Abstract: A liquid-cooling heat-dissipation structure is provided, which includes a first structure having a plurality of skived fins and a second structure having a plurality of guide fins. The first structure and the second structure are combined to each other, so that a chamber is formed between the first structure and the second structure for receiving a working fluid, and the skived fins and the guide fins are disposed in the chamber.

Abstract: A two-phase immersion heat dissipation structure is provided. The two-phase immersion heat dissipation structure includes an immersion-type heat dissipation substrate, a fin assembly, and a metal reinforcement frame. The immersion-type heat dissipation substrate has an upper surface having the fin assembly arranged vertically thereon and a lower surface used for contacting a heat generating element. The metal reinforcement frame is surroundingly in contact with a peripheral wall of the immersion-type heat dissipation substrate, and the metal reinforcement frame has two reinforcement side walls correspondingly protruding from a surface thereof. The two reinforcement side walls are arranged opposite to each other, and a height of the reinforcement side wall is between 5 mm and 15 mm. Each of the two reinforcement side walls has a plurality of through holes that horizontally pass through the reinforcement side wall and that are used for a replenishment of a two-phase coolant.

Abstract: A two-phase immersion-type heat dissipation substrate structure which is used for contacting a heat generating element provided. The two-phase immersion-type heat dissipation substrate structure includes an immersion-type heat dissipation substrate and a fin assembly. The immersion-type heat dissipation substrate has a front side and a back side that is opposite to the front side, the back side is used for contacting the heat generating element, and the front side has the fin assembly arranged thereon. The fin assembly includes a plurality of fins that are perpendicular to the front side, and the front side and the back side are not parallel to each other, so that an extension direction of each of the plurality of fins is neither perpendicular to nor parallel to a direction along which vapor bubbles escape.

Abstract: An immersion-type heat dissipation structure and a method for manufacturing the same are provided. The immersion-type heat dissipation structure includes a first heat dissipation member and a second heat dissipation member that has a plurality of heat dissipation columns and is disposed on the first heat dissipation member. The second heat dissipation member has a porous structure, the first heat dissipation member has a solid structure, and a thermal conductivity of the first heat dissipation member is greater than that of the second heat dissipation member. A shortest distance between two bottoms of any two adjacent ones of the heat dissipation columns is between 0.2 mm and 1.2 mm, a minimum diameter of a top surface of the heat dissipation column is between 0.2 mm and 1.2 mm, and a draft angle formed on a side surface of the heat dissipation column is between 1° and 5°.

Abstract: A two-phase immersion type heat dissipation substrate is in contact with a heat generating element, and includes an immersion type heat dissipation base and at least one first and at least one second fin assembly that are formed on an upper surface thereof. The at least one first fin assembly is located directly above at least one high-temperature heat source area of the heat generating element, and the at least one second fin assembly is located directly above an area that is not the at least one high-temperature heat source area of the heat generating element. The at least one first and at least one second fin assembly include multiple first fins and multiple second fins, respectively. An arrangement density of the first fins is greater than that of the second fins, and a fin height of the first fins is greater than that of the second fins.

Abstract: An immersion-type heat dissipation substrate having a microporous structure is provided. The immersion-type heat dissipation substrate includes a surface having a plurality of micropores for facilitating generation of vapor bubbles. A pore diameter of each of the plurality of micropores is between 5 ?m and 150 ?m, and the plurality of micropores cover 3% to 40% of an area of the surface.

Abstract: An immersion-type porous heat dissipation structure is provided. The immersion-type porous heat dissipation structure includes a porous heat dissipation substrate, a macroscopic fin structure, and at least one reinforcement structure. The porous heat dissipation substrate has a porosity greater than 8%, and has a fin surface and a non-fin surface that are opposite to each other. The fin surface is connected to the macroscopic fin structure, and the macroscopic fin structure includes at least one macroscopic fin. The at least one reinforcement structure protrudes from the fin surface, and is connected to and integrated with the fin surface. A ratio of an area of a connecting part between the at least one reinforcement structure and the fin surface to an area of a connecting part between the at least one macroscopic fin and the fin surface is two or more.

Abstract: An immersion-type porous heat dissipation structure is provided. The immersion-type porous heat dissipation structure includes a porous heat dissipation material in a form of a sheet. A surface of the porous heat dissipation material has a plurality of open pores that are configured to generate air bubbles. A 1 mm2 cross-sectional area of the surface of the porous heat dissipation has at least five of the open pores each having a depth greater than 25 ?m.

Abstract: An immersion heat dissipation structure is provided. The immersion heat dissipation structure includes a porous metal heat dissipation material, an integrated heat spreader, and a thermal interface material. The porous metal heat dissipation material has a porosity greater than 8%. The porous metal heat dissipation material and the integrated heat spreader have the thermal interface material arranged therebetween so that a thermal connection is formed therebetween. A connection surface of the porous metal heat dissipation material and a connection surface of the thermal interface material have a sealing layer or a sealing material arranged therebetween.

Abstract: A liquid cooling heat dissipation substrate structure with partial compression reinforcement is provided. The liquid cooling heat dissipation substrate structure with partial compression reinforcement includes a heat dissipation base that integrally has a heat dissipation main structure and a compression reinforcement structure. The heat dissipation main structure and the compression reinforcement structure are formed through different processes. The heat dissipation main structure and the compression reinforcement structure have different metallographic microstructures. Crystallites of the metallographic microstructure of the heat dissipation main structure are not all arranged in one specific direction, and crystallites of the metallographic microstructure of the compression reinforcement structure are stacked and arranged in a direction that is perpendicular to a compression direction.

Abstract: A liquid cooling heat dissipation substrate with partial compression reinforcement is provided. The liquid cooling heat dissipation substrate with partial compression reinforcement includes a heat dissipation base and a compression reinforcement structure. The heat dissipation base integrally has an upper surface and a lower surface opposite to each other, and the compression reinforcement structure is partially formed on at least one of the upper surface and the lower surface. A ratio of a sum of an area of an orthogonal projection of the compression reinforcement structure on the upper surface and an area of an orthogonal projection of the compression reinforcement structure on the lower surface to a sum of an area of the upper surface and an area of the lower surface is from 10% to 60%.

Abstract: An immersion heat dissipation structure having a macroscopic fin structure and an immersion heat dissipation structure having a fin structure are provided. The immersion heat dissipation structure having a macroscopic fin structure includes a surface having at least two contact angles. At least one part of the surface has one of the at least two contact angles between an immersion cooling liquid that is greater than 90 degrees, and at least another part of the surface has another one of the at least two contact angles between the immersion cooling liquid that is from 0 degrees to 90 degrees.

Abstract: An immersion-type porous heat dissipation substrate structure is provided. The immersion-type porous heat dissipation substrate structure includes a porous heat dissipation base formed by sintering of metal powder. The porous heat dissipation base is immersed in a two-phase coolant for increasing an amount of bubbles that is generated, and has a porosity that is controlled to be between 5% and 50%. Or, the porous heat dissipation base has more than one porosity.

Abstract: A two-phase immersion type heat dissipation fin composite structure is provided. The two-phase immersion type heat dissipation fin composite structure includes a heat dissipation base layer, a bubble activation layer, and a fin structure. The fin structure and the bubble activation layer are both formed on the heat dissipation base layer, or the fin structure is formed on the bubble activation layer. The bubble activation layer is immersed in a two-phase coolant for increasing an amount of bubbles that is generated.

Abstract: An immersion heat dissipation structure is provided. The immersion heat dissipation structure includes a porous metal heat dissipation material, an integrated heat spreader, and a thermal interface material. The porous metal heat dissipation material has a porosity greater than 8%. The porous metal heat dissipation material and the integrated heat spreader have the thermal interface material arranged therebetween so that a thermal connection is formed therebetween. A super-wetting layer is formed on a connection surface between the porous metal heat dissipation material and the thermal interface material, and the super-wetting layer has a wetting angle of less than 10 degrees to water. Alternatively, a super-hydrophobic layer is formed on the connection surface between the porous metal heat dissipation material and the thermal interface material, and the super-hydrophobic layer has a wetting angle of greater than 120 degrees to water.

Abstract: A water-cooling device with a composite heat-dissipating structure is provided, which includes a casing, a main heat-dissipating structure and a layered heat-dissipating structure. The casing is used for accommodating a working fluid, and the casing includes a heat-dissipating substrate. The main heat-dissipating structure includes a plurality of heat-dissipating fins arranged vertically and in parallel to each other that are connected to the heat-dissipating substrate. The layered heat-dissipating structure includes a plurality of horizontal heat-dissipating bodies arranged horizontally and in parallel to each other that are connected to the plurality of heat-dissipating fins arranged vertically and in parallel to each other, and a distance between the plurality of horizontal heat-dissipating bodies arranged horizontally and in parallel to each other is greater than or equal to a distance between the plurality of heat-dissipating fins arranged vertically and in parallel to each other.

Abstract: A lift-off structure for a sprayed thin layer on a substrate surface and a method for the same are provided. The lift-off structure for the sprayed thin layer on the substrate surface includes a base layer and a lifted-off sprayed thin layer. The lifted-off sprayed thin layer is formed on the base layer. The lifted-off sprayed thin layer has at least one ablated new side surface formed thereon, and the at least one ablated new side surface has an inclination angle.

Abstract: The present invention discloses a composite structure of graphene and carbon nanotube and a method of manufacturing the same. The composite structure includes graphene platelets and carbon nanotubes, each carbon nanotube growing perpendicular to the planar surface of the graphene platelet. The method includes steps of graphene platelets preparation, chemical precipitation, chemical reduction and carbon nanotube growth. Metal particles are first formed on the graphene platelets through the steps of chemical precipitation and electrochemical reduction, and carbon nanotubes grow in the step of carbon nanotube growth through thermal treatment. Thus, the graphene platelets and the carbon nanotubes of the present invention form a three dimensional structure, and the carbon nanotubes are used as three dimensional spacers and configured between the graphene platelets, which are effectively separated and hard to aggregate or congregate together.

Abstract: The present invention discloses a composite structure of graphene and carbon nanotube and a method of manufacturing the same. The composite structure includes graphene platelets and carbon nanotubes, each carbon nanotube growing perpendicular to the planar surface of the graphene platelet. The method includes steps of graphene platelets preparation, chemical precipitation, chemical reduction and carbon nanotube growth. Metal particles are first formed on the graphene platelets through the steps of chemical precipitation and electrochemical reduction, and carbon nanotubes grow in the step of carbon nanotube growth through thermal treatment. Thus, the graphene platelets and the carbon nanotubes of the present invention form a three dimensional structure, and the carbon nanotubes are used as three dimensional spacers and configured between the graphene platelets, which are effectively separated and hard to aggregate or congregate together.

Abstract: A method of surface modifying graphene is disclosed and includes placing powder-like graphene into a closed container, heating up to a preset impurity detaching temperature higher than 100° C. so as to detach the impurity from the surface of graphene, further adjusting the treatment temperature to a preset surface modifying temperature, and injecting the gaseous surface modifying agent to be physically adsorbed by the surface of graphene. Thus, surface modified graphene is formed. The surface modifying temperature is higher than the sublimation temperature of the surface modifying agent and less than the decomposition temperature of the surface modifying agent. Therefore, the present invention is simpler and safer because of only physical adsorption used and no chemical reaction involved. Dispersibility of surface modified graphene in the solution is greatly increased to improve uniformity and enhance the performance of the final product formed of surface modified graphene.