Patents by Inventor Cheng Pour

Cheng Pour has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for designing carrier substrates with raised terminals
    Patent number: 7368391
    Abstract: A method for designing a carrier substrate includes configuring at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. The method may also include configuring the carrier substrate to include one or more recessed areas that laterally surround at least a portion of the die-attach location to receive excess adhesive.
    Type: Grant
    Filed: August 29, 2005
    Date of Patent: May 6, 2008
    Assignee: Micron Technology, Inc.
    Inventors: Cher Khng Victor Tan, Choon Kuan Lee, Kian Chai Lee, Guek Har Lim, Wuu Yean Tay, Teck Huat Poh, Cheng Pour Poh
  • Stacked Die in Die BGA Package
    Publication number: 20080096316
    Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
    Type: Application
    Filed: December 18, 2007
    Publication date: April 24, 2008
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Hock Tan, Thiam Lim, Victor Tan, Chee Neo, Michael Tan, Beng Chew, Cheng Pour
  • Stacked Die in Die BGA Package
    Publication number: 20080032449
    Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
    Type: Application
    Filed: October 15, 2007
    Publication date: February 7, 2008
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Hock Tan, Thiam Lim, Victor Tan, Chee Neo, Michael Tan, Beng Chew, Cheng Pour
  • Stacked die in die BGA package
    Publication number: 20060292743
    Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
    Type: Application
    Filed: August 29, 2006
    Publication date: December 28, 2006
    Applicant: Micron Technolgoy, Inc.
    Inventors: Hock Tan, Thiam Lim, Victor Tan, Chee Neo, Michael Tan, Beng Chew, Cheng Pour
  • Stacked die in die BGA package
    Publication number: 20060292745
    Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
    Type: Application
    Filed: August 29, 2006
    Publication date: December 28, 2006
    Applicant: Micron Technology, Inc.
    Inventors: Hock Tan, Thiam Lim, Victor Tan, Chee Neo, Michael Tan, Beng Chew, Cheng Pour
  • Stacked die in die BGA package
    Publication number: 20060292746
    Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
    Type: Application
    Filed: August 29, 2006
    Publication date: December 28, 2006
    Applicant: Micron Technology, Inc.
    Inventors: Hock Tan, Thiam Lim, Victor Tan, Chee Neo, Michael Tan, Beng Chew, Cheng Pour
  • Stacked die in die BGA package
    Publication number: 20060216864
    Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
    Type: Application
    Filed: May 25, 2006
    Publication date: September 28, 2006
    Applicant: Micron Technology, Inc.
    Inventors: Hock Tan, Thiam Lim, Victor Tan, Chee Neo, Michael Tan, Beng Chew, Cheng Pour
  • Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods
    Patent number: 7018871
    Abstract: A carrier substrate includes at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. A solder mask for use on a carrier substrate includes a device-securing region positionable over at least a portion of a die-support location of the carrier substrate. Dams of the solder mask are positionable laterally adjacent to at least portions of the peripheries of corresponding terminals of the carrier substrate. The carrier substrate and solder mask may each include one or more recessed areas that laterally surround at least portions of their die-attach location and device-securing region, respectively, to receive some of the excess adhesive. Assemblies and packages including one or both of the carrier substrate and solder mask are also disclosed, as are assembly methods and methods for designing the carrier substrate and solder mask.
    Type: Grant
    Filed: August 18, 2003
    Date of Patent: March 28, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Cher Khng Victor Tan, Choon Kuan Lee, Kian Chai Lee, Guek Har Lim, Wuu Yean Tay, Teck Huat Poh, Cheng Pour Poh
  • Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks
    Publication number: 20050029676
    Abstract: A solder mask for use on a carrier substrate includes a device-securing region positionable over at least a portion of a die-support location of the carrier substrate. Dams of the solder mask are positionable laterally adjacent to at least portions of the peripheries of corresponding terminals of the carrier substrate. A carrier substrate includes at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. The solder may be positioned or formed on the carrier substrate. The carrier substrate and solder mask may each include one or more recessed areas that laterally surround at least portions of their die-attach location and device-securing region, respectively, to receive excess adhesive.
    Type: Application
    Filed: September 7, 2004
    Publication date: February 10, 2005
    Inventors: Cher Tan, Choon Lee, Kian Lee, Guek Lim, Wuu Tay, Teck Poh, Cheng Pour
  • Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks
    Patent number: 6787923
    Abstract: A carrier substrate includes at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. A solder mask for use on a carrier substrate includes a device-securing region positionable over at least a portion of a die-support location of the carrier substrate. Dams of the solder mask are positionable laterally adjacent to at least portions of the peripheries of corresponding terminals of the carrier substrate. The carrier substrate and solder mask may each include one or more recessed areas that laterally surround at least portions of their die-attach location and device-securing region, respectively, to receive some of the excess adhesive. Assemblies and packages including one or both of the carrier substrate and solder mask are also disclosed, as are assembly methods and methods for designing the carrier substrate and solder mask.
    Type: Grant
    Filed: April 10, 2002
    Date of Patent: September 7, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Cher Khng Victor Tan, Choon Kuan Lee, Kian Chai Lee, Guek Har Lim, Wuu Yean Tay, Teck Huat Poh, Cheng Pour Poh
  • Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods
    Publication number: 20030193092
    Abstract: A carrier substrate includes at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. A solder mask for use on a carrier substrate includes a device-securing region positionable over at least a portion of a die-support location of the carrier substrate. Dams of the solder mask are positionable laterally adjacent to at least portions of the peripheries of corresponding terminals of the carrier substrate. The carrier substrate and solder mask may each include one or more recessed areas that laterally surround at least portions of their die-attach location and device-securing region, respectively, to receive some of the excess adhesive. Assemblies and packages including one or both of the carrier substrate and solder mask are also disclosed, as are assembly methods and methods for designing the carrier substrate and solder mask.
    Type: Application
    Filed: April 10, 2002
    Publication date: October 16, 2003
    Inventors: Cher Khng Victor Tan, Choon Kuan Lee, Kian Chai Lee, Guek Har Lim, Wuu Yean Tay, Teck Huat Poh, Cheng Pour Poh