Abstract: The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a package structure, a circuit structure, a bonding structure and an external element. The circuit structure is disposed on the package structure and is electrically connected to the package structure. The circuit structure has a recess. The bonding structure includes a first bonding pad and a second bonding pad. The second bonding pad is disposed in the recess, and the second bonding pad is disposed on the first bonding pad. The bonding structure is disposed between the circuit structure and the external element. The external element is electrically connected to the circuit structure through the bonding structure. A width of the first bonding pad is smaller than a width of the second bonding pad.

Abstract: A semiconductor device includes a fin extending from a substrate. The fin has a source/drain region and a channel region. The channel region includes a first semiconductor layer and a second semiconductor layer disposed over the first semiconductor layer and vertically separated from the first semiconductor layer by a spacing area. A high-k dielectric layer at least partially wraps around the first semiconductor layer and the second semiconductor layer. A metal layer is formed along opposing sidewalls of the high-k dielectric layer. The metal layer includes a first material. The spacing area is free of the first material.

Abstract: An optoelectronic package structure and a method of manufacturing an optoelectronic package structure are provided. The optoelectronic package structure includes a photonic component. The photonic component has an electrical connection region, a blocking region and a region for accommodating a device. The blocking region is located between the electrical connection region and the region for accommodating a device.

Abstract: A projection device including a light source module, an optical engine module and a projection lens is provided. The optical engine module includes a casing, a heat-conducting base, a heat pipe, a light valve and a thermal conductive layer. The casing has an opening. The heat-conducting base has an assembly opening, wherein the heat-conducting base is disposed on the casing, and the assembly opening is aligned with the opening of the casing. The heat pipe is connected to the heat-conducting base and disposed on the heat-conducting base. The light valve is disposed on the heat-conducting base corresponding to the assembly opening. The light valve is thermally coupled to the heat-conducting base through the thermal conductive layer. The light valve has a first stepped surface and a second stepped surface, and the thermal conductive layer covers at least a part of the first stepped surface and the second stepped surface.

Abstract: A semiconductor device includes a first set of nanostructures stacked over a substrate in a vertical direction, and each of the first set of nanostructures includes a first end portion and a second end portion, and a first middle portion laterally between the first end portion and the second end portion. The first end portion and the second end portion are thicker than the first middle portion. The semiconductor device also includes a first plurality of semiconductor capping layers around the first middle portions of the first set of nanostructures, and a gate structure around the first plurality of semiconductor capping layers.

Abstract: A three-dimensional sensing system includes a plurality of scanners each emitting a light signal to a scene to be sensed and receiving a reflected light signal, according to which depth information is obtained. Only one scanner executes transmitting corresponding light signal and receiving corresponding reflected light signal at a time.

Abstract: A low-gloss metal plate includes a metal body and a plurality of metal pattern units. The metal body has a first surface and a second surface opposite to each other. The plurality of metal pattern units protrude from the first surface and are arranged to form a regular pattern. One of the plurality of metal pattern units has a top, a base and a sidewall. The base at least partially overlaps with the first surface. The sidewall connects the top with the base and forms an angle less than 60° with the base.

Abstract: A low-gloss metal plate includes a metal body and a plurality of metal pattern units. The metal body has a first surface and a second surface opposite to each other. The plurality of metal pattern units protrude from the first surface and are arranged to form a regular pattern. One of the plurality of metal pattern units has a top, a base and a sidewall. The base at least partially overlaps with the first surface. The sidewall connects the top with the base and forms an angle less than 60° with the base.

Abstract: An airtight container comprises a receiver, a cover and a sealing ring. The cover comprises an opening. The sealing ring is used to block a gap between the cover and the receiver when the cover is used for closing or sealing an inlet of the receiver. A valve part is used to close or seal the opening. The valve part comprises a tunnel and a valve to close or seal the tunnel. The valve extends from the valve part into the tunnel and has a thickness decreasing from the valve part to a center of the tunnel so as to form a concave surface at a side of the valve facing away from the tunnel. The valve can be opened by air leaving the receiver.