Patents by Inventor Cheng San Chou
Cheng San Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11971027Abstract: An air compressor is received in an accommodation box and contains a body, a cylinder, a motor, and a transmission mechanism. The body includes a first positioning orifice and a second positioning orifice. The cylinder is connected on the body and communicates with an air storage holder. The motor is fixed on the body, a small gear is received in the first positioning orifice, and a connection seat is accommodated in the first orifice. The transmission mechanism actuates a piston to move in the cylinder reciprocately so as to produce compressed airs. The motor includes at least one locking extension for engaging the motor with the body, hence the motor is fixed on the body securely without using any screws.Type: GrantFiled: May 17, 2022Date of Patent: April 30, 2024Inventors: Wen-San Chou, Cheng-Hsien Chou
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Patent number: 11920586Abstract: An air compressor is received in an accommodation box and contains a body, a cylinder, a motor, and a transmission mechanism. The body includes a first positioning orifice and a second positioning orifice. The cylinder is connected on the body and communicates with an air storage holder. The motor is fixed on the body, a small gear is received in the first positioning orifice, and a connection seat is accommodated in the first orifice. The transmission mechanism actuates a piston to move in the cylinder reciprocately so as to produce compressed air. The motor includes at least one locking extension for engaging the motor with the body. A first end of a respective one locking extension extends from the motor, and a second end of the respective one locking extension is engaged on the body, hence the motor is fixed on the body securely without using any screws.Type: GrantFiled: May 17, 2022Date of Patent: March 5, 2024Inventors: Wen-San Chou, Cheng-Hsien Chou
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Patent number: 11913440Abstract: A fixing device of a motor of an air compressor contains: a body, a cylinder, a motor, a transmission mechanism, and at least one retainer. The body includes a first positioning orifice and a second positioning orifice. The cylinder is connected on the body. The motor is fixed on the body, a small gear is received in the first positioning orifice and is connected on the motor, and a connection seat of the motor is accommodated in the first orifice. The transmission mechanism actuates a piston to move in the cylinder reciprocately. The at least one retainer is configured to fix the body and the motor. A first end of at least one retainer is engaged on the body, and a second end of the at least one retainer is engaged on the motor so that the motor is fixed on the body without using any screws.Type: GrantFiled: May 8, 2022Date of Patent: February 27, 2024Inventors: Wen-San Chou, Cheng-Hsien Chou
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Patent number: 11861928Abstract: Optical sensors and their making methods are described herein. In some embodiments, a described sensing apparatus includes: an image sensor; a collimator above the image sensor, wherein the collimator includes an array of apertures; and an optical filtering layer above the collimator, wherein the optical filtering layer is configured to filter a portion of light to be transmitted into the array of apertures.Type: GrantFiled: November 23, 2022Date of Patent: January 2, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: You-Cheng Jhang, Han-Zong Pan, Wei-Ding Wu, Jiu-Chun Weng, Hsin-Yu Chen, Cheng-San Chou, Chin-Min Lin
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Publication number: 20230401885Abstract: Optical sensors and their making methods are described herein. In some embodiments, a described sensing apparatus includes: an image sensor; a collimator above the image sensor, wherein the collimator includes an array of apertures; and an optical filtering layer above the collimator, wherein the optical filtering layer is configured to filter a portion of light to be transmitted into the array of apertures.Type: ApplicationFiled: August 10, 2023Publication date: December 14, 2023Inventors: You-Cheng JHANG, Han-Zong PAN, Wei-Ding WU, Jiu-Chun WENG, Hsin-Yu CHEN, Cheng-San CHOU, Chin-Min LIN
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Publication number: 20230092567Abstract: Optical sensors and their making methods are described herein. In some embodiments, a described sensing apparatus includes: an image sensor; a collimator above the image sensor, wherein the collimator includes an array of apertures; and an optical filtering layer above the collimator, wherein the optical filtering layer is configured to filter a portion of light to be transmitted into the array of apertures.Type: ApplicationFiled: November 23, 2022Publication date: March 23, 2023Inventors: You-Cheng JHANG, Han-Zong PAN, Wei-Ding WU, Jiu-Chun WENG, Hsin-Yu CHEN, Cheng-San CHOU, Chin-Min LIN
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Patent number: 11514707Abstract: Optical sensors and their making methods are described herein. In some embodiments, a described sensing apparatus includes: an image sensor; a collimator above the image sensor, wherein the collimator includes an array of apertures; and an optical filtering layer above the collimator, wherein the optical filtering layer is configured to filter a portion of light to be transmitted into the array of apertures.Type: GrantFiled: May 7, 2020Date of Patent: November 29, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: You-Cheng Jhang, Han-Zong Pan, Wei-Ding Wu, Jui-Chun Weng, Hsin-Yu Chen, Cheng-San Chou, Chin-Min Lin
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Publication number: 20220216263Abstract: A display apparatus is disclosed. The display apparatus includes a sensor layer including a plurality of sensors, a pixel layer disposed on the sensor layer and including a plurality of pixel areas and a plurality of pixels in the pixel areas, and an opaque layer disposed between the sensor layer and the pixel layer and including holes corresponding to at least one of the pixel areas.Type: ApplicationFiled: March 28, 2022Publication date: July 7, 2022Inventors: Chin-Min Lin, Cheng San Chou
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Patent number: 11289533Abstract: A method of fabricating a sensing apparatus is disclosed. The method includes providing a substrate that includes a plurality of image sensors, forming an optical filtering film on the substrate, and forming a collimator on the optical filtering film. The method further includes forming a blocking layer on the collimator and forming an illumination layer on the blocking layer. The illumination layer is configured to illuminate an object placed above the illumination layer. The image sensors are configured to detect a portion of light reflected from the object.Type: GrantFiled: August 31, 2020Date of Patent: March 29, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chin-Min Lin, Cheng San Chou
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Patent number: 10961118Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. In some embodiments, a ventilation trench and an isolation trench are concurrently within a capping substrate. The isolation trench isolates a silicon region and has a height substantially equal to a height of the ventilation trench. A sealing structure is formed within the ventilation trench and the isolation trench, the sealing structure filing the isolation trench and defining a vent within the ventilation trench. A device substrate is provided and bonded to the capping substrate at a first gas pressure and hermetically sealing a first cavity associated with a first MEMS device and a second cavity associated with a second MEMS device. The capping substrate is thinned to open the vent to adjust a gas pressure of the second cavity.Type: GrantFiled: September 26, 2019Date of Patent: March 30, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen, Hua-Shu Ivan Wu, Fan Hu
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Patent number: 10899608Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.Type: GrantFiled: September 26, 2019Date of Patent: January 26, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen, Hua-Shu Ivan Wu, Fan Hu
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Publication number: 20200403024Abstract: A method of fabricating a sensing apparatus is disclosed. The method includes providing a substrate that includes a plurality of image sensors, forming an optical filtering film on the substrate, and forming a collimator on the optical filtering film. The method further includes forming a blocking layer on the collimator and forming an illumination layer on the blocking layer. The illumination layer is configured to illuminate an object placed above the illumination layer. The image sensors are configured to detect a portion of light reflected from the object.Type: ApplicationFiled: August 31, 2020Publication date: December 24, 2020Inventors: Chin-Min Lin, Cheng San Chou
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Patent number: 10763296Abstract: A sensing apparatus is disclosed. The sensing apparatus includes an image sensor; a collimator above the image sensor, the collimator having an array of apertures; an optical filtering layer between the collimator and the image sensor, wherein the optical filtering layer is configured to filter a portion of light transmitted through the array of apertures; and an illumination layer above the collimator.Type: GrantFiled: February 26, 2018Date of Patent: September 1, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chin-Min Lin, Cheng San Chou
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Patent number: 10556792Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.Type: GrantFiled: November 28, 2017Date of Patent: February 11, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen, Hua-Shu Ivan Wu, Fan Hu
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Publication number: 20200024136Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.Type: ApplicationFiled: September 26, 2019Publication date: January 23, 2020Inventors: Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen, Hua-Shu Ivan Wu, Fan Hu
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Publication number: 20200024137Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. In some embodiments, a ventilation trench and an isolation trench are concurrently within a capping substrate. The isolation trench isolates a silicon region and has a height substantially equal to a height of the ventilation trench. A sealing structure is formed within the ventilation trench and the isolation trench, the sealing structure filing the isolation trench and defining a vent within the ventilation trench. A device substrate is provided and bonded to the capping substrate at a first gas pressure and hermetically sealing a first cavity associated with a first MEMS device and a second cavity associated with a second MEMS device. The capping substrate is thinned to open the vent to adjust a gas pressure of the second cavity.Type: ApplicationFiled: September 26, 2019Publication date: January 23, 2020Inventors: Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen, Hua-Shu Ivan Wu, Fan Hu
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Publication number: 20190161346Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.Type: ApplicationFiled: November 28, 2017Publication date: May 30, 2019Inventors: Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen, Hua-Shu Ivan Wu, Fan Hu
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Publication number: 20190157337Abstract: A sensing apparatus is disclosed. The sensing apparatus includes an image sensor; a collimator above the image sensor, the collimator having an array of apertures; an optical filtering layer between the collimator and the image sensor, wherein the optical filtering layer is configured to filter a portion of light transmitted through the array of apertures; and an illumination layer above the collimator.Type: ApplicationFiled: February 26, 2018Publication date: May 23, 2019Inventors: Chin-Min Lin, Cheng San Chou
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Publication number: 20190140112Abstract: A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration.Type: ApplicationFiled: December 17, 2018Publication date: May 9, 2019Inventors: Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Jen-Cheng Liu, Cheng San Chou, Jung-Kuo Tu, Cheng-Chieh Hsieh
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Patent number: 10087071Abstract: A semiconductor structure includes a first substrate, a second substrate disposed over the first substrate, and including a first surface, a second surface opposite to the first surface, a via portion extending between the first surface and the second surface, a first through hole and a second through hole, and a device disposed over the second surface, and including a dielectric layer, a backplate at least partially exposed from the dielectric layer and a membrane at least partially exposed from the dielectric layer and disposed between the backplate and the first substrate, wherein the via portion is disposed within the second through hole, and the dielectric layer is bonded with the second substrate, and the device is electrically connected to the first substrate through the via portion.Type: GrantFiled: October 25, 2016Date of Patent: October 2, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Tzu-Heng Wu, Chia-Hua Chu, Yi-Heng Tsai, Cheng San Chou, Chen Hsiung Yang