Patents by Inventor Cheng-Ming Hsu

Cheng-Ming Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7560812
    Abstract: An electronic assembly includes a substrate, a chip, a conductive fence and a heat sink. The substrate has a bonding surface. The chip is bonded to the bonding surface. The conductive fence connects the bonding surface and at least locally surrounds the sides of the chip. The heat sink is disposed over the substrate and contacts the chip and the conductive fence. By disposing the conductive fence between the substrate and the heat sink, the conductive fence and the heat sink can further function as the shields of the chip to reduce any adverse influence of an ESD current on the chip.
    Type: Grant
    Filed: October 30, 2006
    Date of Patent: July 14, 2009
    Assignee: VIA Technologies, Inc.
    Inventors: Kevin Kuo, Stanley Huang, Cheng-Ming Hsu, Neng-An Kuo
  • Patent number: 7330355
    Abstract: A fixed pillar with heat loss is a fixed pillar for losing heat. The fixed pillar with heat loss includes a metal body, a screw thread and a plurality of grooves. The metal body is a hollow body. The plurality of grooves is respectively set on two sides of the metal body and communicating with each other. The screw thread is set on one end of the metal body to fix a circuit or other electric devices. Air flows into one side of the metal body and then passes through the inner part of the metal body and last flow out from another side of the metal body. Accordingly, the metal body exchanges heat with the air to lose the thermal energy quickly.
    Type: Grant
    Filed: April 14, 2005
    Date of Patent: February 12, 2008
    Assignee: Via Technologies Inc.
    Inventors: Yi-Cheng Kuo, Chi-Chang Chang, Cheng-Ming Hsu
  • Publication number: 20080012123
    Abstract: An electronic assembly includes a substrate, a chip, a conductive fence and a heat sink. The substrate has a bonding surface. The chip is bonded to the bonding surface. The conductive fence connects the bonding surface and at least locally surrounds the sides of the chip. The heat sink is disposed over the substrate and contacts the chip and the conductive fence. By disposing the conductive fence between the substrate and the heat sink, the conductive fence and the heat sink can further function as the shields of the chip to reduce any adverse influence of an ESD current on the chip.
    Type: Application
    Filed: October 30, 2006
    Publication date: January 17, 2008
    Applicant: VIA TECHNOLOGIES, INC.
    Inventors: Kevin Kuo, Stanley Huang, Cheng-Ming Hsu, Neng-An Kuo
  • Publication number: 20060215370
    Abstract: A fixed pillar with heat loss is a fixed pillar for losing heat. The fixed pillar with heat loss includes a metal body, a screw thread and a plurality of grooves. The metal body is a hollow body. The plurality of grooves is respectively set on two sides of the metal body and communicating with each other. The screw thread is set on one end of the metal body to fix a circuit or other electric devices. Air flows into one side of the metal body and then passes through the inner part of the metal body and last flow out from another side of the metal body. Accordingly, the metal body exchanges heat with the air to lose the thermal energy quickly.
    Type: Application
    Filed: April 14, 2005
    Publication date: September 28, 2006
    Inventors: Yi-Cheng Kuo, Chi-Chang Chang, Cheng-Ming Hsu
  • Patent number: 5642404
    Abstract: A clasp structure of a cellular phone and its battery set includes a cellular phone and a battery set. The battery set includes a case and a battery base. On the battery case there is a clasp component which uses the elasticity of a spring component to join and to separate the cellular phone and the battery set. When the battery has exhausted its power, the user pushes the clasp component to make the battery set separate from the cellular phone.
    Type: Grant
    Filed: November 13, 1995
    Date of Patent: June 24, 1997
    Inventor: Cheng-Ming Hsu