Patents by Inventor Cheng-Shun Chan

Cheng-Shun Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Automatic sensing wafer blade and method for using
    Patent number: 6896304
    Abstract: An automatic sensing wafer blade for picking up wafers that is equipped with a sensor capable of self-diagnosing potential failure conditions of the blade and a method for using the wafer blade are described. The automatic sensing wafer blade is equipped with a V-shaped seal ring on a top surface, and a sensor of either a limit switch or a capacitance sensor for sensing the presence or absence of a wafer on top of the wafer blade. The automatic sensing wafer blade is further capable of self-diagnosing any potential failure conditions of the function of the wafer blade due to contaminating particles, or contaminating liquid on the wafer surface, or due to an aged or malfunctioning seal ring on top of the wafer blade.
    Type: Grant
    Filed: September 3, 2002
    Date of Patent: May 24, 2005
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsiao-Yi Li, Chin-Hsin Peng, Cheng-Shun Chan, Jiann-Sheng Chang, Chung-Hao Tseng, Chien-Ling Huang
  • Automatic sensing wafer blade and method for using
    Publication number: 20040041421
    Abstract: An automatic sensing wafer blade for picking up wafers that is equipped with a sensor capable of self-diagnosing potential failure conditions of the blade and a method for using the wafer blade are described. The automatic sensing wafer blade is equipped with a V-shaped seal ring on a top surface, and a sensor of either a limit switch or a capacitance sensor for sensing the presence or absence of a wafer on top of the wafer blade. The automatic sensing wafer blade is further capable of self-diagnosing any potential failure conditions of the function of the wafer blade due to contaminating particles, or contaminating liquid on the wafer surface, or due to an aged or malfunctioning seal ring on top of the wafer blade.
    Type: Application
    Filed: September 3, 2002
    Publication date: March 4, 2004
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Li Hsiao, Chin-Hsin Peng, Cheng-Shun Chan, Jiann-Sheng Chang, Chung-Hao Tseng, Chien-Ling Huang