Abstract: A computer-implemented method is provided for model training performed by a processing system. The method comprises determining a set of first weights based on a first matrix associated with a source model, determining a set of second weights based on the set of first weights, forming a second matrix associated with a target model based on the set of first weights and the set of second weights, initializing the target model based on the second matrix, and training the target model.

Abstract: A gas extraction device for metal mineral inclusions and a gas extraction method therefor are provided, the device includes a base plate, an annular carrier, sealing covers, a grinding assembly, a vacuum assembly, a gas-gathering assembly and a mass spectrometer. The annular carrier is disposed on the base plate, multiple grinding chambers are defined and evenly distributed in a circular shape on the annular carrier, the sealing covers are disposed at openings of the grinding chambers, the grinding assembly includes grinding hammers, and the grinding hammers penetrate through the sealing covers and extend into the grinding chambers. Side walls of each grinding chamber defines a first through hole and a second through hole. The vacuum assembly is communicated with the grinding chambers through the first through holes. The gas-gathering assembly is communicated with the grinding chambers through the second through holes. The mass spectrometer is communicated with the gas-gathering assembly.

Abstract: A smart acoustic information recognition-based welded weld impact quality determination method and system, comprising: controlling a tip of an ultrasonic impact gun (1) to perform impact treatment on a welded weld with different treatment pressures, treatment speeds, treatment angles and impact frequencies, obtaining acoustic signals during the impact treatment, calculating feature values of the acoustic signals, and constructing an acoustic signal sample set including various stress conditions; marking the acoustic signal sample set according to impact treatment quality assessment results for the welded weld; establishing a multi-weight neural network model, and using the marked acoustic signal sample set to train the multi-weight neural network model; obtaining feature values of welded weld impact treatment acoustic signals to be determined, inputting the feature values into the trained multi-weight neural network model, and outputting determination results for welded weld impact treatment quality to be det

Abstract: In one aspect, the disclosure relates to cooling films comprising a substrate and one or more cooling materials deposited on the substrate. The disclosed cooling films can be used to prepare the disclosed cooling masterbatch materials. The disclosed cooling masterbatch materials can be used to prepare disclosed cooling yarns. The one or more cooling materials deposited on the substrate of a disclosed cooling film, dispersed in a disclosed cooling masterbatch material, or in disclosed cooling yarn are nano-sized particles. In still further aspects, the present disclosure pertains to a fabric comprising a disclosed cooling yarn. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.

Abstract: A compound of formula I, wherein the compound of formula I has the structure: wherein R1 to R5, Y, L, Z and X1 to X7 have meanings given in the description, said compounds having utility in the treatment of hyperproliferative disease.

Abstract: A compound of formula I, wherein the compound of formula I has the structure: wherein R1 to R5, Y, L, Z and X1 to X7 have meanings given in the description, said compounds having utility in the treatment of hyperproliferative disease.

Abstract: A method for preparation of a composite composition involves performing magnetron sputtering deposition to nanolize at least one target such as silver or titanium dioxide or zinc oxide and to deposit the target over surfaces of a plastic matrix, so as to obtain a composite matrix, and using pressing or blowing or injection forming to make the composite matrix into a composite composition. Thereby, the method ensures that the target is evenly distributed over the film, making it a composite composition that is antibacterial, capable of generating anions and far infrared rays or highly ventilative.

Abstract: The present disclosure relates, according to some embodiments, to a method of temporal bipartite projection for users and objects and a method of link prediction for an unhappened event. The method of the temporal bipartite projection comprises making a sequence of user-object weighted bipartite networks with the user-object weights, identifying the transitions for each user from a first object at a first time to a second object at a second time, assigning the transition weights corresponding to the transitions according to a predetermined rule, summing the transition weights for all users between two objects to obtain the transition tendencies, and constructing a temporal projection graph with the transition tendencies.

Abstract: The present disclosure relates, according to some embodiments, to a method of temporal bipartite projection for users and objects and a method of link prediction for an unhappened event. The method of the temporal bipartite projection comprises making a sequence of user-object weighted bipartite networks with the user-object weights, identifying the transitions for each user from a first object at a first time to a second object at a second time, assigning the transition weights corresponding to the transitions according to a predetermined rule, summing the transition weights for all users between two objects to obtain the transition tendencies, and constructing a temporal projection graph with the transition tendencies.

Abstract: This invention discloses a bit-stuffing method for crosstalk avoidance in high-speed buses, which comprises the steps of inputting a plurality of data bit streams in parallel to a data input buffer; the data input buffer sequentially inputting data bits of the data bit streams to a bit-switching unit, and the bit-switching unit switching the data bits to generate bit-switched data; parallelly inputting the bit-switched data to a bit-stuffing encoding unit; the bit-stuffing encoding unit performing bit-stuffing encoding on the bit-switched data to generate encoded data bits and inputting the encoded data bits to an encoded data buffer; and the encoded data buffer outputting the encoded data to a high-speed bus. The encoded data bits passed through the high-speed bus are decoded using a bit-removing method to recover the data bit streams.

Abstract: In one embodiment, a portable 3D media playing device comprises: a telescope-shaped housing; at least one display for displaying video data; and a circuit board coupled to the display for processing video data and transmitting the video data to the display.

Abstract: This invention discloses a bit-stuffing method for crosstalk avoidance in high-speed buses, which comprises the steps of inputting a plurality of data bit streams in parallel to a data input buffer; the data input buffer sequentially inputting data bits of the data bit streams to a bit-switching unit, and the bit-switching unit switching the data bits to generate bit-switched data; parallelly inputting the bit-switched data to a bit-stuffing encoding unit; the bit-stuffing encoding unit performing bit-stuffing encoding on the bit-switched data to generate encoded data bits and inputting the encoded data bits to an encoded data buffer; and the encoded data buffer outputting the encoded data to a high-speed bus. The encoded data bits passed through the high-speed bus are decoded using a bit-removing method to recover the data bit streams.

Abstract: A heat dissipation module for being assembled to a circuit board with a first heat-generating element and a second heat-generating element is provided. A heat generation rate of the first heat-generating element is higher than that of the second heat-generating element. The heat dissipation module includes a heat-transferring connection element, a cooling device, a first heat-transferring plate and a second heat-transferring plate. The heat-transferring connection element has a first part and a second part. The cooling device connects to the first part. The first heat-transferring plate is connected between the first heat-generating element and the second part. The second heat-transferring plate has a third part and a fourth part. The second part is connected between the first heat-transferring plate and the third part. The fourth part is connected to the second heat-generating element. The thermal conductivity of the first heat-transferring plate is higher than that of the second heat-transferring plate.

Abstract: A heat dissipation module for being assembled to a circuit board with a first heat-generating element and a second heat-generating element is provided. A heat generation rate of the first heat-generating element is higher than that of the second heat-generating element. The heat dissipation module includes a heat-transferring connection element, a cooling device, a first heat-transferring plate and a second heat-transferring plate. The heat-transferring connection element has a first part and a second part. The cooling device connects to the first part. The first heat-transferring plate is connected between the first heat-generating element and the second part. The second heat-transferring plate has a third part and a fourth part. The second part is connected between the first heat-transferring plate and the third part. The fourth part is connected to the second heat-generating element. The thermal conductivity of the first heat-transferring plate is higher than that of the second heat-transferring plate.

Abstract: The present invention discloses a switching apparatus and method using bandwidth decomposition, appling a von Neumann algorithm, a Birkhoff theorem, a Packetized Generalized Processor Sharing algorithm, a water filling algorithm and a dynamnically calculating rate algorithm in packet switching of a high speed network. It is not necessary to speed up internally and determine a maximal matching between input ports and output ports for the switching apparatus and method using bandwidth decomposition according to the present invention, so the executing speed of a network using the present appatatus and method will be increased, and the manufacturing of the present invention can be easily implemented by current VLSI technology.

Abstract: The present invention relates to a constant temperature device that comprises a base, a heating thin layer which is coated on the base, and two electric nodes that locate at the two ends of the heating thin layer respectively. The base is made of insulated materials such as glass and ceramic. The heating thin layer is made by a mix of various materials and is coated on the base by the Physical Vapor Deposition (PVD) processing, Chemical Vapor Deposition (CVD) processing or other coating techniques such that the mix of material can be evenly distributed on one side of the base. Once the power is through via the two nodes, the heating thin layer will act as a thermally sensitive resistor (thermistor) to automatically keep the temperature at a pre-set level so as to save energy and ensure the safety of use thereof.

Abstract: A semiconductor device is formed on a substrate having an ESD region and an internal region. A protective layer is formed over a portion of the ESD region to be protected from formation of silicide and suicide is formed on portions of the Internal and ESD region which remain unprotected by the protective layer. A portion of the protective layer is removed to form the remaining portions of the protective layer into sidewall spacers adjacent to a gate electrode included in the ESD region.

Abstract: A semiconductor device is formed on a substrate having an ESD region and an internal region. A protective layer is formed over a portion of the ESD region to be protected from formation of silicide and silicide is formed on portions of the Internal and ESD region which remain unprotected by the protective layer. A portion of the protective layer is removed to form the remaining portions of the protective layer into sidewall spacers adjacent to a gate electrode included in the ESD region.