Abstract: A fine blanking device characterized by a trough structure is provided. Preferably, the fine blanking device comprises a punch, a mother die module having a first die cavity allowing the punch to enter therein, and a blank-holder module having a second die cavity allowing the punch to enter therein; wherein one or more trough structures are formed on/individually formed on the mother die module or/and the blank-holder module, wherein the trough structure is formed, surrounding the first die cavity, on the mother die module at a sheet stock contacting side thereof; or/and the trough structure is formed, surrounding the second die cavity, on the blank-holder module at a sheet stock contacting side thereof.

Abstract: A fine blanking device characterized by a trough structure is provided. Preferably, the fine blanking device comprises a punch, a mother die module having a first die cavity allowing the punch to enter therein, and a blank-holder module having a second die cavity allowing the punch to enter therein; wherein one or more trough structures are formed on/individually formed on the mother die module or/and the blank-holder module, wherein the trough structure is formed, surrounding the first die cavity, on the mother die module at a sheet stock contacting side thereof; or/and the trough structure is formed, surrounding the second die cavity, on the blank-holder module at a sheet stock contacting side thereof.

Abstract: A fine hydro-blanking device is used for blanking a sheet stock. The fine hydro-blanking device includes a clamping module and a punching module. The clamping module is used for clamping the sheet stock. The clamping module includes at least one cavity and at least one fluid flow channel. The at least one fluid flow channel runs through the clamping module. The punching module is inserted into the at least one cavity of the clamping module and contacted with the sheet stock. At least one trough is formed in the sheet stock, and the at least one fluid flow channel is in communication with the at least one trough, so that a liquid is introduced into the at least one trough through the at least one fluid flow channel to provide a liquid pressure to the sheet stock.

Abstract: A two-stage switching power supply includes a first-stage power circuit, a bus capacitor, a second-stage power circuit and a power control unit. The first-stage power circuit is connected to a power bus for receiving an input voltage, and includes a first switching circuit. The input voltage is converted into a bus voltage by alternately conducting and shutting off the first switching circuit. The second-stage power circuit is connected to the power bus for receiving the bus voltage, and includes a second switching circuit. The power control unit is used for controlling operations of the first switching circuit and the second switching circuit. The bus voltage is dynamically adjusted according to electricity consumption amount of the system circuit under control of the power control unit. An operating mode of the second switching circuit of the second-stage power circuit is changed according to the electricity consumption amount of the system circuit.

Abstract: An improved system for testing the operation of component modules and the interconnections therebetween of an integrated circuit (10) formed on a semiconductor chip is provided which consists of several component modules, each with an associated input scan cell (76) and output scan cell (102) when necessary. A component module may have both an input scan cell (76) and an output scan cell (102) unless the input or output of that component module occurs on the boundary of the integrated circuit (10). Each output scan cell (102) has a mode select signal (122) which indicates either input test mode or output test mode. The improved scan test system uses two process steps to verify the operational integrity of the entire integrated circuit (10). During the first step of the scan test, non-adjacent component modules have their mode select signals set to output test mode, and component modules existing between the non-adjacent component modules have their mode select signals set to input test mode.