Patents by Inventor Cheng-Shi Weng

Cheng-Shi Weng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11953740
    Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
  • Patent number: 11947173
    Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
  • Patent number: 8405241
    Abstract: A seesaw-type wave power generating device (1) includes: a first buoy (10); a second buoy (20) disposed on one side of the first buoy (10); an impeller generator (30) disposed between the first buoy (10) and the second buoy (20); a first connecting pipe (42) having both ends communicated with the first buoy (10) and the impeller generator (30); and a second connecting pipe (42) having both ends communicated with the second buoy (20) and the impeller generator (30). A liquid (2) is filled in the first buoy (10) and the second buoy (20). The first buoy (10) and the second buoy (20) bob on the water and water waves (4) causes the liquid (2) to flow back and forth between the first connecting pipe (41) and the second connecting pipe (42), thereby driving the impeller generator (30) to generate electricity. The present invention is easy for implementation and maintenance.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: March 26, 2013
    Inventors: Shih-Hsiung Chen, Cheng-Shi Weng
  • Publication number: 20110169265
    Abstract: A seesaw-type wave power generating device (1) includes: a first buoy (10); a second buoy (20) disposed on one side of the first buoy (10); an impeller generator (30) disposed between the first buoy (10) and the second buoy (20); a first connecting pipe (42) having both ends communicated with the first buoy (10) and the impeller generator (30); and a second connecting pipe (42) having both ends communicated with the second buoy (20) and the impeller generator (30). A liquid (2) is filled in the first buoy (10) and the second buoy (20). The first buoy (10) and the second buoy (20) bob on the water and water waves (4) causes the liquid (2) to flow back and forth between the first connecting pipe (41) and the second connecting pipe (42), thereby driving the impeller generator (30) to generate electricity. The present invention is easy for implementation and maintenance.
    Type: Application
    Filed: November 12, 2010
    Publication date: July 14, 2011
    Inventors: Shih-Hsiung CHEN, Cheng-Shi Weng