Patents by Inventor Cheng P. Pour

Cheng P. Pour has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • External gettering method and device
    Patent number: 10892202
    Abstract: Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound providing external gettering is also disclosed. Methods of fabricating such devices are also disclosed.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: January 12, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Michael Tan, Cheng P. Pour
  • EXTERNAL GETTERING METHOD AND DEVICE
    Publication number: 20190341321
    Abstract: Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound providing external gettering is also disclosed. Methods of fabricating such devices are also disclosed.
    Type: Application
    Filed: July 15, 2019
    Publication date: November 7, 2019
    Inventors: Michael Tan, Cheng P. Pour
  • External gettering method and device
    Patent number: 10453761
    Abstract: Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound providing external gettering is also disclosed. Methods of fabricating such devices are also disclosed.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: October 22, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Michael Tan, Cheng P. Pour
  • EXTERNAL GETTERING METHOD AND DEVICE
    Publication number: 20170110381
    Abstract: Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound providing external gettering is also disclosed. Methods of fabricating such devices are also disclosed.
    Type: Application
    Filed: December 30, 2016
    Publication date: April 20, 2017
    Inventors: Michael Tan, Cheng P. Pour
  • External gettering method and device
    Patent number: 9543166
    Abstract: Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound providing external gettering is also disclosed. Methods of fabricating such devices are also disclosed.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: January 10, 2017
    Assignee: Micron Technology, Inc.
    Inventors: Michael Tan, Cheng P. Pour
  • EXTERNAL GETTERING METHOD AND DEVICE
    Publication number: 20160056051
    Abstract: Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound providing external gettering is also disclosed. Methods of fabricating such devices are also disclosed.
    Type: Application
    Filed: November 3, 2015
    Publication date: February 25, 2016
    Inventors: Michael Tan, Cheng P. Pour
  • External gettering method and device
    Patent number: 9177828
    Abstract: Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound providing external gettering is also disclosed. Methods of fabricating such devices are also disclosed.
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: November 3, 2015
    Assignee: Micron Technology, Inc.
    Inventors: Michael Tan, Cheng P. Pour
  • EXTERNAL GETTERING METHOD AND APPARATUS
    Publication number: 20120205821
    Abstract: Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound providing external gettering is also disclosed. Methods of fabricating such devices are also disclosed.
    Type: Application
    Filed: February 10, 2011
    Publication date: August 16, 2012
    Inventors: Michael Tan, Cheng P. Pour