Patents by Inventor Cheng Nam Lee

Cheng Nam Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of shielding a connector module from electromagnetic interference with elongate members of conductive material and related apparatus
    Patent number: 8157593
    Abstract: An electronic communications equipment chassis has a panel with an aperture for receiving a connector module having at least one female jack. A plurality of elongate members of conductive material are attached to the panel, project into the aperture and form an EMI shield around the connector module.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: April 17, 2012
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Soon Peng Jason Sim, Cheng Nam Lee
  • Optimized memory allocation via feature extraction
    Patent number: 8108645
    Abstract: A method and system for recovering embedded system memory contained within an embedded system includes a software image in embedded system memory and identifying unneeded software features in the software image; identifying memory portions containing the unneeded software features; and reallocating the memory portions containing the unneeded features.
    Type: Grant
    Filed: June 26, 2008
    Date of Patent: January 31, 2012
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Robert R. Brodeur, Robert A. Nebeker, Cheng Nam Lee
  • Optimized Memory Allocation Via Feature Extraction
    Publication number: 20090327639
    Abstract: A method and system for recovering embedded system memory contained within an embedded system includes a software image in embedded system memory and identifying unneeded software features in the software image; identifying memory portions containing the unneeded software features; and reallocating the memory portions containing the unneeded features.
    Type: Application
    Filed: June 26, 2008
    Publication date: December 31, 2009
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Robert R. Brodeur, Robert A. Nebeker, Cheng Nam Lee