Patents by Inventor Cheng-Piao Tung

Cheng-Piao Tung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic package and method for manufacturing the same
    Patent number: 11271313
    Abstract: An electronic package and a method for manufacturing the same are provided, where at least one substrate structure having a second antenna portion is disposed on a carrier structure having a first antenna portion, and then an antenna structure having a first antenna body and a second antenna body is stacked on the carrier structure by a plurality of supporting members to cover the first antenna portion and the second antenna portion, so that the first antenna body corresponds to the first antenna portion, and the second antenna body corresponds to the second antenna portion. The substrate structure is disposed on the carrier structure to generate 5G millimeter waves of different frequencies, such that the antenna structure can generate different antenna signals based on needs.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: March 8, 2022
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Cheng-Piao Tung, Wen-Jung Tsai
  • ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210083389
    Abstract: An electronic package and a method for manufacturing the same are provided, where at least one substrate structure having a second antenna portion is disposed on a carrier structure having a first antenna portion, and then an antenna structure having a first antenna body and a second antenna body is stacked on the carrier structure by a plurality of supporting members to cover the first antenna portion and the second antenna portion, so that the first antenna body corresponds to the first antenna portion, and the second antenna body corresponds to the second antenna portion. The substrate structure is disposed on the carrier structure to generate 5G millimeter waves of different frequencies, such that the antenna structure can generate different antenna signals based on needs.
    Type: Application
    Filed: August 19, 2020
    Publication date: March 18, 2021
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Cheng-Piao Tung, Wen-Jung Tsai