Patents by Inventor Cheng-Shi Liu

Cheng-Shi Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat-dissipating module and electronic apparatus
    Patent number: 7558062
    Abstract: A heat-dissipating module suitable for dissipating heat generated by a heat-generating element is provided. The heat-dissipating module includes a first heat-conducting plate, a first heat-dissipating tube, and a fan. The first heat-conducting plate is thermally coupled to the heat-generating element. The first heat-dissipating tube has a first opening and a second opening opposite to the first opening. The first heat-conducting plate is connected to the first heat-dissipating tube and located at an outside of the first heat-dissipating tube. The fan is disposed adjacent to the first opening and corresponding to first opening. The fan is adapted for generating an air current flowing in the first heat-dissipating tube. The heat-dissipating module can transfer the heat generated by the heat-generating element during operation to an external environment.
    Type: Grant
    Filed: September 5, 2007
    Date of Patent: July 7, 2009
    Assignee: Inventec Corporation
    Inventors: Feng-Ku Wang, Yi-Lun Cheng, Chun-Lung Lin, Chih-Kai Yang, Cheng-Shi Liu
  • HEAT-DISSIPATING MODULE AND ELECTRONIC APPARATUS
    Publication number: 20090016020
    Abstract: A heat-dissipating module suitable for dissipating heat generated by a heat-generating element is provided. The heat-dissipating module includes a first heat-conducting plate, a first heat-dissipating tube, and a fan. The first heat-conducting plate is thermally coupled to the heat-generating element. The first heat-dissipating tube has a first opening and a second opening opposite to the first opening. The first heat-conducting plate is connected to the first heat-dissipating tube and located at an outside of the first heat-dissipating tube. The fan is disposed adjacent to the first opening and corresponding to first opening. The fan is adapted for generating an air current flowing in the first heat-dissipating tube. The heat-dissipating module can transfer the heat generated by the heat-generating element during operation to an external environment.
    Type: Application
    Filed: September 5, 2007
    Publication date: January 15, 2009
    Applicant: INVENTEC CORPORATION
    Inventors: Feng-Ku Wang, Yi-Lun Cheng, Chun-Lung Lin, Chih-Kai Yang, Cheng-Shi Liu