Patents by Inventor Cheng-Ta Lu

Cheng-Ta Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10338888
    Abstract: An electronic component footprint setup system in collaboration with a circuit layout system and a method thereof are provided in the present disclosure. The electronic component footprint setup system in collaboration with a circuit layout system provides a user operating the circuit layout system with an interface on which parameters of an electronic component footprint to be created are configured; the parameters of the electronic component footprint are transformed for conforming to electronic component footprint specifications used in the circuit layout system; characteristic values of the electronic component footprint are calculated according to electronic component footprint specifications and electronic component footprint setup regulations; the electronic component footprint is created in the circuit layout system according to the characteristic values.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: July 2, 2019
    Assignee: Footprintku Inc.
    Inventors: Cheng-Ta Lu, Yu-Cheng Hu, Guan-Yu Shih, Kun-You Lin, Mong-Fong Horng
  • Patent number: 10331847
    Abstract: An automated electronic component footprint setup system and a method thereof are provided in the present disclosure. The system is available to not only an external first user for configuring characteristic parameters of an electronic component for the database but also an external second user for configuring setup parameters of an electronic component footprint to be created. Then, the system is to create an electronic component footprint of a specific electronic layout system according to the characteristic parameters of the electronic component, component setup regulations and the setup parameters, all of which correspond to the electronic component footprint.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: June 25, 2019
    Assignee: FOOTPRINTKU INC.
    Inventors: Cheng-Ta Lu, Yu-Siang Fan Jiang, Jiun-Huei Ho, Chun-Chieh Tsai, Yi-Ting Chen
  • Publication number: 20190050200
    Abstract: An electronic component footprint setup system in collaboration with a circuit layout system and a method thereof are provided in the present disclosure. The electronic component footprint setup system in collaboration with a circuit layout system provides a user operating the circuit layout system with an interface on which parameters of an electronic component footprint to be created are configured; the parameters of the electronic component footprint are transformed for conforming to electronic component footprint specifications used in the circuit layout system; characteristic values of the electronic component footprint are calculated according to electronic component footprint specifications and electronic component footprint setup regulations; the electronic component footprint is created in the circuit layout system according to the characteristic values.
    Type: Application
    Filed: August 8, 2017
    Publication date: February 14, 2019
    Applicant: FootPrintKu Inc.
    Inventors: Cheng-Ta Lu, Yu-Cheng Hu, Guan-Yu Shih, Kun-You Lin, Mong-Fong Horng
  • Publication number: 20190050503
    Abstract: An automated electronic component footprint setup system and a method thereof are provided in the present disclosure. The system is available to not only an external first user for configuring characteristic parameters of an electronic component for the database but also an external second user for configuring setup parameters of an electronic component footprint to be created. Then, the system is to create an electronic component footprint of a specific electronic layout system according to the characteristic parameters of the electronic component, component setup regulations and the setup parameters, all of which correspond to the electronic component footprint.
    Type: Application
    Filed: August 8, 2017
    Publication date: February 14, 2019
    Applicant: FootPrintKu Inc.
    Inventors: Cheng-Ta Lu, Yu-Siang Fan Jiang, Jiun-Huei Ho, Chun-Chieh Tsai, Yi-Ting Chen