touch pad disposed above the base, and a switch. The guiding component is located between the base and the touch pad. The touch pad has an inner surface facing the base. Here, the switch is disposed on the inner surface, and a guiding structure is disposed on the inner surface. The guiding structure is slidably connected to the guiding component. The touch pad moving toward the base drives the guiding component to rotate relative to the base through the guiding structure, and the touch pad moves along a vertical direction.

Abstract: A leak detection sensor is disclosed for detecting a leaking liquid spilled from an adapter-coupling position, and includes a first conductive layer, an insulator and a second conductive layer. The first conductive layer includes a first through hole. The adapter-coupling position is located adjacent to the first through hole. The insulator includes a second through hole. The second conductive layer is connected to the first conductive layer through the insulator, and includes a conducting surface in fluid communication with the adapter-coupling position through the second through hole and the first through hole. The first conductive layer and the second conductive layer are insulated from each other through the insulator. When the leaking liquid is spilled into the first through hole and the second through hole, and contacts the conducting surface, the second conductive layer is conducted to the first conductive layer to form a conducting-resistance value.

Abstract: An electronic device is provided, including a main body and a camera module. The camera module has a frame, a lens unit disposed in the frame, a guiding member, and a hinge. The guiding member is affixed to the main body and has a rail and a spring sheet. The hinge pivotally connects to the frame and the guiding member. When the camera module is in the retracted position, the camera module is hidden in a recess of the main body. When the camera module slides out of the recess from the retracted position along the rail into the operational position, the spring sheet is pressed by the hinge to increase the friction between the hinge and the guiding member.

Abstract: A touch pad structure includes a base, a guiding component rotatably disposed on the base, a touch pad disposed above the base, and a switch. The guiding component is located between the base and the touch pad. The touch pad has an inner surface facing the base. Here, the switch is disposed on the inner surface, and a guiding structure is disposed on the inner surface. The guiding structure is slidably connected to the guiding component. The touch pad moving toward the base drives the guiding component to rotate relative to the base through the guiding structure, and the touch pad moves along a vertical direction.

Abstract: An apparatus and a method for monitoring the relative relationship between the wafer and the chuck is provided, especially for monitoring whether the wafer is sticky on the chuck when the wafer is de-chucked. The lift pins may be extended outside the chuck to separate the wafer and the chuck when the wafer is de-chucked. By detecting the capacitance between the de-chucked wafer and the chuck, especially by comparing the detected capacitance with the capacitance that the wafer is held by the chuck, one may determine whether the wafer is sticky on the chuck, or even whether the wafer is properly supported by the lift pins. Accordingly, an early alarm may be issued if the wafer is sticky or improperly removed. Besides, by controlling a switch electrically connected to a lift pin that contacted the wafer, the charges at the wafer may be eliminated.

Abstract: A photosensitive detector includes an array of detection units, each detection unit having a light-sensing transistor (1), a charge storage transistor (2) and a reading transistor (3), or comprising a light-sensing transistor, a charge transfer transistor (4), a charge storage transistor and a reading transistor. The light-sensing transistor is configured to realize the light-sensing function of the photosensitive detector; the charge storage transistor is configured to store photogenerated charges; the reading transistor is configured to read a signal; and, the charge transfer transistor is configured to control the transfer of the photogenerated charges. The photosensitive detector can realize global shutter and fast reading, and is compatible with the existing floating gate CMOS process, and the failure of any pixel will not affect the normal operation of the whole imaging array.

Abstract: A two-by-two array consists of four pixels. Each pixel comprises one light-sensing transistor and one reading transistor. Both the light sensing transistor and the reading transistor are formed above a same P-type semiconductor substrate, and have a composite dielectric gate structure. The substrates of the four reading transistors are connected to form a regular octagonal ring structure located in the center of the array. On four sides of the regular octagonal ring structure, four heavily-doped N+ regions are formed on the substrates not covered with the composite dielectric gate, of which every two regions are opposite to each other and form right angles, wherein two opposite heavily-doped N+ regions are connected to form a shared N+ source, and the other two are connected to form a shared N+ drain.

Abstract: An apparatus and a method for monitoring the relative relationship between the wafer and the chuck is provided, especially for monitoring whether the wafer is sticky on the chuck when the wafer is de-chucked. The lift pins may be extended outside the chuck to separate the wafer and the chuck when the wafer is de-chucked. By detecting the capacitance between the de-chucked wafer and the chuck, especially by comparing the detected capacitance with the capacitance that the wafer is held by the chuck, one may determine whether the wafer is sticky on the chuck, or even whether the wafer is properly supported by the lift pins. Accordingly, an early alarm may be issued if the wafer is sticky or improperly removed. Besides, by controlling a switch electrically connected to a lift pin that contacted the wafer, the charges at the wafer may be eliminated.

Abstract: A photosensitive detection unit has a composite dielectric gate MOS-C portion and a composite dielectric gate MOSFET portion. The two portions are formed above a same P-type semiconductor substrate, and share a charge coupled layer. A plurality of the photosensitive detection units are arranged on a same P-type semiconductor substrate in form of an array to obtain a detector. Adjacent unit pixels in the detector are isolated by deep trench isolation regions and P+-type injection regions below the isolation regions. During the detection, the P-type semiconductor substrate in the composite dielectric gate MOS-C portion senses light and then couples photoelectrons to the charge coupled layer, and photoelectronic signals are read by the composite dielectric gate MOSFET portion.

Abstract: A two-by-two array consists of four pixels. Each pixel comprises one light-sensing transistor and one reading transistor. Both the light sensing transistor and the reading transistor are formed above a same P-type semiconductor substrate, and have a composite dielectric gate structure. The substrates of the four reading transistors are connected to form a regular octagonal ring structure located in the center of the array. On four sides of the regular octagonal ring structure, four heavily-doped N+ regions are formed on the substrates not covered with the composite dielectric gate, of which every two regions are opposite to each other and form right angles, wherein two opposite heavily-doped N+ regions are connected to form a shared N+ source, and the other two are connected to form a shared N+ drain.

Abstract: An apparatus and a method for monitoring the relative relationship between the wafer and the chuck is provided, especially for monitoring whether the wafer is sticky on the chuck when the wafer is de-chucked. The lift pins may be extended outside the chuck to separate the wafer and the chuck when the wafer is de-chucked. By detecting the capacitance between the de-chucked wafer and the chuck, especially by comparing the detected capacitance with the capacitance that the wafer is held by the chuck, one may determine whether the wafer is sticky on the chuck, or even whether the wafer is properly supported by the lift pins. Accordingly, an early alarm may be issued if the wafer is sticky or improperly removed. Besides, by controlling a switch electrically connected to a lift pin that contacted the wafer, the charges at the wafer may be eliminated.

Abstract: A photosensitive detector includes an array of detectin units, each detection unit having a light-sensing transistor (1), a charge storage transistor (2) and a reading transistor (3), or comprising a light-sensing transistor, a charge transfer transistor (4), a charge storage transistor and a reading transistor. The light-sensing transistor is configured to realize the light-sensing function of the photosensitive detector; the charge storage transistor is configured to store photogenerated charges; the reading transistor is configured to read a signal; and, the charge transfer transistor is configured to control the transfer of the photogenerated charges. The photosensitive detector can realize global shutter and fast reading, and is compatible with the existing floating gate CMOS process, and the failure of any pixel will not affect the normal operation of the whole imaging array.

Abstract: The present disclosure provides an electronic device that includes a display device. A first panoramic image capturing device is movably configured on the display surface of the display device. A second panoramic image capturing device is movably configured on a back panel relative to the display surface. A drive unit is configured to push the first panoramic image capturing device out of the electronic device along a first direction perpendicular to the display surface and push the second panoramic image capturing device out of the electronic device along a second direction, which is opposite to the first direction, when receiving a first signal. The drive unit is configured to pull the first panoramic image capturing device back to the electronic device along the second direction and pull the second panoramic image capturing device back to the electronic device along the first direction when receiving a second signal.

Abstract: Provided is a novel active noise control biosensor including a detection plate, a signal detection module and a control module. The signal detection module includes a signal superimposable transistor and a readout circuit. The signal superimposable transistor has a secondary input terminal and a primary input terminal. The detection plate inputs a detected primary signal to the primary input terminal, and the control module processes an output signal from the signal detection module by a signal processing system and generates and inputs a secondary signal to the secondary input terminal. The primary signal and the secondary signal received by the signal superimposable transistor are superimposed to realize active noise control, and the superimposed signal is read out by the readout circuit and output as an input signal to the control module. The biosensor can achieve the detection of potential or charges and have active noise control characteristics.

Abstract: An electronic device including a display, a host, a hinge, a panoramic camera, a linkage assembly and a torsion spring is provided. The display has a plane facing the host. The hinge is connected between the display and the host. The panoramic camera is disposed in an accommodating space on an upper side of the display and is rotatable relative to the display. The linkage assembly is disposed in the display and driven by the hinge to limit the panoramic camera, such that the panoramic camera is kept in a state of being protruded from the plane of the display, and the torsion spring is disposed on a lower portion of the panoramic camera, wherein when the display is closed relative to the host, the hinge drives the linkage assembly to release the limitation on the panoramic camera, and the torsion spring enables the panoramic camera to be restored to the original position.