Abstract: An integrated circuit assembly includes a semiconductor die, a copper coating disposed on a surface of the semiconductor die, a solder bond layer disposed on the copper coating, and a copper lid disposed on the solder bond layer.

Abstract: A thermal module may include a valve used to promote unidirectional flow. The valve may be formed from several flow barriers designed to provide minimal resistance to a refrigerant while flowing in one direction, but provide significant resistance to flow in the opposite direction. The thermal module may include a void. The refrigerant may flow or circulate in a loop around the void. Using the valve for unidirectional flow, a thermal module may provide enhanced thermal transport capabilities.

Abstract: A thermal management module for an integrated circuit assembly includes a housing defining a configured to receive a fluid and having a variable cross-sectional area. The thermal management module also includes a wick disposed within the sealed passage, where the wick forms pores configured to convey a liquid form of the fluid toward an evaporator section of the thermal management module. The thermal management module also includes a void formed within the sealed passage between the wick and a wall of the housing, wherein the void is configured to convey a vapor form of the fluid toward a condenser section of the thermal management module.

Abstract: The present disclosure is directed to thermal management and electromagnetic interference (EMI) shielding techniques for a system on a chip (SOC) device to reduce the thermal resistance between a SOC die of the SOC device and heat dissipation components, while still providing EMI shielding to components of the SOC device. For example, a SOC device may include an EMI mesh disposed on the SOC die. The EMI mesh includes a plurality of windows such that a thermal interface material (TIM) may extend through the plurality of windows and physically couple both the heat dissipation components (e.g., a spreader) and the SOC die while still providing EMI shielding to the SOC die.

Abstract: A head-mountable device can provide a cooling module that effectively manages heat while also minimizing noise, vibration, leakage, power consumption, size, and weight. To dissipate heat, the cooling module with a fan can be operated to move air through a chamber within the head-mountable device. An integrated heat sink can provide heat dissipation properties by drawing heat away from heat-generating components and into the chamber. The integrated heat sink can include a base plate that defines at least a portion of the chamber in which the blades of the fan are positioned. The integrated heat sink can further include fins between the chamber and an outlet. The fins can be integrated with the base plate to maximize heat dissipation and reduce the number of interfaces between separate parts.

Abstract: Systems and methods are provided for mitigating recirculation of backflow fluid through a fan. The fan includes a housing having a channel that extends from an inlet to an outlet of the housing. A rotor assembly is positioned within the channel and is configured to direct a fluid flow from the inlet to the outlet. The rotor assembly includes a hub, a plurality of fan blades, and a shroud disposed about a circumference of the fan blades, where a radial gap extends between the shroud and the housing. The radial gap is configured to receive a portion of the fluid flow from the outlet as backflow fluid. The rotor assembly also includes an inlet flange that is configured receive the backflow fluid from the radial gap and to direct the backflow fluid in a direction away from the inlet prior to discharge of the backflow fluid from the radial gap.

Abstract: Systems and methods are provided for mitigating recirculation of backflow fluid through a fan. The fan includes a housing having a channel that extends from an inlet to an outlet of the housing. A rotor assembly is positioned within the channel and is configured to direct a fluid flow from the inlet to the outlet. The rotor assembly includes a hub, a plurality of fan blades, and a shroud disposed about a circumference of the fan blades, where a radial gap extends between the shroud and the housing. The radial gap is configured to receive a portion of the fluid flow from the outlet as backflow fluid. The rotor assembly also includes an inlet flange that is configured receive the backflow fluid from the radial gap and to direct the backflow fluid in a direction away from the inlet prior to discharge of the backflow fluid from the radial gap.

Abstract: A composite memory device that includes different types of non-volatile memory devices, which have different performance characteristics, is described. This composite memory device may receive requests, a given one of which includes a command, a logical address for at least a block of data associated with the command, and a hint associated with the command. For the given request, the composite memory device executes the command on the block of data at the logical address in at least one of the types of non-volatile memory devices. Furthermore, the composite memory device conditionally executes the hint based on one or more criteria, such as: available memory in the types of non-volatile memory devices, traffic through an interface circuit in the composite memory device, operational states of the types of non-volatile memory devices, a target performance characteristic of the composite memory device, and an environmental condition of the composite memory device.

Abstract: Systems and methods for nonvolatile memory (“NVM”) performance throttling are disclosed. Performance of an NVM system may be throttled to achieve particular data retention requirements. In particular, because higher storage temperatures tend to reduce the amount of time that data may be reliably stored in an NVM system, performance of the NVM system may be throttled to reduce system temperatures and increase data retention time.

Abstract: Systems and methods for nonvolatile memory (“NVM”) performance throttling are disclosed. Performance of an NVM system may be throttled to achieve particular data retention requirements. In particular, because higher storage temperatures tend to reduce the amount of time that data may be reliably stored in an NVM system, performance of the NVM system may be throttled to reduce system temperatures and increase data retention time.

Abstract: Portable computer structures are provided. The portable computer structures may include hard drive mounting structures. The hard drive mounting structures may include elastomeric support members. Each elastomeric support member may have a relatively rigid inner portion. The inner portion may include a hole that receives a hard drive mounting pin. Each elastomeric support member may also have a relatively flexible outer portion. The relatively flexible outer portion may be mounted within an opening in a plastic support member. The rigid inner portion may have a square outline and may be mounted within a square opening in the flexible outer portion.

Abstract: A computer system that generates a disposition instruction and an associated access command directed to a block of data at a logical address is described. The disposition instruction and the access command are communicated to a memory system in the computer system via a communication link. Note that the memory system includes different types of memory having different performance characteristics, and the disposition instruction is generated based on the different performance characteristics. In response to the access command, the memory system accesses the block of data at the logical address in a first type of memory in the different types of memory. Furthermore, based on the disposition instruction, the memory system moves the block of data to a second type of memory in the different types of memory to facilitate subsequent accesses to the block of data.

Abstract: The described embodiments relate generally to control of rotational components in a computer system. In one embodiment, the rotational component includes a cooling fan assembly, the cooling fan assembly being controlled in accordance with resonant frequency avoidance data. The resonant frequency avoidance data being characteristic of the computer system such that when the cooling fan assembly operates in accordance with the resonant frequency avoidance data, the cooling fan assembly does not operate at a fan speed that is coincident with a natural resonant frequency of the computer system.

Abstract: The described embodiments relate generally to control of rotational components in a computer system. In one embodiment, the rotational component includes a cooling fan, the cooling fan being controlled in accordance with data tailored to reduce the acoustic noise produced by the cooling fan. In one embodiment, the cooling fan is operated with non-uniform pulse width modulated signals. The non-uniform pulse width modulated signals can be a function of desired rotation speed and can include fundamental and harmonic components.

Abstract: A composite memory device that includes different types of non-volatile memory devices, which have different performance characteristics, is described. This composite memory device may receive requests, a given one of which includes a command, a logical address for at least a block of data associated with the command, and a hint associated with the command. For the given request, the composite memory device executes the command on the block of data at the logical address in at least one of the types of non-volatile memory devices. Furthermore, the composite memory device conditionally executes the hint based on one or more criteria, such as: available memory in the types of non-volatile memory devices, traffic through an interface circuit in the composite memory device, operational states of the types of non-volatile memory devices, a target performance characteristic of the composite memory device, and an environmental condition of the composite memory device.

Abstract: A fan assembly for a computing device is disclosed. The device can include an impeller having a number of blades and a motor for turning the blades. The motor can turn the blades via a magnetic interaction between the impeller and the motor. A thrust bearing can be used to control a position of the impeller relative to the motor. In particular, the impeller can be configured to rotate around an axis and the thrust bearing can be used to control movement of the impeller in a direction aligned with the axis. In one embodiment, the impeller can be configured to generate aerodynamic forces, such as lift, and the parameters associated with the thrust bearing can be selected to counteract the aerodynamic forces so that the impeller remains within a desired positional range relative to the motor.

Abstract: Portable computer structures are provided. The portable computer structures may include hard drive mounting structures. The hard drive mounting structures may include elastomeric support members. Each elastomeric support member may have a relatively rigid inner portion. The inner portion may include a hole that receives a hard drive mounting pin. Each elastomeric support member may also have a relatively flexible outer portion. The relatively flexible outer portion may be mounted within an opening in a plastic support member. The rigid inner portion may have a square outline and may be mounted within a square opening in the flexible outer portion.

Abstract: Portable computer structures are provided. The portable computer structures may include hard drive mounting structures. The hard drive mounting structures may include elastomeric support members. Each elastomeric support member may have a relatively rigid inner portion. The inner portion may include a hole that receives a hard drive mounting pin. Each elastomeric support member may also have a relatively flexible outer portion. The relatively flexible outer portion may be mounted within an opening in a plastic support member. The rigid inner portion may have a square outline and may be mounted within a square opening in the flexible outer portion.

Abstract: A computer system that generates a disposition instruction and an associated access command directed to a block of data at a logical address is described. The disposition instruction and the access command are communicated to a memory system in the computer system via a communication link. Note that the memory system includes different types of memory having different performance characteristics, and the disposition instruction is generated based on the different performance characteristics. In response to the access command, the memory system accesses the block of data at the logical address in a first type of memory in the different types of memory. Furthermore, based on the disposition instruction, the memory system moves the block of data to a second type of memory in the different types of memory to facilitate subsequent accesses to the block of data.

Abstract: Some embodiments provide a system that manages the temperature of a component in an electronic device. During operation, the system receives, from the component, a temperature offset of the component and a thermal state boundary associated with the temperature offset. Next, the system uses the temperature offset and the thermal state boundary to control the temperature of the component.