Abstract: An automatic fluid replacement device is adapted to be mounted on an opening of a storage barrel. The automatic fluid replacement device includes a robotic arm, at least one fluid convey joint and a controller. The robotic arm has a gripper. The fluid convey joint includes a convey pipe, a sleeve and a sealing bag. The convey pipe is configured to deliver a fluid. The sleeve is sleeved on the convey pipe. The gripper clamps the sleeve. The sealing bag is sleeved on the sleeve. The controller is configured for automatically controlling the robotic arm to move the fluid convey joint into the opening and controlling the sealing bag to be inflated to seal the opening.

Abstract: An automatic fluid replacement device is adapted to be mounted on an opening of a storage barrel. The automatic fluid replacement device includes a robotic arm, at least one fluid convey joint and a controller. The robotic arm has a gripper. The fluid convey joint includes a convey pipe, a sleeve and a sealing bag. The convey pipe is configured to deliver a fluid. The sleeve is sleeved on the convey pipe. The gripper clamps the sleeve. The sealing bag is sleeved on the sleeve. The controller is configured for automatically controlling the robotic arm to move the fluid convey joint into the opening and controlling the sealing bag to be inflated to seal the opening.

Abstract: A stress measuring device and a stress measuring method for measuring a stress distribution of an object are provided. The stress measuring method includes: receiving a first-dimension image of the object; marking an area of the first-dimension image to generate a marked area; calculating a first stress applied to the marked area and transforming the marked area to a strained marked area corresponding to a second-dimension image to generate a determination result; and calculating the stress distribution corresponding to the first-dimension image of the object according to the determination result.

Abstract: A strain measurement method includes disposing a 3D camera module at a first measurement position; using the 3D camera module to acquire a first 3D image of a to-be-measured object at a first to-be-measured position; acquiring a second 3D image of the to-be-measured object at the first to-be-measured position; and splicing the first and second 3D images to obtain an initial 3D image. The method still includes: moving the 3D camera module from the first measurement position to a second measurement position; using the 3D camera module to acquire a third 3D image of the to-be-measured object at a second to-be-measured position; acquiring a fourth 3D image of the to-be-measured object at the second to-be-measured position; and splicing the third and fourth 3D images to obtain a deformed 3D image. The method further includes comparing the initial 3D image and the deformed 3D image to output 3D deformation information.

Abstract: A strain measurement method includes disposing a 3D camera module at a first measurement position; using the 3D camera module to acquire a first 3D image of a to-be-measured object at a first to-be-measured position; acquiring a second 3D image of the to-be-measured object at the first to-be-measured position; and splicing the first and second 3D images to obtain an initial 3D image. The method still includes: moving the 3D camera module from the first measurement position to a second measurement position; using the 3D camera module to acquire a third 3D image of the to-be-measured object at a second to-be-measured position; acquiring a fourth 3D image of the to-be-measured object at the second to-be-measured position; and splicing the third and fourth 3D images to obtain a deformed 3D image. The method further includes comparing the initial 3D image and the deformed 3D image to output 3D deformation information.

Abstract: A stretchable electronics generating apparatus and layout method thereof are provided. The layout method includes: establishing a layout database, wherein the layout database recodes a plurality of layout selection information respectively corresponding to a plurality of strain/stress information; detecting a layout target area to obtain a strain/stress distribution status of the layout target area; generating a wire routing information according to the strain/stress distribution status based on the layout database; and transporting the wire routing information to a manufacture device of the conductive wires for disposing a plurality of physical conductive wires on the layout target area by the manufacture device.

Abstract: A circuit board includes a substrate and at least one circuit structure. The substrate has first slots, each first slot extends along a first axis, and a length of each first slot along the first axis is greater than lengths of each first slot along other directions. The circuit structure is disposed on the substrate and includes arc segments and extending segments. Each arc segment is connected between two of the extending segments such that the circuit structure is circuitous. The circuit structure and each first slot have an interval therebetween such that each first slot and a part of a surface of the substrate are exposed by the circuit structure. Each first slot is located between adjacent two extending segments, and the first axis of each first slot passes through the corresponding arc segment. In addition, an electronic device having the circuit board is also provided.

Abstract: A stress measuring device and a stress measuring method for measuring a stress distribution of an object are provided. The stress measuring method includes: receiving a first-dimension image of the object; marking an area of the first-dimension image to generate a marked area; calculating a first stress applied to the marked area and transforming the marked area to a strained marked area corresponding to a second-dimension image to generate a determination result; and calculating the stress distribution corresponding to the first-dimension image of the object according to the determination result.

Abstract: A stretchable electronics generating apparatus and layout method thereof are provided. The layout method includes: establishing a layout database, wherein the layout database recodes a plurality of layout selection information respectively corresponding to a plurality of strain/stress information; detecting a layout target area to obtain a strain/stress distribution status of the layout target area; generating a wire routing information according to the strain/stress distribution status based on the layout database; and transporting the wire routing information to a manufacture device of the conductive wires for disposing a plurality of physical conductive wires on the layout target area by the manufacture device.

Abstract: A circuit board includes a substrate and at least one circuit structure. The substrate has first slots, each first slot extends along a first axis, and a length of each first slot along the first axis is greater than lengths of each first slot along other directions. The circuit structure is disposed on the substrate and includes arc segments and extending segments. Each arc segment is connected between two of the extending segments such that the circuit structure is circuitous. The circuit structure and each first slot have an interval therebetween such that each first slot and a partial surface of the substrate are exposed by the circuit structure. Each first slot is located between adjacent two extending segments, and the first axis of each first slot passes through the corresponding arc segment. In addition, an electronic device having the circuit board is also provided.