Abstract: An IC package mainly includes a substrate having slot(s), a chip, a protective encapsulant, a stiffening encapsulant, and a plurality of external terminals. The Young's modulus of the stiffening encapsulant is greater than the one of the protective encapsulant and the curing shrinkage of the stiffening encapsulant is smaller than the one of the protective encapsulant. The protective encapsulant is formed on one of the surfaces of the substrate for encapsulating the chip. The stiffening encapsulant protrudes from the other surface of the substrate where the external terminals are disposed. Moreover, the stiffening encapsulant is formed inside the slot and is contacted with the chip. Since the stiffening encapsulant is embedded and formed inside the slot, therefore, the contact area of the stiffening encapsulant with the substrate is increased to enhance the warpage resistance of the IC package.

Abstract: A display panel has a display area and a peripheral circuit area next to the display area. The display panel includes a number of pixels, a first signal line, a second signal line, and a third signal line. The pixels are arranged in array in the display area. The first signal line disposed in an intersection of the display area and the peripheral circuit area is electrically connected to the pixels. A data signal is suitable for being applied to the first signal line. The second signal line is disposed in the peripheral circuit area. A common signal is suitable for being applied to the second signal line. The third signal line is disposed between the first signal line and the second signal line. A reference signal is suitable for being applied to the third signal line. The data signal, the common signal, and the reference signal are different signals.

Abstract: An IC package mainly includes a substrate having slot(s), a chip, a protective encapsulant, a stiffening encapsulant, and a plurality of external terminals. The Young's modulus of the stiffening encapsulant is greater than the one of the protective encapsulant and the curing shrinkage of the stiffening encapsulant is smaller than the one of the protective encapsulant. The protective encapsulant is formed on one of the surfaces of the substrate for encapsulating the chip. The stiffening encapsulant protrudes from the other surface of the substrate where the external terminals are disposed. Moreover, the stiffening encapsulant is formed inside the slot and is contacted with the chip. Since the stiffening encapsulant is embedded and formed inside the slot, therefore, the contact area of the stiffening encapsulant with the substrate is increased to enhance the warpage resistance of the IC package.