Patents by Inventor Cheng-Ping Chang

Cheng-Ping Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240137431
    Abstract: A packet sorting and reassembly circuit module, including a header parser, an information processing circuit, at least one state tracking and reassembly circuit, and an output arbiter, is provided. The header parser is configured to analyze multiple first packet segments to obtain header information corresponding to a first network packet, wherein the first network packet is transmitted based on a transmission control protocol (TCP) communication protocol. The information processing circuit is configured to transmit the first packet segments and sideband information corresponding to the first packet segments to a first state tracking and reassembly circuit among the at least one state tracking and reassembly circuit according to the header information. The first state tracking and reassembly circuit is configured to reassemble and sort the first packet segments according to the sideband information. The output arbiter is configured to output the first packet segments according to a sorting result.
    Type: Application
    Filed: January 16, 2023
    Publication date: April 25, 2024
    Applicants: Chung Yuan Christian University, KGI Securities Co. Ltd.
    Inventors: Yu-Kuen Lai, Chao-Lin Wang, He-Ping Li, Cheng-Han Chuang, Kai-Po Chang
  • Publication number: 20220196586
    Abstract: A capacitive biosensor is provided. The capacitive biosensor includes: a transistor, an interconnect structure on the transistor, and a passivation layer on the interconnect structure. The interconnect structure includes a first metal structure on the transistor, a second metal structure on the first metal structure, and a third metal structure on the second metal structure. The third metal structure includes a first conductive layer, a second conductive layer, and a third conductive layer that are sequentially stacked. The passivation has an opening exposing a portion of the third metal structure. The capacitive biosensor further includes a sensing region on the interconnect structure. The sensing region includes a first sensing electrode and a second sensing electrode. The first sensing electrode is formed of the third conductive layer, and the second sensing electrode is disposed on the passivation layer.
    Type: Application
    Filed: December 23, 2020
    Publication date: June 23, 2022
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Cheng-Ping CHANG, Chien-Hui LI, Chien-Hsun WU, Tai-I YANG, Yung-Hsiang CHEN
  • Patent number: 11366182
    Abstract: A magnetoresistive device includes a magnetoresistor disposed over a substrate, a stress release structure covering a side surface of the magnetoresistor, an electrical connection structure disposed over the magnetoresistor, and a passivation layer disposed over the electrical connection structure and the stress release structure.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: June 21, 2022
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Chien-Hsun Wu, Cheng-Ping Chang, Chien-Hui Li, Tai-I Yang, Yung-Hsiang Chen
  • Publication number: 20220190216
    Abstract: A diode package structure includes a substrate, at least one diode chip and an opaque encapsulating layer. The substrate has an electrically conductive layer. At least one diode chip is mounted on the substrate and electrically connected to the electrically conductive layer. The opaque encapsulating layer has a cap portion and a sidewall portion, wherein the sidewall portion is connected to and surrounds the substrate to jointly form a concave structure, the cap portion is connected between a sidewall of the diode chip and the sidewall portion, wherein a first contact vertex of the cap portion and the sidewall of the diode chip is higher than a second contact vertex of the cap portion and the sidewall portion.
    Type: Application
    Filed: September 13, 2021
    Publication date: June 16, 2022
    Inventors: Yu-Jing FANG, Hsiang-Chun HSU, Cheng-Ping CHANG
  • Publication number: 20210231753
    Abstract: A magnetoresistive device includes a magnetoresistor disposed over a substrate, a stress release structure covering a side surface of the magnetoresistor, an electrical connection structure disposed over the magnetoresistor, and a passivation layer disposed over the electrical connection structure and the stress release structure.
    Type: Application
    Filed: January 24, 2020
    Publication date: July 29, 2021
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Chien-Hsun WU, Cheng-Ping CHANG, Chien-Hui LI, Tai-I YANG, Yung-Hsiang CHEN
  • Patent number: 10991855
    Abstract: A white light emitting device includes a blue LED chip having a dominant emission wavelength of about 440-465 nm, and a phosphor layer configured to be excited by the dominant emission wavelength of the blue LED chip. The phosphor layer includes a first phosphor having a peak emission wavelength of about 480-519 nm, a second phosphor having a peak emission wavelength of about 520-560 nm, and a third phosphor having a peak emission wavelength of about 620-670 nm. The first phosphor and the second phosphor both have a garnet structure as represented by A3B5O12:Ce, A is selected from the group consisting of Y, Lu, and a combination of thereof, and B is selected from the group consisting of Al, Ga, and a combination of thereof.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: April 27, 2021
    Assignee: Lextar Electronics Corporation
    Inventors: Cheng-Ping Chang, Zong-Han Yu, Kuo-Chan Hung
  • Publication number: 20190319175
    Abstract: A white light emitting device includes a blue LED chip having a dominant emission wavelength of about 440-465 nm, and a phosphor layer configured to be excited by the dominant emission wavelength of the blue LED chip. The phosphor layer includes a first phosphor having a peak emission wavelength of about 480-519 nm, a second phosphor having a peak emission wavelength of about 520-560 nm, and a third phosphor having a peak emission wavelength of about 620-670 nm. The first phosphor and the second phosphor both have a garnet structure as represented by A3B5O12:Ce, A is selected from the group consisting of Y, Lu, and a combination of thereof, and B is selected from the group consisting of Al, Ga, and a combination of thereof.
    Type: Application
    Filed: April 16, 2018
    Publication date: October 17, 2019
    Inventors: Cheng-Ping CHANG, Zong-Han YU, Kuo-Chan HUNG
  • Patent number: 10312421
    Abstract: A white light source device includes a first light-emitting element, and at least one second light-emitting element. The first light-emitting element includes a first light-emitting unit and a first wavelength conversion unit, and emits a first light beam. Each of the second light-emitting elements includes a second light-emitting unit and a second wavelength conversion unit, and emits a second light beam. An emission spectrum of the second light beam is different from an emission spectrum of the first light beam. The first light beam and the second light beam are mixed into a white light beam, and a color fidelity index of the white light beam is greater than 90.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: June 4, 2019
    Assignee: LEXTAR ELECTRONICS CORPORATION
    Inventors: Cheng-Ping Chang, Zong-Han Yu
  • Publication number: 20180108817
    Abstract: A white light source device includes a first light-emitting element, and at least one second light-emitting element. The first light-emitting element includes a first light-emitting unit and a first wavelength conversion unit, and emits a first light beam. Each of the second light-emitting elements includes a second light-emitting unit and a second wavelength conversion unit, and emits a second light beam. An emission spectrum of the second light beam is different from an emission spectrum of the first light beam. The first light beam and the second light beam are mixed into a white light beam, and a color fidelity index of the white light beam is greater than 90.
    Type: Application
    Filed: September 6, 2017
    Publication date: April 19, 2018
    Inventors: Cheng-Ping CHANG, Zong-Han YU
  • Publication number: 20150137158
    Abstract: A light-emitting diode (LED) package frame is provided, including a leadframe and an insulating member. The leadframe includes a first electrode and a second electrode separated from each other. The insulating member is disposed between the first electrode and the second electrode for insulation between the first and second electrodes, including a first protrusion and a second protrusion. The coefficient of thermal expansion of the insulating member is greater than that of the leadframe. Specifically, the first electrode and the second electrode respectively include a first recess and a second recess which abut the insulating member. The first protrusion and the second protrusion are respectively engaged with the first recess and the second recess.
    Type: Application
    Filed: May 19, 2014
    Publication date: May 21, 2015
    Applicant: LEXTAR ELECTRONICS CORPORATION
    Inventors: Tsung-Han LI, Cheng-Ping CHANG
  • Publication number: 20150029723
    Abstract: The disclosure provides a light-emitting diode (LED) package structure, including: a lead frame; at least two light-emitting diode chips having different light-emitting wavelengths disposed on the lead frame; an encapsulant disposed over the lead frame and covering the light-emitting diode chips, wherein the encapsulant has a first concave portion; and an optical glue disposed in the first concave portion, wherein the optical glue has a plurality of scattering particles to uniformly mix the lights of different wavelengths emitted by the light-emitting diode chips.
    Type: Application
    Filed: April 11, 2014
    Publication date: January 29, 2015
    Applicant: LEXTAR ELECTRONICS CORPORATION
    Inventors: Shih-Ju Lo, Cheng-Ping Chang, Hui-Kai Hsu, I-Chun Lee, Wen-Kai Shao
  • Patent number: 8038777
    Abstract: An air sterilization device with low aerosol bounce includes an air conditioning pipe, a porous filter media, and a UV light generator. This porous filter media, it is secured on the fixing portion. This porous filter media has many irregularly distributed channels. The channel is coated with a coating layer having a thickness between 10 ?m to 1000 ?m sticking aerosols for avoiding bounce effect. The UV light generator can emit UV light to kill biological aerosols. It is suitable for long-term usage. So, the bounce effect of aerosols can be significantly reduced. The maintenance cost is low. The sterilization effect is excellent. Plus, the flow rate of the air conditioning system remains high.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: October 18, 2011
    Assignee: Institute of Occupational Safety and Health, Council of Labor Affairs, Executive Yuan
    Inventors: Chane-Yu Lai, Po-Chen Hung, Sheng-Hsiu Huang, Yu-Fang Ho, Cheng-Ping Chang, Tung-Sheng Shih, Tai-Shan Yu, Chi-yu Chuang
  • Patent number: 7819727
    Abstract: The present invention is a push-pull ventilation hood having a push device to obtain a push air flow and a pull device to exhaust contaminant flow with an exhaust opening and the two devices properly coordinated with each other, wherein, when the push flow flows through a contaminant source, a contaminated flow of the push flow is exhausted through the exhaust opening. Based on the design process according to the present invention, a push-pull hood with the highest efficiency of push velocity can be designed and the push-pull hood can economically and effectively control the contaminant source.
    Type: Grant
    Filed: July 8, 2004
    Date of Patent: October 26, 2010
    Assignee: Institute of Occupational Safety and Health Council of Labor Affairs
    Inventors: Rong Fung Huang, Yu-Kang Chen, Tung-Sheng Shih, Cheng-Ping Chang, Wen-Yu Yeh, Chun-Wan Chen, Shin Yi Lin, Shun-Yuan Jan
  • Publication number: 20100267321
    Abstract: A biological safety cabinet (BSC) has an air curtain to isolate air inside and outside the BSC. A most preferable slight concave curtain of air can be obtained. With the curtain, neither contamination in the BSC leaks out nor outside contamination enters the BSC. Furthermore, no circulation is formed in the BSC by blowing the air curtain. Thus, the operator using the BSC and the product in the BSC are both well protected.
    Type: Application
    Filed: June 22, 2007
    Publication date: October 21, 2010
    Applicant: Institute of Occupational Safety and Health, Council of Labor Affairs, Executive Yuan
    Inventors: Rong Fung Huang, Tung-Sheng Shih, Cheng-Ping Chang, Chun-Wan Chen, Chen-Hsiung Hung
  • Patent number: D667384
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: September 18, 2012
    Assignee: Lextar Electronics Corp.
    Inventors: Cheng-Ping Chang, Che-Ming Hsu, Hui-Kai Hsu
  • Patent number: D668235
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: October 2, 2012
    Assignee: Lextar Electronics Corp.
    Inventors: Cheng-Ping Chang, Che-Ming Hsu, Hui-Kai Hsu
  • Patent number: D670661
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: November 13, 2012
    Assignee: Lextar Electronics, Corp.
    Inventor: Cheng-Ping Chang
  • Patent number: D671082
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: November 20, 2012
    Inventor: Cheng-Ping Chang
  • Patent number: D728492
    Type: Grant
    Filed: January 21, 2014
    Date of Patent: May 5, 2015
    Assignee: Lextar Electronics Corporation
    Inventors: Liang-Ta Lin, Che-Ming Hsu, Cheng-Ping Chang, Zong-Han Li
  • Patent number: D728493
    Type: Grant
    Filed: January 21, 2014
    Date of Patent: May 5, 2015
    Assignee: Lextar Electronics Corporation
    Inventors: Liang-Ta Lin, Che-Ming Hsu, Cheng-Ping Chang, Zong-Han Li