Patents by Inventor Cheng Paug Chang

Cheng Paug Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6834711
    Abstract: A heat-radiating structure with low height, including a first heat-radiating plate and a second heat-radiating plate spaced above the first heat-radiating plate. The first heat-radiating plate is formed with multiple first perforations arranged at intervals and multiple first dents arranged at intervals and extending downward. The second heat-radiating plate is formed with multiple second perforations arranged at intervals and multiple second dents extending downward and fitted with the first perforations. A heat-generating body such as a CPU is adjacent to outer sides of the bottoms of the first and second dents. The heat-radiating structure has a height much smaller than that of a conventional vertical heat-radiating plate and a heat conducting area much larger than that of the vertical heat-radiating plate.
    Type: Grant
    Filed: April 30, 2003
    Date of Patent: December 28, 2004
    Inventors: Ming-Hwa Liu, Brian D. F. Chen, Cheng Paug Chang
  • Publication number: 20030205369
    Abstract: A heat-radiating structure with low height, including a first heat-radiating plate and a second heat-radiating plate spaced above the first heat-radiating plate. The first heat-radiating plate is formed with multiple first perforations arranged at intervals and multiple first dents arranged at intervals and extending downward. The second heat-radiating plate is formed with multiple second perforations arranged at intervals and multiple second dents extending downward and fitted with the first perforations. A heat-generating body such as a CPU is adjacent to outer sides of the bottoms of the first and second dents. The heat-radiating structure has a height much smaller than that of a conventional vertical heat-radiating plate and a heat conducting area much larger than that of the vertical heat-radiating plate.
    Type: Application
    Filed: April 30, 2003
    Publication date: November 6, 2003
    Inventors: Ming-Hwa Liu, Brian D.F. Chen, Cheng Paug Chang